DE69634395D1 - Methode und Vorrichtung zur Herstellung von Halbleiterbauelementen - Google Patents

Methode und Vorrichtung zur Herstellung von Halbleiterbauelementen

Info

Publication number
DE69634395D1
DE69634395D1 DE69634395T DE69634395T DE69634395D1 DE 69634395 D1 DE69634395 D1 DE 69634395D1 DE 69634395 T DE69634395 T DE 69634395T DE 69634395 T DE69634395 T DE 69634395T DE 69634395 D1 DE69634395 D1 DE 69634395D1
Authority
DE
Germany
Prior art keywords
semiconductor devices
manufacturing semiconductor
manufacturing
devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69634395T
Other languages
English (en)
Inventor
Gen Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69634395D1 publication Critical patent/DE69634395D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Library & Information Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE69634395T 1995-05-23 1996-05-20 Methode und Vorrichtung zur Herstellung von Halbleiterbauelementen Expired - Lifetime DE69634395D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14686895A JP3347528B2 (ja) 1995-05-23 1995-05-23 半導体製造装置

Publications (1)

Publication Number Publication Date
DE69634395D1 true DE69634395D1 (de) 2005-04-07

Family

ID=15417389

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69634395T Expired - Lifetime DE69634395D1 (de) 1995-05-23 1996-05-20 Methode und Vorrichtung zur Herstellung von Halbleiterbauelementen

Country Status (5)

Country Link
US (1) US5740052A (de)
EP (1) EP0744764B1 (de)
JP (1) JP3347528B2 (de)
KR (1) KR100193154B1 (de)
DE (1) DE69634395D1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
TW449672B (en) * 1997-12-25 2001-08-11 Nippon Kogaku Kk Process and apparatus for manufacturing photomask and method of manufacturing the same
JP3741401B2 (ja) 1998-02-27 2006-02-01 キヤノン株式会社 基板搬送装置、半導体製造装置および液晶プレート製造装置
EP0940721A3 (de) * 1998-03-04 2003-03-12 Agilent Technologies, Inc. (a Delaware corporation) Maskenspeichervorrichtung und-verfahren
US6136614A (en) * 1998-03-04 2000-10-24 Agilent Technologies Apparatus and method for manufacturing integrated circuit devices
US6192290B1 (en) * 1998-05-21 2001-02-20 Lucent Technologies Inc. System and method of manufacturing semicustom integrated circuits using reticle primitives from a library and interconnect reticles
JP3513437B2 (ja) 1999-09-01 2004-03-31 キヤノン株式会社 基板管理方法及び半導体露光装置
US6746879B1 (en) * 2002-10-02 2004-06-08 Taiwan Semiconductor Manufacturing Company Guard filter methodology and automation system to avoid scrap due to reticle errors
JP2004228474A (ja) * 2003-01-27 2004-08-12 Canon Inc 原版搬送装置
US7206652B2 (en) * 2004-08-20 2007-04-17 International Business Machines Corporation Method and system for intelligent automated reticle management

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4062463A (en) * 1976-05-11 1977-12-13 Machine Technology, Inc. Automated single cassette load mechanism for scrubber
JPS598352Y2 (ja) * 1979-05-28 1984-03-15 富士通株式会社 ガラスマスクの洗浄装置
US4248508A (en) * 1979-08-03 1981-02-03 The Perkin-Elmer Corporation Projection mask storage and carrier system
US4549843A (en) * 1983-03-15 1985-10-29 Micronix Partners Mask loading apparatus, method and cassette
US4758127A (en) * 1983-06-24 1988-07-19 Canon Kabushiki Kaisha Original feeding apparatus and a cassette for containing the original
JPS61100932A (ja) * 1984-10-24 1986-05-19 Hitachi Ltd 露光装置
US5097421A (en) * 1984-12-24 1992-03-17 Asyst Technologies, Inc. Intelligent waxer carrier
US4757355A (en) * 1985-10-29 1988-07-12 Canon Kabushiki Kaisha Mask storing mechanism
US4746256A (en) * 1986-03-13 1988-05-24 Roboptek, Inc. Apparatus for handling sensitive material such as semiconductor wafers
US4999671A (en) * 1986-07-11 1991-03-12 Canon Kabushiki Kaisha Reticle conveying device
US4984953A (en) * 1987-02-20 1991-01-15 Canon Kabushiki Kaisha Plate-like article conveying system
DE68928460T2 (de) * 1988-09-06 1998-04-02 Canon K.K., Tokio/Tokyo Maskenkassetten-Ladevorrichtung
JPH0758397B2 (ja) * 1989-12-05 1995-06-21 株式会社東芝 マスク管理装置

Also Published As

Publication number Publication date
EP0744764A3 (de) 1997-11-12
KR100193154B1 (ko) 1999-06-15
KR960042919A (ko) 1996-12-21
JP3347528B2 (ja) 2002-11-20
EP0744764A2 (de) 1996-11-27
JPH08316137A (ja) 1996-11-29
US5740052A (en) 1998-04-14
EP0744764B1 (de) 2005-03-02

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Legal Events

Date Code Title Description
8332 No legal effect for de