KR950009813B1
(ko)
*
|
1993-01-27 |
1995-08-28 |
삼성전자주식회사 |
반도체장치 및 그 제조방법
|
DE69404189T2
(de)
*
|
1993-03-31 |
1998-01-08 |
Texas Instruments Inc |
Leicht donatoren-dotierte Elektroden für Materialien mit hoher dielektrischer Konstante
|
US6404003B1
(en)
*
|
1999-07-28 |
2002-06-11 |
Symetrix Corporation |
Thin film capacitors on silicon germanium substrate
|
US5585300A
(en)
*
|
1994-08-01 |
1996-12-17 |
Texas Instruments Incorporated |
Method of making conductive amorphous-nitride barrier layer for high-dielectric-constant material electrodes
|
US5489548A
(en)
*
|
1994-08-01 |
1996-02-06 |
Texas Instruments Incorporated |
Method of forming high-dielectric-constant material electrodes comprising sidewall spacers
|
US5504041A
(en)
*
|
1994-08-01 |
1996-04-02 |
Texas Instruments Incorporated |
Conductive exotic-nitride barrier layer for high-dielectric-constant materials
|
US5622893A
(en)
*
|
1994-08-01 |
1997-04-22 |
Texas Instruments Incorporated |
Method of forming conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes
|
US5464786A
(en)
*
|
1994-10-24 |
1995-11-07 |
Micron Technology, Inc. |
Method for forming a capacitor having recessed lateral reaction barrier layer edges
|
US6204111B1
(en)
|
1994-12-28 |
2001-03-20 |
Matsushita Electronics Corporation |
Fabrication method of capacitor for integrated circuit
|
CN1075243C
(zh)
*
|
1994-12-28 |
2001-11-21 |
松下电器产业株式会社 |
集成电路用电容元件及其制造方法
|
KR0141160B1
(ko)
*
|
1995-03-22 |
1998-06-01 |
김광호 |
강유전체 메모리 장치 및 그 제조방법
|
US5874364A
(en)
*
|
1995-03-27 |
1999-02-23 |
Fujitsu Limited |
Thin film deposition method, capacitor device and method for fabricating the same, and semiconductor device and method for fabricating the same
|
KR0147639B1
(ko)
*
|
1995-05-29 |
1998-08-01 |
김광호 |
고유전율 캐패시터의 하부전극 형성방법
|
JP3805001B2
(ja)
*
|
1995-06-08 |
2006-08-02 |
株式会社ルネサステクノロジ |
半導体装置
|
KR100292012B1
(ko)
*
|
1995-06-28 |
2001-11-15 |
엔, 마이클 그로브 |
실리콘에집적된강유전체커패시터를위한장벽층
|
KR100200299B1
(ko)
*
|
1995-11-30 |
1999-06-15 |
김영환 |
반도체 소자 캐패시터 형성방법
|
JP3168400B2
(ja)
*
|
1996-01-19 |
2001-05-21 |
日本プレシジョン・サーキッツ株式会社 |
半導体装置および半導体装置の製造方法
|
JPH09260600A
(ja)
*
|
1996-03-19 |
1997-10-03 |
Sharp Corp |
半導体メモリ素子の製造方法
|
US5838605A
(en)
*
|
1996-03-20 |
1998-11-17 |
Ramtron International Corporation |
Iridium oxide local interconnect
|
US5892281A
(en)
|
1996-06-10 |
1999-04-06 |
Micron Technology, Inc. |
Tantalum-aluminum-nitrogen material for semiconductor devices
|
JP3193302B2
(ja)
*
|
1996-06-26 |
2001-07-30 |
ティーディーケイ株式会社 |
膜構造体、電子デバイス、記録媒体および強誘電体薄膜の製造方法
|
KR100235949B1
(ko)
*
|
1996-06-27 |
1999-12-15 |
김영환 |
반도체 소자의 캐패시터 제조 방법
|
US5760474A
(en)
*
|
1996-07-09 |
1998-06-02 |
Micron Technology, Inc. |
Capacitor, integrated circuitry, diffusion barriers, and method for forming an electrically conductive diffusion barrier
|
DE19630110C2
(de)
*
|
1996-07-25 |
1998-11-19 |
Siemens Ag |
Schichtaufbau mit einer ferroelektrischen Schicht und Herstellverfahren
|
JPH1079481A
(ja)
*
|
1996-09-05 |
1998-03-24 |
Mitsubishi Electric Corp |
導電層接続構造およびその製造方法
|
US6251720B1
(en)
|
1996-09-27 |
2001-06-26 |
Randhir P. S. Thakur |
High pressure reoxidation/anneal of high dielectric constant materials
|
US6897105B1
(en)
*
|
1998-09-16 |
2005-05-24 |
Texas Instrument Incorporated |
Method of forming metal oxide gate structures and capacitor electrodes
|
JP3512959B2
(ja)
*
|
1996-11-14 |
2004-03-31 |
株式会社東芝 |
半導体装置及びその製造方法
|
US5719417A
(en)
*
|
1996-11-27 |
1998-02-17 |
Advanced Technology Materials, Inc. |
Ferroelectric integrated circuit structure
|
US5807774A
(en)
*
|
1996-12-06 |
1998-09-15 |
Sharp Kabushiki Kaisha |
Simple method of fabricating ferroelectric capacitors
|
KR100224729B1
(ko)
*
|
1996-12-10 |
1999-10-15 |
윤종용 |
반도체장치의 강유전체 커패시터 및 그 제조방법
|
US5932907A
(en)
*
|
1996-12-24 |
1999-08-03 |
International Business Machines Corporation |
Method, materials, and structures for noble metal electrode contacts to silicon
|
US6144546A
(en)
*
|
1996-12-26 |
2000-11-07 |
Kabushiki Kaisha Toshiba |
Capacitor having electrodes with two-dimensional conductivity
|
JP2930102B2
(ja)
*
|
1997-01-31 |
1999-08-03 |
日本電気株式会社 |
半導体装置用配線構造及びその製造方法
|
US6209991B1
(en)
*
|
1997-03-04 |
2001-04-03 |
Hewlett-Packard Company |
Transition metal carbide films for applications in ink jet printheads
|
US6075691A
(en)
*
|
1997-03-06 |
2000-06-13 |
Lucent Technologies Inc. |
Thin film capacitors and process for making them
|
EP0865079A3
(de)
*
|
1997-03-13 |
1999-10-20 |
Applied Materials, Inc. |
Verfahren zur Beseitigung von auf geätzten Platinflächen abgelagerten Verunreinigungen
|
US5796573A
(en)
*
|
1997-05-29 |
1998-08-18 |
International Business Machines Corporation |
Overhanging separator for self-defining stacked capacitor
|
US6153491A
(en)
|
1997-05-29 |
2000-11-28 |
International Business Machines Corporation |
Overhanging separator for self-defining discontinuous film
|
US5955756A
(en)
*
|
1997-05-29 |
1999-09-21 |
International Business Machines Corporation |
Trench separator for self-defining discontinuous film
|
US6002575A
(en)
*
|
1997-05-29 |
1999-12-14 |
International Business Machines Corporation |
Adherent separator for self-defining discontinuous film
|
TW406317B
(en)
*
|
1997-06-27 |
2000-09-21 |
Siemens Ag |
Method to produce a barrier-layer in a semiconductor-body and semiconductor component with such a barrier-layer
|
TW421858B
(en)
*
|
1997-06-30 |
2001-02-11 |
Texas Instruments Inc |
Integrated circuit capacitor and memory
|
JPH11111753A
(ja)
*
|
1997-10-01 |
1999-04-23 |
Mitsubishi Electric Corp |
半導体装置
|
US6462931B1
(en)
*
|
1997-10-23 |
2002-10-08 |
Texas Instruments Incorporated |
High-dielectric constant capacitor and memory
|
US5923970A
(en)
*
|
1997-11-20 |
1999-07-13 |
Advanced Technology Materials, Inc. |
Method of fabricating a ferrolelectric capacitor with a graded barrier layer structure
|
US6171898B1
(en)
|
1997-12-17 |
2001-01-09 |
Texas Instruments Incorporated |
Method of fabricating an oxygen-stable layer/diffusion barrier/poly bottom electrode structure for high-K-DRAMS using a disposable-oxide processing
|
US6180446B1
(en)
|
1997-12-17 |
2001-01-30 |
Texas Instruments Incorporated |
Method of fabricating an oxygen-stable layer/diffusion barrier/poly bottom electrode structure for high-K DRAMS using disposable-oxide processing
|
US5998225A
(en)
*
|
1997-12-17 |
1999-12-07 |
Texas Instruments Incorporated |
Method of fabricating an oxygen-stable layer/diffusion barrier/poly bottom electrode structure for high-K DRAMs using disposable-oxide processing
|
US6184074B1
(en)
|
1997-12-17 |
2001-02-06 |
Texas Instruments Incorporated |
Method of fabrication a self-aligned polysilicon/diffusion barrier/oxygen stable sidewall bottom electrode structure for high-K DRAMS
|
US6313539B1
(en)
*
|
1997-12-24 |
2001-11-06 |
Sharp Kabushiki Kaisha |
Semiconductor memory device and production method of the same
|
KR100436056B1
(ko)
|
1997-12-30 |
2004-12-17 |
주식회사 하이닉스반도체 |
강유전체 커패시터의 확산장벽막 형성방법
|
US6919168B2
(en)
|
1998-01-13 |
2005-07-19 |
Applied Materials, Inc. |
Masking methods and etching sequences for patterning electrodes of high density RAM capacitors
|
US6323132B1
(en)
|
1998-01-13 |
2001-11-27 |
Applied Materials, Inc. |
Etching methods for anisotropic platinum profile
|
US6265318B1
(en)
|
1998-01-13 |
2001-07-24 |
Applied Materials, Inc. |
Iridium etchant methods for anisotropic profile
|
JP2002510146A
(ja)
|
1998-01-13 |
2002-04-02 |
アプライド マテリアルズ インコーポレイテッド |
異方性プラチナプロファイルのエッチング方法
|
US6245684B1
(en)
*
|
1998-03-13 |
2001-06-12 |
Applied Materials, Inc. |
Method of obtaining a rounded top trench corner for semiconductor trench etch applications
|
KR100468708B1
(ko)
*
|
1998-03-23 |
2005-03-16 |
삼성전자주식회사 |
강유전체커패시터및그제조방법
|
KR100284737B1
(ko)
*
|
1998-03-26 |
2001-03-15 |
윤종용 |
고유전율의유전막을갖는반도체장치의커패시터제조방법
|
US6084265A
(en)
*
|
1998-03-30 |
2000-07-04 |
Texas Instruments - Acer Incorporated |
High density shallow trench contactless nonvolitile memory
|
US6117733A
(en)
*
|
1998-05-27 |
2000-09-12 |
Taiwan Semiconductor Manufacturing Company |
Poly tip formation and self-align source process for split-gate flash cell
|
US6259131B1
(en)
|
1998-05-27 |
2001-07-10 |
Taiwan Semiconductor Manufacturing Company |
Poly tip and self aligned source for split-gate flash cell
|
DE19828969A1
(de)
|
1998-06-29 |
1999-12-30 |
Siemens Ag |
Verfahren zur Herstellung von Halbleiterbauelementen
|
DE19834649C1
(de)
*
|
1998-07-31 |
2000-03-16 |
Siemens Ag |
Verfahren zum Herstellen einer Speicherzelle
|
JP2000133633A
(ja)
*
|
1998-09-09 |
2000-05-12 |
Texas Instr Inc <Ti> |
ハ―ドマスクおよびプラズマ活性化エッチャントを使用した材料のエッチング方法
|
KR100293720B1
(ko)
|
1998-10-01 |
2001-07-12 |
박종섭 |
반도체 소자의 캐패시터 형성 방법
|
KR100282487B1
(ko)
|
1998-10-19 |
2001-02-15 |
윤종용 |
고유전 다층막을 이용한 셀 캐패시터 및 그 제조 방법
|
JP4048514B2
(ja)
*
|
1998-10-20 |
2008-02-20 |
富士通株式会社 |
半導体装置及びその製造方法
|
TW386286B
(en)
*
|
1998-10-26 |
2000-04-01 |
Ind Tech Res Inst |
An ohmic contact of semiconductor and the manufacturing method
|
DE19849542C2
(de)
|
1998-10-27 |
2002-07-11 |
Infineon Technologies Ag |
Verfahren zur Herstellung eines Kondensators
|
KR100318457B1
(ko)
*
|
1998-10-28 |
2002-02-19 |
박종섭 |
플라즈마를이용한강유전체박막형성방법
|
US6433993B1
(en)
*
|
1998-11-23 |
2002-08-13 |
Microcoating Technologies, Inc. |
Formation of thin film capacitors
|
US6187674B1
(en)
*
|
1998-12-08 |
2001-02-13 |
United Microelectronics Corp. |
Manufacturing method capable of preventing corrosion and contamination of MOS gate
|
US6309928B1
(en)
*
|
1998-12-10 |
2001-10-30 |
Taiwan Semiconductor Manufacturing Company |
Split-gate flash cell
|
KR100474589B1
(ko)
|
1998-12-29 |
2005-06-21 |
주식회사 하이닉스반도체 |
캐패시터제조방법
|
KR100505397B1
(ko)
|
1998-12-30 |
2006-05-16 |
주식회사 하이닉스반도체 |
반도체메모리소자의캐패시터제조방법
|
KR100424192B1
(ko)
*
|
1998-12-30 |
2004-05-17 |
주식회사 하이닉스반도체 |
캐패시터 제조방법
|
US6323537B1
(en)
*
|
1999-01-13 |
2001-11-27 |
Agere Systems Guardian Corp. |
Capacitor for an integrated circuit
|
US6358790B1
(en)
|
1999-01-13 |
2002-03-19 |
Agere Systems Guardian Corp. |
Method of making a capacitor
|
US6284637B1
(en)
|
1999-03-29 |
2001-09-04 |
Chartered Semiconductor Manufacturing Ltd. |
Method to fabricate a floating gate with a sloping sidewall for a flash memory
|
JP2001057412A
(ja)
*
|
1999-08-19 |
2001-02-27 |
Mitsubishi Electric Corp |
半導体装置およびその製造方法
|
US6281543B1
(en)
|
1999-08-31 |
2001-08-28 |
Micron Technology, Inc. |
Double layer electrode and barrier system on hemispherical grain silicon for use with high dielectric constant materials and methods for fabricating the same
|
US6801422B2
(en)
*
|
1999-12-28 |
2004-10-05 |
Intel Corporation |
High performance capacitor
|
US6724611B1
(en)
*
|
2000-03-29 |
2004-04-20 |
Intel Corporation |
Multi-layer chip capacitor
|
US6638857B1
(en)
|
2000-03-30 |
2003-10-28 |
Triquint Technology Holding Co. |
E-beam deposition method and apparatus for providing high purity oxide films
|
US6642567B1
(en)
*
|
2000-08-31 |
2003-11-04 |
Micron Technology, Inc. |
Devices containing zirconium-platinum-containing materials and methods for preparing such materials and devices
|
US6534357B1
(en)
*
|
2000-11-09 |
2003-03-18 |
Micron Technology, Inc. |
Methods for forming conductive structures and structures regarding same
|
US6563161B2
(en)
*
|
2001-03-22 |
2003-05-13 |
Winbond Electronics Corporation |
Memory-storage node and the method of fabricating the same
|
JP3661850B2
(ja)
*
|
2001-04-25 |
2005-06-22 |
富士通株式会社 |
半導体装置およびその製造方法
|
US6468901B1
(en)
*
|
2001-05-02 |
2002-10-22 |
Sharp Laboratories Of America, Inc. |
Nickel silicide including iridium for use in ultra-shallow junctions with high thermal stability and method of manufacturing the same
|
KR100418581B1
(ko)
*
|
2001-06-12 |
2004-02-11 |
주식회사 하이닉스반도체 |
메모리 소자의 제조방법
|
US7037862B2
(en)
*
|
2001-06-13 |
2006-05-02 |
Micron Technology, Inc. |
Dielectric layer forming method and devices formed therewith
|
US6727140B2
(en)
*
|
2001-07-11 |
2004-04-27 |
Micron Technology, Inc. |
Capacitor with high dielectric constant materials and method of making
|
KR100414872B1
(ko)
*
|
2001-08-29 |
2004-01-13 |
주식회사 하이닉스반도체 |
반도체소자 및 그 제조 방법
|
EP1294021A1
(de)
*
|
2001-08-31 |
2003-03-19 |
Infineon Technologies AG |
Kondensatoreinrichtung für eine Halbleiterschaltungsanordnung und Verfahren zu deren Herstellung
|
JP3553535B2
(ja)
*
|
2001-09-28 |
2004-08-11 |
ユーディナデバイス株式会社 |
容量素子及びその製造方法
|
DE10207130B4
(de)
|
2002-02-20 |
2007-09-27 |
Infineon Technologies Ag |
Verfahren zur Herstellung eines Bauelements sowie Bauelement mit einer Edelmetallschicht, einer Edelmetallsilizidschicht und einer oxidierten Silizidschicht
|
US6607969B1
(en)
*
|
2002-03-18 |
2003-08-19 |
The United States Of America As Represented By The Secretary Of The Navy |
Method for making pyroelectric, electro-optical and decoupling capacitors using thin film transfer and hydrogen ion splitting techniques
|
US7341947B2
(en)
*
|
2002-03-29 |
2008-03-11 |
Micron Technology, Inc. |
Methods of forming metal-containing films over surfaces of semiconductor substrates
|
US6653236B2
(en)
*
|
2002-03-29 |
2003-11-25 |
Micron Technology, Inc. |
Methods of forming metal-containing films over surfaces of semiconductor substrates; and semiconductor constructions
|
JP4445191B2
(ja)
*
|
2002-10-07 |
2010-04-07 |
株式会社東芝 |
半導体装置およびその製造方法
|
US6794753B2
(en)
*
|
2002-12-27 |
2004-09-21 |
Lexmark International, Inc. |
Diffusion barrier and method therefor
|
US7070207B2
(en)
*
|
2003-04-22 |
2006-07-04 |
Ibiden Co., Ltd. |
Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
|
US6886403B2
(en)
*
|
2003-06-17 |
2005-05-03 |
Delphi Technologies, Inc. |
Sensor with amorphous electrode
|
US7080896B2
(en)
*
|
2004-01-20 |
2006-07-25 |
Lexmark International, Inc. |
Micro-fluid ejection device having high resistance heater film
|
JP2005235860A
(ja)
*
|
2004-02-17 |
2005-09-02 |
Sanyo Electric Co Ltd |
半導体装置及びその製造方法
|
US8134196B2
(en)
*
|
2005-09-02 |
2012-03-13 |
Stats Chippac Ltd. |
Integrated circuit system with metal-insulator-metal circuit element
|
DE102005048774B4
(de)
*
|
2005-10-07 |
2009-04-02 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Substrat, das zumindest bereichsweise an einer Oberfläche mit einer Beschichtung eines Metalls versehen ist, sowie dessen Verwendung
|
US7534693B2
(en)
*
|
2006-01-04 |
2009-05-19 |
Freescale Semiconductor, Inc. |
Thin-film capacitor with a field modification layer and methods for forming the same
|
KR100723420B1
(ko)
*
|
2006-02-20 |
2007-05-30 |
삼성전자주식회사 |
비정질 합금 산화층을 포함하는 비휘발성 메모리 소자
|
JP5288193B2
(ja)
*
|
2009-03-26 |
2013-09-11 |
Tdk株式会社 |
薄膜コンデンサ
|
JP2010287696A
(ja)
*
|
2009-06-10 |
2010-12-24 |
Panasonic Corp |
電界効果トランジスタおよびその製造方法
|
DE102009043740B4
(de)
*
|
2009-09-30 |
2021-08-05 |
Globalfoundries Dresden Module One Llc & Co. Kg |
Rückseitenmetallisierung mit besserer Haftung in Hochleistungshalbleiterbauelementen
|
US9013002B1
(en)
*
|
2011-12-02 |
2015-04-21 |
The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration |
Iridium interfacial stack (IRIS)
|
US9349392B1
(en)
|
2012-05-24 |
2016-05-24 |
Western Digital (Fremont), Llc |
Methods for improving adhesion on dielectric substrates
|
JP2018142562A
(ja)
*
|
2017-02-24 |
2018-09-13 |
株式会社村田製作所 |
半導体装置
|