DE69524247D1 - Stempel für lithographie-verfahren - Google Patents

Stempel für lithographie-verfahren

Info

Publication number
DE69524247D1
DE69524247D1 DE69524247T DE69524247T DE69524247D1 DE 69524247 D1 DE69524247 D1 DE 69524247D1 DE 69524247 T DE69524247 T DE 69524247T DE 69524247 T DE69524247 T DE 69524247T DE 69524247 D1 DE69524247 D1 DE 69524247D1
Authority
DE
Germany
Prior art keywords
stamp
lithography process
lithography
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69524247T
Other languages
English (en)
Other versions
DE69524247T2 (de
Inventor
Andre Biebuyck
Bruno Michel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69524247D1 publication Critical patent/DE69524247D1/de
Application granted granted Critical
Publication of DE69524247T2 publication Critical patent/DE69524247T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K1/00—Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE69524247T 1995-08-04 1995-08-04 Stempel für lithographie-verfahren Expired - Lifetime DE69524247T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/IB1995/000609 WO1997006012A1 (en) 1995-08-04 1995-08-04 Stamp for a lithographic process
US08/691,285 US5817242A (en) 1995-08-04 1996-08-01 Stamp for a lithographic process

Publications (2)

Publication Number Publication Date
DE69524247D1 true DE69524247D1 (de) 2002-01-10
DE69524247T2 DE69524247T2 (de) 2002-08-08

Family

ID=26318656

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69524247T Expired - Lifetime DE69524247T2 (de) 1995-08-04 1995-08-04 Stempel für lithographie-verfahren

Country Status (5)

Country Link
US (1) US5817242A (de)
EP (1) EP0784542B1 (de)
JP (1) JP3372258B2 (de)
DE (1) DE69524247T2 (de)
WO (1) WO1997006012A1 (de)

Families Citing this family (155)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176962B1 (en) 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
AU6774996A (en) * 1995-08-18 1997-03-12 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
ATE552341T1 (de) 1996-10-01 2012-04-15 Geron Corp Katalytische untereinheit der menschlichen telomerase
JP3372466B2 (ja) * 1997-12-22 2003-02-04 ティーディーケイ株式会社 偏光板の製造方法
KR100335070B1 (ko) * 1999-04-21 2002-05-03 백승준 압축 성형 기법을 이용한 미세 패턴 형성 방법
US6736985B1 (en) * 1999-05-05 2004-05-18 Agere Systems Inc. High-resolution method for patterning a substrate with micro-printing
CN1191609C (zh) 1999-07-09 2005-03-02 材料研究及工程研究所 在装置制造过程中使器件层成图的方法
EP1072954A3 (de) * 1999-07-28 2002-05-22 Lucent Technologies Inc. Lithographisches Verfahren
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US6214151B1 (en) 1999-11-05 2001-04-10 International Business Machines Corporation Thermal dye transfer process for preparing opto-electronic devices
US6294398B1 (en) * 1999-11-23 2001-09-25 The Trustees Of Princeton University Method for patterning devices
TW562755B (en) * 1999-12-31 2003-11-21 Ibm Stamp device for printing a pattern on a surface of a substrate
WO2001059523A1 (en) * 2000-02-07 2001-08-16 Koninklijke Philips Electronics N.V. Stamp for use in a lithographic process, method of manufacturing a stamp, and method of manufacturing a patterned layer on a substrate
US6444254B1 (en) 2000-03-03 2002-09-03 Duke University Microstamping activated polymer surfaces
US7163712B2 (en) 2000-03-03 2007-01-16 Duke University Microstamping activated polymer surfaces
US20040195202A1 (en) * 2000-04-28 2004-10-07 Alexander Pechenik Method for making a nano-stamp and for forming, with the stamp, nano-size elements on a substrate
US6365059B1 (en) 2000-04-28 2002-04-02 Alexander Pechenik Method for making a nano-stamp and for forming, with the stamp, nano-size elements on a substrate
US6395435B1 (en) * 2000-06-27 2002-05-28 The United States Of America As Represented By The Secretary Of The Navy Photo-lithographic mask having total internal reflective surfaces
JP4740518B2 (ja) * 2000-07-17 2011-08-03 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 転写リソグラフィ・プロセスのための自動液体ディスペンス方法およびシステム
US7476523B2 (en) 2000-08-14 2009-01-13 Surface Logix, Inc. Method of patterning a surface using a deformable stamp
US7294294B1 (en) 2000-10-17 2007-11-13 Seagate Technology Llc Surface modified stamper for imprint lithography
JP4278977B2 (ja) * 2000-11-22 2009-06-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ スタンプ、方法および装置
US7018674B2 (en) * 2001-03-02 2006-03-28 Omron, Corporation Manufacturing methods and apparatuses of an optical device and a reflection plate provided with a resin thin film having a micro-asperity pattern
US6517977B2 (en) * 2001-03-28 2003-02-11 Motorola, Inc. Lithographic template and method of formation and use
WO2002093258A1 (de) * 2001-05-14 2002-11-21 Elmicron Ag Verfahren zur herstellung von prägewerkzeugen
US6673287B2 (en) * 2001-05-16 2004-01-06 International Business Machines Corporation Vapor phase surface modification of composite substrates to form a molecularly thin release layer
US6949199B1 (en) 2001-08-16 2005-09-27 Seagate Technology Llc Heat-transfer-stamp process for thermal imprint lithography
US6586885B2 (en) * 2001-08-20 2003-07-01 Motorola, Inc. MHCD and microfluidic apparatus and method
EP1438753B1 (de) * 2001-10-11 2010-04-07 Koninklijke Philips Electronics N.V. Dünnfilmtranistor-bauelement und diesbezügliches verfahren
US20030127002A1 (en) * 2002-01-04 2003-07-10 Hougham Gareth Geoffrey Multilayer architechture for microcontact printing stamps
WO2003065120A2 (en) * 2002-01-11 2003-08-07 Massachusetts Institute Of Technology Microcontact printing
DE10217089A1 (de) * 2002-04-17 2003-10-30 Inst Neue Mat Gemein Gmbh Transferverfahren zur Herstellung mikrostrukturierter Substrate
DE10217151A1 (de) * 2002-04-17 2003-10-30 Clariant Gmbh Nanoimprint-Resist
US6849558B2 (en) 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
WO2003099463A2 (en) 2002-05-27 2003-12-04 Koninklijke Philips Electronics N.V. Method and device for transferring a pattern from a stamp to a substrate
DE60326724D1 (de) * 2002-05-30 2009-04-30 Ibm Strukturierungsverfahren
US6861365B2 (en) * 2002-06-28 2005-03-01 Hewlett-Packard Development Company, L.P. Method and system for forming a semiconductor device
JP3821069B2 (ja) * 2002-08-01 2006-09-13 株式会社日立製作所 転写パターンによる構造体の形成方法
US7083880B2 (en) * 2002-08-15 2006-08-01 Freescale Semiconductor, Inc. Lithographic template and method of formation and use
US7754131B2 (en) * 2002-08-27 2010-07-13 Obducat Ab Device for transferring a pattern to an object
JP4340086B2 (ja) * 2003-03-20 2009-10-07 株式会社日立製作所 ナノプリント用スタンパ、及び微細構造転写方法
JP4269745B2 (ja) * 2003-03-31 2009-05-27 株式会社日立製作所 スタンパ及び転写装置
JP4185808B2 (ja) * 2003-05-09 2008-11-26 Ｔｄｋ株式会社 インプリント装置およびインプリント方法
DE10330456B9 (de) * 2003-07-05 2007-11-08 Erich Thallner Vorrichtung zum Erstellen einer Oberflächenstruktur auf einem Wafer
US8268446B2 (en) 2003-09-23 2012-09-18 The University Of North Carolina At Chapel Hill Photocurable perfluoropolyethers for use as novel materials in microfluidic devices
US7632087B2 (en) * 2003-12-19 2009-12-15 Wd Media, Inc. Composite stamper for imprint lithography
US9040090B2 (en) 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
KR20120105062A (ko) 2003-12-19 2012-09-24 더 유니버시티 오브 노쓰 캐롤라이나 엣 채플 힐 소프트 또는 임프린트 리소그래피를 이용하여 분리된 마이크로- 및 나노- 구조를 제작하는 방법
US8158728B2 (en) 2004-02-13 2012-04-17 The University Of North Carolina At Chapel Hill Methods and materials for fabricating microfluidic devices
US7168939B2 (en) * 2004-02-26 2007-01-30 Hitachi Global Storage Technologies Netherlands Bv System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning
US7741003B2 (en) * 2004-03-30 2010-06-22 Hitachi Global Storage Technologies Netherlands B.V. Photoresist transfer pads
US20080055581A1 (en) * 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
CN101427182B (zh) * 2004-04-27 2011-10-19 伊利诺伊大学评议会 用于软光刻法的复合构图设备
US7140861B2 (en) * 2004-04-27 2006-11-28 Molecular Imprints, Inc. Compliant hard template for UV imprinting
US7799699B2 (en) * 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
CN101120433B (zh) 2004-06-04 2010-12-08 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法
US7521292B2 (en) * 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US8217381B2 (en) * 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
JP4058425B2 (ja) * 2004-06-10 2008-03-12 Ｔｄｋ株式会社 スタンパー、インプリント方法および情報記録媒体製造方法
US7306970B2 (en) * 2004-08-30 2007-12-11 International Business Machines Corporation Method and apparatus for manufacturing an optoelectronic device
EP1789848B1 (de) * 2004-09-08 2010-06-30 NIL Technology APS Flexibler nano-druckstempel
US7654816B2 (en) * 2004-10-07 2010-02-02 Hewlett-Packard Development Company, L.P. Lithographic mask alignment
US20060081557A1 (en) 2004-10-18 2006-04-20 Molecular Imprints, Inc. Low-k dielectric functional imprinting materials
EP1669196B1 (de) * 2004-12-10 2008-05-21 ESSILOR INTERNATIONAL (Compagnie Générale d'Optique) Stempel zum Auftragen eines Motivs, Verfahren zur Stempelherstellung und Verfahren zur Herstellung eines Objekts anhand von diesem Stempel
EP1853967A4 (de) * 2005-02-03 2009-11-11 Univ North Carolina Polymermaterial mit niedriger oberflächenenergie zur verwendung in flüssigkristallanzeigen
GB2426486A (en) * 2005-05-27 2006-11-29 Microsaic Systems Ltd Self-aligning micro-contact print engine
EP4040474A1 (de) * 2005-06-02 2022-08-10 The Board of Trustees of the University of Illinois Druckbare halbleiterstrukturen und verfahren zum herstellen und montieren
US8173525B2 (en) 2005-06-17 2012-05-08 Georgia Tech Research Corporation Systems and methods for nanomaterial transfer
US7771917B2 (en) * 2005-06-17 2010-08-10 Micron Technology, Inc. Methods of making templates for use in imprint lithography
KR101222946B1 (ko) 2005-06-24 2013-01-17 엘지디스플레이 주식회사 백 프레인이 부착된 소프트 몰드의 제조방법
US20090304992A1 (en) * 2005-08-08 2009-12-10 Desimone Joseph M Micro and Nano-Structure Metrology
EP1764648B1 (de) 2005-09-14 2012-05-23 Thallner, Erich, Dipl.-Ing. Stempel mit einer Nanostempelstruktur sowie Vorrichtung und Verfahren zu dessen Herstellung
FR2894515B1 (fr) * 2005-12-08 2008-02-15 Essilor Int Procede de transfert d'un motif micronique sur un article optique et article optique ainsi obtenu
US7943080B2 (en) 2005-12-23 2011-05-17 Asml Netherlands B.V. Alignment for imprint lithography
US7377765B2 (en) * 2006-02-14 2008-05-27 Hitachi Global Storage Technologies System, method, and apparatus for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
JP2009528254A (ja) 2006-03-03 2009-08-06 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 空間的に配列したナノチューブ及びナノチューブアレイの作製方法
GB2436163A (en) * 2006-03-10 2007-09-19 Seiko Epson Corp Device fabrication by ink-jet printing materials into bank structures, and embossing tool
JP4641321B2 (ja) * 2006-03-27 2011-03-02 パイオニア株式会社 パターン転写用モールド
WO2007117808A2 (en) * 2006-03-29 2007-10-18 Dow Corning Corporation Method of forming nanoscale features using soft lithography
KR100857521B1 (ko) * 2006-06-13 2008-09-08 엘지디스플레이 주식회사 박막트랜지스터 제조용 몰드의 제조방법 및 그 제조장비
FR2903679B1 (fr) * 2006-07-17 2014-07-04 Centre Nat Rech Scient Fabrication de dispositifs microfluidiques polymeriques par impression photo-assistee.
KR101290598B1 (ko) * 2006-09-07 2013-07-29 엘지디스플레이 주식회사 횡전계형 액정표시장치용 컬러필터 기판의 제조방법
KR100831046B1 (ko) * 2006-09-13 2008-05-21 삼성전자주식회사 나노 임프린트용 몰드 및 그 제조 방법
US7919029B2 (en) * 2006-12-01 2011-04-05 Seagate Technology Llc Thermal compensated stampers/imprinters
US20080128944A1 (en) * 2006-12-01 2008-06-05 Seagate Technology Llc Injection molded polymeric stampers/imprinters for fabricating patterned recording media
US8128393B2 (en) 2006-12-04 2012-03-06 Liquidia Technologies, Inc. Methods and materials for fabricating laminate nanomolds and nanoparticles therefrom
KR101610885B1 (ko) 2007-01-17 2016-04-08 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
GB0701909D0 (en) * 2007-01-31 2007-03-14 Imp Innovations Ltd Deposition Of Organic Layers
JP5064078B2 (ja) * 2007-03-30 2012-10-31 株式会社日立産機システム 微細パターン転写用金型およびそれを用いた樹脂製転写物の製造方法
JP2010537395A (ja) * 2007-05-30 2010-12-02 モレキュラー・インプリンツ・インコーポレーテッド 窒化ケイ素、炭化ケイ素、または酸窒化ケイ素膜を有するテンプレート
DE102007027434A1 (de) * 2007-06-14 2008-12-18 X-Fab Semiconductor Foundries Ag Verfahren zur Herstellung von Justagestrukturen für eine strukturierte Schichtabscheidung auf einem Mikrosystemtechnikwafer mittels einer Beschichtungsmaske
DE102007027435A1 (de) * 2007-06-14 2008-12-18 X-Fab Semiconductor Foundries Ag Verfahren und Vorrichtung zur strukturierten Schichtabscheidung auf prozessierten Mikrosystemtechnikwafern
JP4448868B2 (ja) * 2007-06-29 2010-04-14 株式会社日立産機システム インプリント用スタンパとその製造方法
GB2453766A (en) * 2007-10-18 2009-04-22 Novalia Ltd Method of fabricating an electronic device
TWI444282B (zh) 2007-10-19 2014-07-11 Showa Denko Kk 樹脂壓模（ｓｔａｍｐｅｒ）之製造方法及製造裝置及壓印（ｉｍｐｒｉｎｔ）方法、以及磁性記錄媒體及磁性記錄再生裝置
FR2922813B1 (fr) 2007-10-31 2010-04-09 Lyon Ecole Centrale Dispositif et procedes de microtamponnage et tampon pour ce dispositif
JP5002422B2 (ja) * 2007-11-14 2012-08-15 株式会社日立ハイテクノロジーズ ナノプリント用樹脂スタンパ
SG185929A1 (en) 2007-11-21 2012-12-28 Molecular Imprints Inc Porous template and imprinting stack for nano-imprint lithography
US9054074B2 (en) * 2007-12-17 2015-06-09 International Business Machines Corporation One-dimensional hierarchical nested channel design for continuous feed manufacturing processes
JP5408953B2 (ja) * 2008-01-18 2014-02-05 昭和電工株式会社 樹脂スタンパの製造方法とインプリント方法及び磁気記録媒体の製造方法
JP5435879B2 (ja) 2008-02-14 2014-03-05 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
JP5101343B2 (ja) 2008-03-03 2012-12-19 株式会社ダイセル 微細構造物の製造方法
EP2255378B1 (de) 2008-03-05 2015-08-05 The Board of Trustees of the University of Illinois Streckbare und klappbare elektronische anordnungen
US8470701B2 (en) 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US20090263729A1 (en) * 2008-04-21 2009-10-22 Micron Technology, Inc. Templates for imprint lithography and methods of fabricating and using such templates
ES2687650T3 (es) 2008-04-25 2018-10-26 Northwestern University Litografía de Plumas de Polímero
US8945502B2 (en) * 2008-04-30 2015-02-03 The Regents Of The University Of California Patterned, dense and high-quality SWNTs arrays
JP5160302B2 (ja) * 2008-05-19 2013-03-13 株式会社東芝 半導体装置の製造方法
US9038536B2 (en) 2008-06-02 2015-05-26 Koninklijke Philips N.V. Silicone rubber material for soft lithography
WO2010005707A1 (en) * 2008-06-16 2010-01-14 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US7927976B2 (en) 2008-07-23 2011-04-19 Semprius, Inc. Reinforced composite stamp for dry transfer printing of semiconductor elements
JP5117318B2 (ja) * 2008-08-07 2013-01-16 株式会社日立ハイテクノロジーズ ナノインプリント用スタンパ及び該スタンパを使用する微細構造転写装置
JP4609562B2 (ja) * 2008-09-10 2011-01-12 日立電線株式会社 微細構造転写用スタンパ及びその製造方法
US8470188B2 (en) 2008-10-02 2013-06-25 Molecular Imprints, Inc. Nano-imprint lithography templates
JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 伸縮可能な集積回路およびセンサアレイを有する装置
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
JP5155814B2 (ja) * 2008-10-21 2013-03-06 株式会社日立ハイテクノロジーズ インプリント装置
WO2010059781A1 (en) 2008-11-19 2010-05-27 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
CA2752907A1 (en) * 2009-02-18 2010-08-26 Northwestern University Gel polymer pen lithography
TWI671811B (zh) 2009-05-12 2019-09-11 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
US8261660B2 (en) 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
DE102009034532A1 (de) * 2009-07-23 2011-02-03 Msg Lithoglas Ag Verfahren zum Herstellen einer strukturierten Beschichtung auf einem Substrat, beschichtetes Substrat sowie Halbzeug mit einem beschichteten Substrat
JP2011059021A (ja) * 2009-09-11 2011-03-24 Tokyo Electron Ltd 基板検査装置及び基板検査装置における位置合わせ方法
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
JP6046491B2 (ja) 2009-12-16 2016-12-21 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ コンフォーマル電子機器を使用した生体内での電気生理学
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US20110151114A1 (en) * 2009-12-18 2011-06-23 Cooledge Lighting, Inc. Composite patterning device and method for removing elements from host substrate by establishing conformal contact between device and a contact surface
WO2011094317A2 (en) * 2010-01-26 2011-08-04 Molecular Imprints, Inc. Micro-conformal templates for nanoimprint lithography
FR2955520B1 (fr) * 2010-01-28 2012-08-31 Commissariat Energie Atomique Moule pour la lithographie par nano-impression et procedes de realisation
US20110189329A1 (en) * 2010-01-29 2011-08-04 Molecular Imprints, Inc. Ultra-Compliant Nanoimprint Lithography Template
CN105496423A (zh) 2010-03-17 2016-04-20 伊利诺伊大学评议会 基于生物可吸收基质的可植入生物医学装置
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
WO2012167096A2 (en) 2011-06-03 2012-12-06 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US9701045B2 (en) 2011-06-30 2017-07-11 3M Innovative Properties Company Method for making, inking, and mounting stamps for micro-contact printing
KR101979354B1 (ko) 2011-12-01 2019-08-29 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프로그램 변형을 실행하도록 설계된 과도 장치
EP2830492B1 (de) 2012-03-30 2021-05-19 The Board of Trustees of the University of Illinois An ein körperteil montierbare, oberflächenkonformierbare, elektronische vorrichtungen und zugehöriges herstellungsverfahren
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US20140251660A1 (en) * 2013-03-05 2014-09-11 Ronald Steven Cok Variable-depth micro-channel structure
CN107078085B (zh) 2014-10-28 2020-12-08 美国亚德诺半导体公司 转移打印方法
MX2017015586A (es) 2015-06-01 2018-08-23 Univ Illinois Sistemas electronicos miniaturizados con capacidades de energia inalambrica y comunicacion de campo cercano.
US11029198B2 (en) 2015-06-01 2021-06-08 The Board Of Trustees Of The University Of Illinois Alternative approach for UV sensing
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
BR112019001453B1 (pt) 2016-07-27 2023-02-07 Koninklijke Philips N.V. Método de fabricação de uma estampa à base de poliorganossiloxano, estampa à base de poliorganossiloxano, uso da mesma e método de formação de uma camada dotada de um padrão
TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
EP3691851A4 (de) * 2017-10-03 2021-06-23 Cornell University Systeme und verfahren zur mikrostrukturierung von objekten
CN112689797A (zh) * 2018-09-12 2021-04-20 应用材料公司 用于制造压印光刻的印模的方法、用于压印光刻的印模、压印辊子、和卷对卷基板处理设备
WO2020052749A1 (en) * 2018-09-12 2020-03-19 Applied Materials, Inc. Method of manufacturing a stamp for imprint lithography, stamp for imprint lithography, imprint roller and roll-to-roll substrate processing apparatus
US20200278605A1 (en) 2019-03-01 2020-09-03 Applied Materials, Inc. Method and apparatus for stamp generation and curing

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2253944C2 (de) * 1972-11-03 1983-02-24 Agfa-Gevaert Ag, 5090 Leverkusen Verfahren zur Herstellung eines Reliefbildes
FR2663760A1 (fr) * 1990-06-26 1991-12-27 Amri Dahbia Procede de fabrication d'un tampon marqueur portatif permettant de reproduire manuellement une photographie d'identite en demi-teinte sur tout document et en nombre illimite.
US5270078A (en) * 1992-08-14 1993-12-14 E. I. Du Pont De Nemours And Company Method for preparing high resolution wash-off images
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles

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WO1997006012A1 (en) 1997-02-20
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EP0784542B1 (de) 2001-11-28
US5817242A (en) 1998-10-06
EP0784542A1 (de) 1997-07-23

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