DE69514268D1 - Leiterrahmen für Halbleiteranordnung - Google Patents

Leiterrahmen für Halbleiteranordnung

Info

Publication number
DE69514268D1
DE69514268D1 DE69514268T DE69514268T DE69514268D1 DE 69514268 D1 DE69514268 D1 DE 69514268D1 DE 69514268 T DE69514268 T DE 69514268T DE 69514268 T DE69514268 T DE 69514268T DE 69514268 D1 DE69514268 D1 DE 69514268D1
Authority
DE
Germany
Prior art keywords
semiconductor device
lead frame
lead
frame
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69514268T
Other languages
English (en)
Other versions
DE69514268T2 (de
Inventor
Kenji Takahashi
Junichi Asada
Kazunori Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69514268D1 publication Critical patent/DE69514268D1/de
Application granted granted Critical
Publication of DE69514268T2 publication Critical patent/DE69514268T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69514268T 1990-04-18 1991-04-17 Leiterrahmen für Halbleiteranordnung Expired - Fee Related DE69514268T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2102135A JP2515032B2 (ja) 1990-04-18 1990-04-18 半導体装置用リ―ドフレ―ム

Publications (2)

Publication Number Publication Date
DE69514268D1 true DE69514268D1 (de) 2000-02-10
DE69514268T2 DE69514268T2 (de) 2000-06-08

Family

ID=14319325

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69514268T Expired - Fee Related DE69514268T2 (de) 1990-04-18 1991-04-17 Leiterrahmen für Halbleiteranordnung
DE69125200T Expired - Fee Related DE69125200T2 (de) 1990-04-18 1991-04-17 Leiterrahmen für Halbleiteranordnung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69125200T Expired - Fee Related DE69125200T2 (de) 1990-04-18 1991-04-17 Leiterrahmen für Halbleiteranordnung

Country Status (5)

Country Link
US (1) US5162895A (de)
EP (2) EP0452903B1 (de)
JP (1) JP2515032B2 (de)
KR (1) KR950006437B1 (de)
DE (2) DE69514268T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100234351B1 (ko) * 1992-04-17 1999-12-15 윤종용 리드 프레임
JP3205235B2 (ja) * 1995-01-19 2001-09-04 シャープ株式会社 リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
US5990544A (en) * 1997-07-07 1999-11-23 Nippon Steel Semiconductor Corp. Lead frame and a semiconductor device having the same
US5889318A (en) * 1997-08-12 1999-03-30 Micron Technology, Inc. Lead frame including angle iron tie bar and method of making the same
US6028350A (en) * 1998-02-09 2000-02-22 Advanced Micro Devices, Inc. Lead frame with strip-shaped die bonding pad
JP2001308247A (ja) * 2000-04-19 2001-11-02 Nec Kansai Ltd リードフレーム及び表面実装型半導体装置
US6373126B1 (en) * 2000-04-26 2002-04-16 Advanced Micro Devices, Inc. Method for reducing IC package delamination by use of internal baffles
SG112799A1 (en) 2000-10-09 2005-07-28 St Assembly Test Services Ltd Leaded semiconductor packages and method of trimming and singulating such packages
US6686258B2 (en) 2000-11-02 2004-02-03 St Assembly Test Services Ltd. Method of trimming and singulating leaded semiconductor packages
US7875962B2 (en) * 2007-10-15 2011-01-25 Power Integrations, Inc. Package for a power semiconductor device
JP6193622B2 (ja) * 2013-05-28 2017-09-06 日本特殊陶業株式会社 配線基板ユニットおよびリード付き配線基板の製造方法
JP6653235B2 (ja) * 2016-09-29 2020-02-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5455169A (en) * 1977-10-12 1979-05-02 Nec Corp Semiconductor device
JPS54113370U (de) * 1978-01-26 1979-08-09
JPS5691455A (en) * 1979-12-26 1981-07-24 Fujitsu Ltd Lead frame for manufacturing of semiconductor device
CA1195782A (en) * 1981-07-06 1985-10-22 Mikio Nishikawa Lead frame for plastic encapsulated semiconductor device
US4706105A (en) * 1983-02-02 1987-11-10 Hitachi, Ltd. Semiconductor device and method of producing the same
JPS59147448A (ja) * 1983-02-12 1984-08-23 Fujitsu Ltd 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法
JPS6123351A (ja) * 1984-07-11 1986-01-31 Nec Corp リ−ドフレ−ム
JPS61160956A (ja) * 1985-01-08 1986-07-21 Sanyo Electric Co Ltd 半導体装置
JPS61245556A (ja) * 1985-04-24 1986-10-31 Hitachi Ltd リ−ドフレ−ム
JPS61179756U (de) * 1985-04-30 1986-11-10
JPS62136056A (ja) * 1985-12-09 1987-06-19 Nec Corp リ−ドフレ−ム
JPS62162837U (de) * 1986-04-04 1987-10-16
JPS6327057U (de) * 1986-08-05 1988-02-22
JPS63110763A (ja) * 1986-10-29 1988-05-16 Mitsubishi Electric Corp リ−ドフレ−ム
JPS63181362A (ja) * 1987-01-23 1988-07-26 Hitachi Ltd リ−ドフレ−ム
US4942454A (en) * 1987-08-05 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed semiconductor device
JPH01150345A (ja) * 1987-12-07 1989-06-13 Mitsubishi Electric Corp リードフレーム
JPH01244654A (ja) * 1988-03-25 1989-09-29 Nec Kyushu Ltd リードフレーム
JPH01304759A (ja) * 1988-06-02 1989-12-08 Mitsubishi Electric Corp 半導体用リードフレーム
JPH0212955A (ja) * 1988-06-30 1990-01-17 Nec Corp リードフレーム
JPH0233961A (ja) * 1988-07-23 1990-02-05 Nec Corp リードフレーム
JPH02194641A (ja) * 1989-01-24 1990-08-01 Ibiden Co Ltd リードフレーム
JPH02244750A (ja) * 1989-03-17 1990-09-28 Fujitsu Miyagi Electron:Kk リードフレーム
JPH0395960A (ja) * 1989-09-07 1991-04-22 Hitachi Cable Ltd アウターリードが半田めっきされてなるリードフレームの製造方法

Also Published As

Publication number Publication date
KR910019181A (ko) 1991-11-30
US5162895A (en) 1992-11-10
EP0452903B1 (de) 1997-03-19
EP0676807B1 (de) 2000-01-05
DE69514268T2 (de) 2000-06-08
KR950006437B1 (ko) 1995-06-15
EP0676807A1 (de) 1995-10-11
EP0452903A3 (en) 1992-12-23
EP0452903A2 (de) 1991-10-23
DE69125200T2 (de) 1997-08-07
JPH04750A (ja) 1992-01-06
DE69125200D1 (de) 1997-04-24
JP2515032B2 (ja) 1996-07-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee