DE69505553T2 - MONOLITHISCHE MIKROELEKTRONISCHE SCHALTUNGSMODULE AUS FLüSSIGKRISTALLPOLYMER - Google Patents

MONOLITHISCHE MIKROELEKTRONISCHE SCHALTUNGSMODULE AUS FLüSSIGKRISTALLPOLYMER

Info

Publication number
DE69505553T2
DE69505553T2 DE69505553T DE69505553T DE69505553T2 DE 69505553 T2 DE69505553 T2 DE 69505553T2 DE 69505553 T DE69505553 T DE 69505553T DE 69505553 T DE69505553 T DE 69505553T DE 69505553 T2 DE69505553 T2 DE 69505553T2
Authority
DE
Germany
Prior art keywords
layers
polymer
liquid crystal
crystal polymer
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69505553T
Other languages
English (en)
Other versions
DE69505553D1 (de
Inventor
Randy Jester
Edwin Culbertson
Detlef Frank
Sherman Rounsville
John Penoyer
Takeichi Tsudaka
Mioru Onodera
Toshiaki Sato
Toru Sanefuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuraray Co Ltd
CNA Holdings LLC
Original Assignee
Kuraray Co Ltd
Hoechst Celanese Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co Ltd, Hoechst Celanese Corp filed Critical Kuraray Co Ltd
Application granted granted Critical
Publication of DE69505553D1 publication Critical patent/DE69505553D1/de
Publication of DE69505553T2 publication Critical patent/DE69505553T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Liquid Crystal (AREA)
  • Liquid Crystal Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69505553T 1994-09-16 1995-09-05 MONOLITHISCHE MIKROELEKTRONISCHE SCHALTUNGSMODULE AUS FLüSSIGKRISTALLPOLYMER Expired - Lifetime DE69505553T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/307,958 US5719354A (en) 1994-09-16 1994-09-16 Monolithic LCP polymer microelectronic wiring modules
PCT/US1995/011101 WO1996008945A1 (en) 1994-09-16 1995-09-05 Monolithic lcp polymer microelectronic wiring modules

Publications (2)

Publication Number Publication Date
DE69505553D1 DE69505553D1 (de) 1998-11-26
DE69505553T2 true DE69505553T2 (de) 1999-06-24

Family

ID=23191904

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69505553T Expired - Lifetime DE69505553T2 (de) 1994-09-16 1995-09-05 MONOLITHISCHE MIKROELEKTRONISCHE SCHALTUNGSMODULE AUS FLüSSIGKRISTALLPOLYMER

Country Status (6)

Country Link
US (1) US5719354A (de)
EP (1) EP0781501B1 (de)
JP (1) JP3190547B2 (de)
AT (1) ATE172592T1 (de)
DE (1) DE69505553T2 (de)
WO (1) WO1996008945A1 (de)

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JPH11297458A (ja) * 1998-04-06 1999-10-29 Kuraray Co Ltd フレキシブルヒータ
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CN109699132A (zh) * 2018-12-28 2019-04-30 广州市香港科大霍英东研究院 多层lcp低温压合方法及制备的产品
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CN112349688B (zh) * 2020-09-28 2022-04-19 中国电子科技集团公司第二十九研究所 一种六层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349689B (zh) * 2020-09-28 2022-09-20 中国电子科技集团公司第二十九研究所 一种六层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349685B (zh) * 2020-09-28 2022-05-10 中国电子科技集团公司第二十九研究所 一种六层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349695B (zh) * 2020-09-28 2022-04-19 中国电子科技集团公司第二十九研究所 一种四层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349697B (zh) * 2020-09-28 2022-09-20 中国电子科技集团公司第二十九研究所 一种六层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349684B (zh) * 2020-09-28 2022-10-21 中国电子科技集团公司第二十九研究所 一种lcp封装基板、制造方法及多芯片系统级封装结构
CN112349694B (zh) * 2020-09-28 2022-05-17 中国电子科技集团公司第二十九研究所 一种lcp封装基板、制造方法及多芯片系统级封装结构
CN112349691B (zh) * 2020-09-28 2023-05-05 中国电子科技集团公司第二十九研究所 一种气密高导热lcp封装基板、制造方法及多芯片系统级封装结构
CN112349683B (zh) * 2020-09-28 2022-04-26 中国电子科技集团公司第二十九研究所 一种四层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349687B (zh) * 2020-09-28 2023-06-16 中国电子科技集团公司第二十九研究所 一种六层布线任意层互联lcp封装基板、制造方法及多芯片系统级封装结构
CN112349690B (zh) * 2020-09-28 2023-06-16 中国电子科技集团公司第二十九研究所 一种六层布线任意层互联lcp封装基板、制造方法及多芯片系统级封装结构

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Also Published As

Publication number Publication date
JPH0897565A (ja) 1996-04-12
JP3190547B2 (ja) 2001-07-23
ATE172592T1 (de) 1998-11-15
WO1996008945A1 (en) 1996-03-21
US5719354A (en) 1998-02-17
EP0781501B1 (de) 1998-10-21
DE69505553D1 (de) 1998-11-26
EP0781501A1 (de) 1997-07-02

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