ATE172592T1 - Monolithische mikroelektronische schaltungsmodule aus flüssigkristallpolymer - Google Patents

Monolithische mikroelektronische schaltungsmodule aus flüssigkristallpolymer

Info

Publication number
ATE172592T1
ATE172592T1 AT95931048T AT95931048T ATE172592T1 AT E172592 T1 ATE172592 T1 AT E172592T1 AT 95931048 T AT95931048 T AT 95931048T AT 95931048 T AT95931048 T AT 95931048T AT E172592 T1 ATE172592 T1 AT E172592T1
Authority
AT
Austria
Prior art keywords
layers
polymer
liquid crystal
crystal polymer
melting point
Prior art date
Application number
AT95931048T
Other languages
English (en)
Inventor
Randy D Jester
Edwin C Culbertson
Detlef M Frank
Sherman H Rounsville
John A Penoyer
Takeichi Tsudaka
Mioru Onodera
Toshiaki Sato
Toru Sanefuji
Original Assignee
Hoechst Celanese Corp
Kuraray Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst Celanese Corp, Kuraray Co filed Critical Hoechst Celanese Corp
Application granted granted Critical
Publication of ATE172592T1 publication Critical patent/ATE172592T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Liquid Crystal (AREA)
  • Liquid Crystal Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT95931048T 1994-09-16 1995-09-05 Monolithische mikroelektronische schaltungsmodule aus flüssigkristallpolymer ATE172592T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/307,958 US5719354A (en) 1994-09-16 1994-09-16 Monolithic LCP polymer microelectronic wiring modules

Publications (1)

Publication Number Publication Date
ATE172592T1 true ATE172592T1 (de) 1998-11-15

Family

ID=23191904

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95931048T ATE172592T1 (de) 1994-09-16 1995-09-05 Monolithische mikroelektronische schaltungsmodule aus flüssigkristallpolymer

Country Status (6)

Country Link
US (1) US5719354A (de)
EP (1) EP0781501B1 (de)
JP (1) JP3190547B2 (de)
AT (1) ATE172592T1 (de)
DE (1) DE69505553T2 (de)
WO (1) WO1996008945A1 (de)

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CN112349688B (zh) * 2020-09-28 2022-04-19 中国电子科技集团公司第二十九研究所 一种六层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349697B (zh) * 2020-09-28 2022-09-20 中国电子科技集团公司第二十九研究所 一种六层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349684B (zh) * 2020-09-28 2022-10-21 中国电子科技集团公司第二十九研究所 一种lcp封装基板、制造方法及多芯片系统级封装结构
CN112349689B (zh) * 2020-09-28 2022-09-20 中国电子科技集团公司第二十九研究所 一种六层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349685B (zh) * 2020-09-28 2022-05-10 中国电子科技集团公司第二十九研究所 一种六层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349690B (zh) * 2020-09-28 2023-06-16 中国电子科技集团公司第二十九研究所 一种六层布线任意层互联lcp封装基板、制造方法及多芯片系统级封装结构
CN112349694B (zh) * 2020-09-28 2022-05-17 中国电子科技集团公司第二十九研究所 一种lcp封装基板、制造方法及多芯片系统级封装结构
CN112349683B (zh) * 2020-09-28 2022-04-26 中国电子科技集团公司第二十九研究所 一种四层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349695B (zh) * 2020-09-28 2022-04-19 中国电子科技集团公司第二十九研究所 一种四层布线lcp封装基板、制造方法及多芯片系统级封装结构
CN112349691B (zh) * 2020-09-28 2023-05-05 中国电子科技集团公司第二十九研究所 一种气密高导热lcp封装基板、制造方法及多芯片系统级封装结构
WO2022113961A1 (ja) * 2020-11-24 2022-06-02 富士フイルム株式会社 液晶ポリマーフィルム、ポリマーフィルム、及び、積層体
JP7507502B2 (ja) * 2022-03-24 2024-06-28 佳勝科技股▲ふん▼有限公司 多層基板

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Also Published As

Publication number Publication date
JPH0897565A (ja) 1996-04-12
US5719354A (en) 1998-02-17
DE69505553T2 (de) 1999-06-24
EP0781501B1 (de) 1998-10-21
WO1996008945A1 (en) 1996-03-21
DE69505553D1 (de) 1998-11-26
JP3190547B2 (ja) 2001-07-23
EP0781501A1 (de) 1997-07-02

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