ATE155312T1 - Herstellungsverfahren einer vielschicht- leiterplatte - Google Patents

Herstellungsverfahren einer vielschicht- leiterplatte

Info

Publication number
ATE155312T1
ATE155312T1 AT93917736T AT93917736T ATE155312T1 AT E155312 T1 ATE155312 T1 AT E155312T1 AT 93917736 T AT93917736 T AT 93917736T AT 93917736 T AT93917736 T AT 93917736T AT E155312 T1 ATE155312 T1 AT E155312T1
Authority
AT
Austria
Prior art keywords
substrate
traces
basic
contact
circuit board
Prior art date
Application number
AT93917736T
Other languages
English (en)
Inventor
Erik Middelman
Pieter Hendrik Zuuring
Original Assignee
Amp Akzo Linlam Vof
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Akzo Linlam Vof filed Critical Amp Akzo Linlam Vof
Application granted granted Critical
Publication of ATE155312T1 publication Critical patent/ATE155312T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0287—Unidirectional or parallel fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
AT93917736T 1992-08-13 1993-08-03 Herstellungsverfahren einer vielschicht- leiterplatte ATE155312T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP92202492 1992-08-13

Publications (1)

Publication Number Publication Date
ATE155312T1 true ATE155312T1 (de) 1997-07-15

Family

ID=8210849

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93917736T ATE155312T1 (de) 1992-08-13 1993-08-03 Herstellungsverfahren einer vielschicht- leiterplatte

Country Status (12)

Country Link
EP (1) EP0655183B1 (de)
JP (1) JP2650072B2 (de)
KR (1) KR950703270A (de)
AT (1) ATE155312T1 (de)
AU (1) AU683846B2 (de)
BR (1) BR9306894A (de)
CA (1) CA2142267A1 (de)
DE (1) DE69312073T2 (de)
ES (1) ES2105301T3 (de)
RU (1) RU2115274C1 (de)
TW (1) TW230864B (de)
WO (1) WO1994005140A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2924894B1 (fr) * 2007-12-10 2010-12-10 Eads Europ Aeronautic Defence Pieces en materiau composite electro-structural.
WO2009088687A2 (en) 2007-12-31 2009-07-16 Datalogic Mobile, Inc. Systems and methods for configuring, updating, and booting an alternate operating system on a portable data reader
JP5125567B2 (ja) * 2008-02-07 2013-01-23 株式会社デンソー 多層回路基板
JP5956198B2 (ja) * 2012-03-05 2016-07-27 旭化成株式会社 集光型太陽電池用レンズ及び集光型太陽電池用レンズの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3756891A (en) * 1967-12-26 1973-09-04 Multilayer circuit board techniques
JPH01283996A (ja) * 1988-05-11 1989-11-15 Mitsubishi Electric Corp 多層プリント配線板
JPH02237197A (ja) * 1989-03-10 1990-09-19 Hitachi Ltd 多層回路基板及びその製造方法並びにその用途
ES2072531T3 (es) * 1990-09-24 1995-07-16 Amp Akzo Linlam Vof Metodo para la fabricacion, en un procedimiento continuo, de sustratos para placas de circuitos impresos, y placas de circuitos impresos asi fabricadas.

Also Published As

Publication number Publication date
EP0655183B1 (de) 1997-07-09
EP0655183A1 (de) 1995-05-31
AU683846B2 (en) 1997-11-27
WO1994005140A1 (en) 1994-03-03
JP2650072B2 (ja) 1997-09-03
TW230864B (de) 1994-09-21
RU2115274C1 (ru) 1998-07-10
ES2105301T3 (es) 1997-10-16
AU4706593A (en) 1994-03-15
BR9306894A (pt) 1998-12-08
DE69312073D1 (de) 1997-08-14
KR950703270A (ko) 1995-08-23
JPH08500212A (ja) 1996-01-09
RU95106822A (ru) 1996-11-27
DE69312073T2 (de) 1998-01-15
CA2142267A1 (en) 1994-03-03

Similar Documents

Publication Publication Date Title
ES2089534T3 (es) Metodo para fabricar un panel de circuito impreso de capas multiples.
RU93058543A (ru) Способ изготовления многослойных печатных плат и многослойная печатная плата
KR970014494A (ko) 다층회로기판 및 그 제조방법
TW200740334A (en) Multilayer printed wiring board and its manufacturing method
CA2083072A1 (en) Method for manufacturing polyimide multilayer wiring substrate
EP0282625A3 (de) Verfahren zur Herstellung einer gedruckten Mehrschichtleiterplatte vom starren Typ
KR970061017A (ko) 도체층부착이방성도전시트 및 이를 사용한 배선기판
CN109429441A (zh) 软硬结合板及其制作方法
MY110786A (en) Method for producing a printed circuit board and a printed circuit board
ATE155312T1 (de) Herstellungsverfahren einer vielschicht- leiterplatte
WO2004114730A3 (en) Metal foil composite structure for producing clad laminate
JPH0359597B2 (de)
JPS5998597A (ja) 多層プリント配線板
JPS6489591A (en) Manufacture of wiring board and that of multilayer wiring board
JPH10173313A (ja) 貫通孔用銅張積層板の重ね形成
JP2514667B2 (ja) 多層基板の製造方法
JPH0521960A (ja) 多層プリント配線板およびその製造方法
JPS62277795A (ja) 配線板の製造方法
JPS60236278A (ja) 配線用板
JPS61226991A (ja) 多層回路基板
JPH02119294A (ja) プリント配線板の製造方法
JPS6459989A (en) Manufacture of printed wiring board
JPH0133959B2 (de)
JPS5814760B2 (ja) インサツカイロバン
JPH0359595B2 (de)

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee