DE69427037T2 - Anisotropischer elektroleitfaehiger klebefilm - Google Patents

Anisotropischer elektroleitfaehiger klebefilm

Info

Publication number
DE69427037T2
DE69427037T2 DE69427037T DE69427037T DE69427037T2 DE 69427037 T2 DE69427037 T2 DE 69427037T2 DE 69427037 T DE69427037 T DE 69427037T DE 69427037 T DE69427037 T DE 69427037T DE 69427037 T2 DE69427037 T2 DE 69427037T2
Authority
DE
Germany
Prior art keywords
glass particles
adhesive film
particles
electrically conductive
styrene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69427037T
Other languages
German (de)
English (en)
Other versions
DE69427037D1 (de
Inventor
Hiroaki Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of DE69427037D1 publication Critical patent/DE69427037D1/de
Publication of DE69427037T2 publication Critical patent/DE69427037T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
DE69427037T 1993-12-16 1994-12-16 Anisotropischer elektroleitfaehiger klebefilm Expired - Fee Related DE69427037T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31639093A JP3408301B2 (ja) 1993-12-16 1993-12-16 異方性導電膜
PCT/US1994/014468 WO1995016998A1 (en) 1993-12-16 1994-12-16 Anisotropic, electrically conductive adhesive film

Publications (2)

Publication Number Publication Date
DE69427037D1 DE69427037D1 (de) 2001-05-10
DE69427037T2 true DE69427037T2 (de) 2001-11-15

Family

ID=18076551

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69427037T Expired - Fee Related DE69427037T2 (de) 1993-12-16 1994-12-16 Anisotropischer elektroleitfaehiger klebefilm

Country Status (8)

Country Link
EP (1) EP0734576B1 (enExample)
JP (1) JP3408301B2 (enExample)
KR (1) KR100359175B1 (enExample)
CN (1) CN1137324A (enExample)
DE (1) DE69427037T2 (enExample)
MY (1) MY113832A (enExample)
TW (1) TW250592B (enExample)
WO (1) WO1995016998A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2219325A1 (en) * 1995-04-24 1996-10-31 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesives for polyolefin surfaces
CA2254883A1 (en) * 1996-05-16 1997-11-20 Christopher A. Haak Adhesive compositions and methods of use
JP5378261B2 (ja) * 1997-02-14 2013-12-25 日立化成株式会社 回路部材接続用接着剤
EP1890324A3 (en) 1997-03-31 2008-06-11 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7618713B2 (en) 1997-03-31 2009-11-17 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JP3226889B2 (ja) * 1998-05-06 2001-11-05 シンワ プロダクト カンパニー・リミテッド 導電性粘着テープ
US6294270B1 (en) 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
KR100575467B1 (ko) * 1999-12-30 2006-05-03 삼성토탈 주식회사 자기점착이 가능한 보호필름용 수지 조성물
KR100398315B1 (ko) * 2001-02-12 2003-09-19 한국과학기술원 고주파 패키지용 플립 칩 접속을 위한 전도성 접착제의 제조방법
US7033668B2 (en) 2001-08-23 2006-04-25 Tesa Ag Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface
TW200538522A (en) * 2004-02-16 2005-12-01 Hitachi Chemical Co Ltd Adhesive composition, film-formed adhesive and circuit-joining material by using the same, and joining structure of circuit member and method for producing the same
DE602004014257D1 (de) 2004-06-02 2008-07-17 Sony Ericsson Mobile Comm Ab Transparente leitende Antenne für ein tragbares Kommunikationsgerät
KR100622598B1 (ko) * 2004-12-08 2006-09-19 엘에스전선 주식회사 피티씨 특성을 갖는 이방 도전성 접착제
EP1902493A1 (en) * 2005-07-08 2008-03-26 Cypak AB Use of heat-activated adhesive for manufacture and a device so manufactured
KR20110074634A (ko) 2007-01-10 2011-06-30 히다치 가세고교 가부시끼가이샤 회로 부재 접속용 접착제 및 이것을 이용한 반도체 장치
CN101836265B (zh) * 2007-10-22 2012-07-25 日本化学工业株式会社 包覆导电性粉体和使用该粉体的导电性粘合剂
TWI389999B (zh) * 2007-12-18 2013-03-21 Cheil Ind Inc 黏著性組成物及使用該黏著性組成物的各向異性導電膜
JP2010010142A (ja) * 2009-10-07 2010-01-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
TWI540590B (zh) * 2011-05-31 2016-07-01 住友電木股份有限公司 半導體裝置
US9111847B2 (en) * 2012-06-15 2015-08-18 Infineon Technologies Ag Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
CN112946797B (zh) * 2021-02-19 2023-10-31 晋江联兴反光材料有限公司 一种复合金属层的反光膜及其制备方法
JP2024510400A (ja) * 2021-03-09 2024-03-07 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー 進歩した接着剤

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608377A (ja) * 1983-06-28 1985-01-17 Matsushita Electric Ind Co Ltd 異方導電性接着剤
JPS60133079A (ja) * 1983-12-21 1985-07-16 Seikosha Co Ltd 異方導電性接着剤
JPS619472A (ja) * 1984-06-22 1986-01-17 Seikosha Co Ltd 異方導電性接着剤

Also Published As

Publication number Publication date
EP0734576B1 (en) 2001-04-04
MY113832A (en) 2002-06-29
EP0734576A1 (en) 1996-10-02
TW250592B (enExample) 1995-07-01
KR960706680A (ko) 1996-12-09
WO1995016998A1 (en) 1995-06-22
DE69427037D1 (de) 2001-05-10
JPH07211145A (ja) 1995-08-11
JP3408301B2 (ja) 2003-05-19
KR100359175B1 (ko) 2003-01-15
CN1137324A (zh) 1996-12-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee