KR100359175B1 - 이방성전기전도성접착제필름 - Google Patents

이방성전기전도성접착제필름 Download PDF

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Publication number
KR100359175B1
KR100359175B1 KR1019960703120A KR19960703120A KR100359175B1 KR 100359175 B1 KR100359175 B1 KR 100359175B1 KR 1019960703120 A KR1019960703120 A KR 1019960703120A KR 19960703120 A KR19960703120 A KR 19960703120A KR 100359175 B1 KR100359175 B1 KR 100359175B1
Authority
KR
South Korea
Prior art keywords
electrically conductive
adhesive film
adhesive
particles
glass particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960703120A
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English (en)
Korean (ko)
Other versions
KR960706680A (ko
Inventor
히로아키 야마구치
Original Assignee
미네소타 마이닝 앤드 매뉴팩춰링 캄파니
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Filing date
Publication date
Application filed by 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 filed Critical 미네소타 마이닝 앤드 매뉴팩춰링 캄파니
Publication of KR960706680A publication Critical patent/KR960706680A/ko
Application granted granted Critical
Publication of KR100359175B1 publication Critical patent/KR100359175B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
KR1019960703120A 1993-12-16 1994-12-16 이방성전기전도성접착제필름 Expired - Fee Related KR100359175B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31639093A JP3408301B2 (ja) 1993-12-16 1993-12-16 異方性導電膜
JP93-316390 1993-12-16

Publications (2)

Publication Number Publication Date
KR960706680A KR960706680A (ko) 1996-12-09
KR100359175B1 true KR100359175B1 (ko) 2003-01-15

Family

ID=18076551

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960703120A Expired - Fee Related KR100359175B1 (ko) 1993-12-16 1994-12-16 이방성전기전도성접착제필름

Country Status (8)

Country Link
EP (1) EP0734576B1 (enExample)
JP (1) JP3408301B2 (enExample)
KR (1) KR100359175B1 (enExample)
CN (1) CN1137324A (enExample)
DE (1) DE69427037T2 (enExample)
MY (1) MY113832A (enExample)
TW (1) TW250592B (enExample)
WO (1) WO1995016998A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140027305A (ko) * 2011-05-31 2014-03-06 스미또모 베이크라이트 가부시키가이샤 반도체 장치

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2219325A1 (en) * 1995-04-24 1996-10-31 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesives for polyolefin surfaces
CA2254883A1 (en) * 1996-05-16 1997-11-20 Christopher A. Haak Adhesive compositions and methods of use
JP5378261B2 (ja) * 1997-02-14 2013-12-25 日立化成株式会社 回路部材接続用接着剤
EP1890324A3 (en) 1997-03-31 2008-06-11 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7618713B2 (en) 1997-03-31 2009-11-17 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JP3226889B2 (ja) * 1998-05-06 2001-11-05 シンワ プロダクト カンパニー・リミテッド 導電性粘着テープ
US6294270B1 (en) 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
KR100575467B1 (ko) * 1999-12-30 2006-05-03 삼성토탈 주식회사 자기점착이 가능한 보호필름용 수지 조성물
KR100398315B1 (ko) * 2001-02-12 2003-09-19 한국과학기술원 고주파 패키지용 플립 칩 접속을 위한 전도성 접착제의 제조방법
US7033668B2 (en) 2001-08-23 2006-04-25 Tesa Ag Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface
TW200538522A (en) * 2004-02-16 2005-12-01 Hitachi Chemical Co Ltd Adhesive composition, film-formed adhesive and circuit-joining material by using the same, and joining structure of circuit member and method for producing the same
DE602004014257D1 (de) 2004-06-02 2008-07-17 Sony Ericsson Mobile Comm Ab Transparente leitende Antenne für ein tragbares Kommunikationsgerät
KR100622598B1 (ko) * 2004-12-08 2006-09-19 엘에스전선 주식회사 피티씨 특성을 갖는 이방 도전성 접착제
EP1902493A1 (en) * 2005-07-08 2008-03-26 Cypak AB Use of heat-activated adhesive for manufacture and a device so manufactured
KR20110074634A (ko) 2007-01-10 2011-06-30 히다치 가세고교 가부시끼가이샤 회로 부재 접속용 접착제 및 이것을 이용한 반도체 장치
CN101836265B (zh) * 2007-10-22 2012-07-25 日本化学工业株式会社 包覆导电性粉体和使用该粉体的导电性粘合剂
TWI389999B (zh) * 2007-12-18 2013-03-21 Cheil Ind Inc 黏著性組成物及使用該黏著性組成物的各向異性導電膜
JP2010010142A (ja) * 2009-10-07 2010-01-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
US9111847B2 (en) * 2012-06-15 2015-08-18 Infineon Technologies Ag Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
CN112946797B (zh) * 2021-02-19 2023-10-31 晋江联兴反光材料有限公司 一种复合金属层的反光膜及其制备方法
JP2024510400A (ja) * 2021-03-09 2024-03-07 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー 進歩した接着剤

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133079A (ja) * 1983-12-21 1985-07-16 Seikosha Co Ltd 異方導電性接着剤

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608377A (ja) * 1983-06-28 1985-01-17 Matsushita Electric Ind Co Ltd 異方導電性接着剤
JPS619472A (ja) * 1984-06-22 1986-01-17 Seikosha Co Ltd 異方導電性接着剤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133079A (ja) * 1983-12-21 1985-07-16 Seikosha Co Ltd 異方導電性接着剤

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140027305A (ko) * 2011-05-31 2014-03-06 스미또모 베이크라이트 가부시키가이샤 반도체 장치
KR101912573B1 (ko) * 2011-05-31 2018-10-29 스미또모 베이크라이트 가부시키가이샤 반도체 장치
KR20180118802A (ko) * 2011-05-31 2018-10-31 스미또모 베이크라이트 가부시키가이샤 반도체 장치
KR101969278B1 (ko) * 2011-05-31 2019-04-15 스미또모 베이크라이트 가부시키가이샤 반도체 장치

Also Published As

Publication number Publication date
EP0734576B1 (en) 2001-04-04
MY113832A (en) 2002-06-29
EP0734576A1 (en) 1996-10-02
TW250592B (enExample) 1995-07-01
KR960706680A (ko) 1996-12-09
DE69427037T2 (de) 2001-11-15
WO1995016998A1 (en) 1995-06-22
DE69427037D1 (de) 2001-05-10
JPH07211145A (ja) 1995-08-11
JP3408301B2 (ja) 2003-05-19
CN1137324A (zh) 1996-12-04

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