MY113832A - Anisotropic, electrically conductive adhesive film - Google Patents

Anisotropic, electrically conductive adhesive film

Info

Publication number
MY113832A
MY113832A MYPI94003372A MYPI19943372A MY113832A MY 113832 A MY113832 A MY 113832A MY PI94003372 A MYPI94003372 A MY PI94003372A MY PI19943372 A MYPI19943372 A MY PI19943372A MY 113832 A MY113832 A MY 113832A
Authority
MY
Malaysia
Prior art keywords
electrically conductive
anisotropic
adhesive film
conductive adhesive
insulating adhesive
Prior art date
Application number
MYPI94003372A
Other languages
English (en)
Inventor
Hiroaki Yamaguchi
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of MY113832A publication Critical patent/MY113832A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
MYPI94003372A 1993-12-16 1994-12-16 Anisotropic, electrically conductive adhesive film MY113832A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31639093A JP3408301B2 (ja) 1993-12-16 1993-12-16 異方性導電膜

Publications (1)

Publication Number Publication Date
MY113832A true MY113832A (en) 2002-06-29

Family

ID=18076551

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94003372A MY113832A (en) 1993-12-16 1994-12-16 Anisotropic, electrically conductive adhesive film

Country Status (8)

Country Link
EP (1) EP0734576B1 (enExample)
JP (1) JP3408301B2 (enExample)
KR (1) KR100359175B1 (enExample)
CN (1) CN1137324A (enExample)
DE (1) DE69427037T2 (enExample)
MY (1) MY113832A (enExample)
TW (1) TW250592B (enExample)
WO (1) WO1995016998A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2219325A1 (en) * 1995-04-24 1996-10-31 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesives for polyolefin surfaces
CA2254883A1 (en) * 1996-05-16 1997-11-20 Christopher A. Haak Adhesive compositions and methods of use
JP5378261B2 (ja) * 1997-02-14 2013-12-25 日立化成株式会社 回路部材接続用接着剤
EP1890324A3 (en) 1997-03-31 2008-06-11 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7618713B2 (en) 1997-03-31 2009-11-17 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JP3226889B2 (ja) * 1998-05-06 2001-11-05 シンワ プロダクト カンパニー・リミテッド 導電性粘着テープ
US6294270B1 (en) 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
KR100575467B1 (ko) * 1999-12-30 2006-05-03 삼성토탈 주식회사 자기점착이 가능한 보호필름용 수지 조성물
KR100398315B1 (ko) * 2001-02-12 2003-09-19 한국과학기술원 고주파 패키지용 플립 칩 접속을 위한 전도성 접착제의 제조방법
US7033668B2 (en) 2001-08-23 2006-04-25 Tesa Ag Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface
TW200538522A (en) * 2004-02-16 2005-12-01 Hitachi Chemical Co Ltd Adhesive composition, film-formed adhesive and circuit-joining material by using the same, and joining structure of circuit member and method for producing the same
DE602004014257D1 (de) 2004-06-02 2008-07-17 Sony Ericsson Mobile Comm Ab Transparente leitende Antenne für ein tragbares Kommunikationsgerät
KR100622598B1 (ko) * 2004-12-08 2006-09-19 엘에스전선 주식회사 피티씨 특성을 갖는 이방 도전성 접착제
EP1902493A1 (en) * 2005-07-08 2008-03-26 Cypak AB Use of heat-activated adhesive for manufacture and a device so manufactured
KR20110074634A (ko) 2007-01-10 2011-06-30 히다치 가세고교 가부시끼가이샤 회로 부재 접속용 접착제 및 이것을 이용한 반도체 장치
CN101836265B (zh) * 2007-10-22 2012-07-25 日本化学工业株式会社 包覆导电性粉体和使用该粉体的导电性粘合剂
TWI389999B (zh) * 2007-12-18 2013-03-21 Cheil Ind Inc 黏著性組成物及使用該黏著性組成物的各向異性導電膜
JP2010010142A (ja) * 2009-10-07 2010-01-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
TWI540590B (zh) * 2011-05-31 2016-07-01 住友電木股份有限公司 半導體裝置
US9111847B2 (en) * 2012-06-15 2015-08-18 Infineon Technologies Ag Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
CN112946797B (zh) * 2021-02-19 2023-10-31 晋江联兴反光材料有限公司 一种复合金属层的反光膜及其制备方法
JP2024510400A (ja) * 2021-03-09 2024-03-07 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー 進歩した接着剤

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608377A (ja) * 1983-06-28 1985-01-17 Matsushita Electric Ind Co Ltd 異方導電性接着剤
JPS60133079A (ja) * 1983-12-21 1985-07-16 Seikosha Co Ltd 異方導電性接着剤
JPS619472A (ja) * 1984-06-22 1986-01-17 Seikosha Co Ltd 異方導電性接着剤

Also Published As

Publication number Publication date
EP0734576B1 (en) 2001-04-04
EP0734576A1 (en) 1996-10-02
TW250592B (enExample) 1995-07-01
KR960706680A (ko) 1996-12-09
DE69427037T2 (de) 2001-11-15
WO1995016998A1 (en) 1995-06-22
DE69427037D1 (de) 2001-05-10
JPH07211145A (ja) 1995-08-11
JP3408301B2 (ja) 2003-05-19
KR100359175B1 (ko) 2003-01-15
CN1137324A (zh) 1996-12-04

Similar Documents

Publication Publication Date Title
MY113832A (en) Anisotropic, electrically conductive adhesive film
EP0848386A4 (en) TRANSPARENT CONDUCTIVE FILM, LOW REFLECTION TRANSPARENT CONDUCTIVE FILM, AND DISPLAY
AU625624B2 (en) Conductive polymer composition and electrical device
AU4724397A (en) Surface light source and liquid crystal display, portable telephone and information terminal employing the surface light source
DE69013232D1 (de) Tragbares datenverarbeitungsterminal mit schwenkbarer anzeige.
EP0821385A3 (en) Plasma display device and its manufacturing method
AU5408494A (en) Electrically insulating film and tape-backing made thereof
AU545782B2 (en) Suspension with soft block and spring in housing
GB2299425A (en) Specified return determinator
TW237581B (enExample)
AU6473198A (en) Gas storage and delivery system with an electrically conductive adsorbent
AU1659897A (en) Display sign and an optical element for use in the same
ATE26104T1 (de) Farbneutrale, solarselektive waermereflexionsschicht fuer glasscheiben.
WO1997044707A3 (en) Liquid crystal display device with integrated solar power source and antenna
EP0653463A3 (en) Electroconductive silicone rubber composition.
DE69023071D1 (de) Elektrische Vorrichtung mit Glasdichtungen enthaltenden Durchführungen.
EP0232422A4 (en) TRANSPARENT, CONDUCTIVE FILM INTEGRATED WITH POLARIZING MEMBRANE.
AU5468496A (en) An interlayer film and laminated glass using the same
EP0749105A3 (en) A sign
EP0639871A3 (en) Surface mountable electrical connector and contact clamp.
EP0229960A3 (en) Liquid level sensor
GB9325946D0 (en) Protein absorbed shapable electroconductive polymer film
TW350963B (en) Conductive reflection film and the cathode ray tube
AU8250091A (en) Translational enhancement in pseudomonas
AU111090S (en) Electrical connector