DE69425999D1 - Photodetektor mit einem mehrschichtigen Filter und Herstellungsverfahren - Google Patents

Photodetektor mit einem mehrschichtigen Filter und Herstellungsverfahren

Info

Publication number
DE69425999D1
DE69425999D1 DE69425999T DE69425999T DE69425999D1 DE 69425999 D1 DE69425999 D1 DE 69425999D1 DE 69425999 T DE69425999 T DE 69425999T DE 69425999 T DE69425999 T DE 69425999T DE 69425999 D1 DE69425999 D1 DE 69425999D1
Authority
DE
Germany
Prior art keywords
manufacturing process
layer filter
filter photodetector
photodetector
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69425999T
Other languages
English (en)
Other versions
DE69425999T2 (de
Inventor
Toshimasa Hamada
Tetsuya Hanamoto
Takahiro Funakoshi
Masumi Nakamichi
Masaru Iwasaki
Shohichi Katoh
Koji Miyake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69425999D1 publication Critical patent/DE69425999D1/de
Publication of DE69425999T2 publication Critical patent/DE69425999T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/28—Interference filters
    • G02B5/285—Interference filters comprising deposited thin solid films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02165—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors using interference filters, e.g. multilayer dielectric filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
DE69425999T 1993-07-01 1994-07-01 Photodetektor mit einem mehrschichtigen Filter und Herstellungsverfahren Expired - Fee Related DE69425999T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16352293A JP3242495B2 (ja) 1993-07-01 1993-07-01 多層膜フィルタ付き受光素子及びその製造方法

Publications (2)

Publication Number Publication Date
DE69425999D1 true DE69425999D1 (de) 2000-11-02
DE69425999T2 DE69425999T2 (de) 2001-03-01

Family

ID=15775474

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69425999T Expired - Fee Related DE69425999T2 (de) 1993-07-01 1994-07-01 Photodetektor mit einem mehrschichtigen Filter und Herstellungsverfahren

Country Status (4)

Country Link
US (1) US5644124A (de)
EP (1) EP0632508B1 (de)
JP (1) JP3242495B2 (de)
DE (1) DE69425999T2 (de)

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CN1125358C (zh) 1995-08-03 2003-10-22 松下电器产业株式会社 光学装置及光纤组件
US5835741A (en) * 1996-12-31 1998-11-10 Compaq Computer Corporation Bus-to-bus bridge in computer system, with fast burst memory range
DE19746089A1 (de) * 1997-10-20 1999-04-29 Forschungszentrum Juelich Gmbh Eine Filterstruktur aufweisendes Bauelement
IT1313260B1 (it) * 1999-07-28 2002-07-17 St Microelectronics Srl Dispositivo fotosensore integrato su semiconduttore e relativoprocesso di fabbricazione.
JP2001351266A (ja) * 2000-04-06 2001-12-21 Fujitsu Ltd 光ピックアップ及び光記憶装置
US6686431B2 (en) 2000-11-01 2004-02-03 Avery Dennison Corporation Optical coating having low refractive index
JP2002151729A (ja) * 2000-11-13 2002-05-24 Sony Corp 半導体装置及びその製造方法
DE10118231A1 (de) * 2001-04-11 2002-10-17 Heidenhain Gmbh Dr Johannes Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung
DE10214769A1 (de) * 2002-04-03 2003-10-16 Bosch Gmbh Robert Vorrichtung und Sensor zur Aufnahme von Lichtsignalen sowie Herstellungsverfahren
JP4154165B2 (ja) * 2002-04-05 2008-09-24 キヤノン株式会社 光電変換素子及びそれを用いた固体撮像装置、カメラ及び画像読み取り装置
US7095009B2 (en) * 2002-05-21 2006-08-22 3M Innovative Properties Company Photopic detector system and filter therefor
JP2004354735A (ja) * 2003-05-29 2004-12-16 Daishinku Corp 光線カットフィルタ
FR2860644B1 (fr) * 2003-10-06 2006-03-03 St Microelectronics Sa Composant, plaque et boitier semi-conducteur a capteur optique
JP4643202B2 (ja) * 2004-08-20 2011-03-02 日本電波工業株式会社 光学ローパスフィルタ
JP5010244B2 (ja) * 2005-12-15 2012-08-29 オンセミコンダクター・トレーディング・リミテッド 半導体装置
US7312434B1 (en) * 2006-12-26 2007-12-25 Eaton Corporation Method of filtering spectral energy
US20080180665A1 (en) * 2007-01-31 2008-07-31 Redman David J Measuring color spectra using color filter arrays
JP5301108B2 (ja) 2007-04-20 2013-09-25 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置
US20080266563A1 (en) * 2007-04-26 2008-10-30 Redman David J Measuring color using color filter arrays
JP4891841B2 (ja) * 2007-06-08 2012-03-07 浜松ホトニクス株式会社 分光モジュール
JP5094742B2 (ja) * 2007-06-08 2012-12-12 浜松ホトニクス株式会社 分光器
JP4988524B2 (ja) * 2007-11-22 2012-08-01 パナソニック株式会社 発光ダイオード照明器具
US8445299B2 (en) * 2007-12-12 2013-05-21 Newport Corporation Performance optically coated semiconductor devices and related methods of manufacture
JP2010103378A (ja) * 2008-10-24 2010-05-06 Omron Corp 光センサ
US20100163759A1 (en) * 2008-12-31 2010-07-01 Stmicroelectronics S.R.L. Radiation sensor with photodiodes being integrated on a semiconductor substrate and corresponding integration process
IT1392502B1 (it) * 2008-12-31 2012-03-09 St Microelectronics Srl Sensore comprendente almeno un fotodiodo a doppia giunzione verticale integrato su substrato semiconduttore e relativo processo di integrazione
CN202177716U (zh) * 2011-07-22 2012-03-28 浙江水晶光电科技股份有限公司 高像素影像系统用滤光片
JP6476873B2 (ja) * 2015-01-13 2019-03-06 セイコーエプソン株式会社 光検出装置、光検出モジュール及び電子機器
JP2016170114A (ja) * 2015-03-13 2016-09-23 株式会社東芝 距離測定装置及び光検出器
DE102018130510A1 (de) * 2018-11-30 2020-06-04 Vishay Semiconductor Gmbh Strahlungssensor und Herstellungsverfahren hierfür
JP7410782B2 (ja) * 2020-04-03 2024-01-10 京セラ株式会社 電磁波検出装置および検出モジュール

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JPS5068787A (de) * 1973-10-22 1975-06-09
US3996461A (en) * 1975-03-31 1976-12-07 Texas Instruments Incorporated Silicon photosensor with optical thin film filter
JPS60185901A (ja) * 1983-10-31 1985-09-21 Toppan Printing Co Ltd 固体撮像素子用色分解フイルタ−
JPS60134203A (ja) * 1983-12-23 1985-07-17 Dainippon Printing Co Ltd 色分離フイルタ
JPS6281605A (ja) * 1985-10-07 1987-04-15 Nippon Shinku Kogaku Kk 誘電体多層膜光学フイルタおよびその製造方法
US4827118A (en) * 1986-07-10 1989-05-02 Minolta Camera Kabushiki Kaisha Light-sensitive device having color filter and manufacturing method thereof
JPS63144306A (ja) * 1986-12-08 1988-06-16 Toshiba Corp 誘電体多層膜及びその製造方法
JPH01188806A (ja) * 1988-01-22 1989-07-28 Nippon Telegr & Teleph Corp <Ntt> 多層膜フィルタ付き受光器およびその製造方法
JPH0642582B2 (ja) * 1988-06-27 1994-06-01 シャープ株式会社 誘電体多層被覆膜
US4925259A (en) * 1988-10-20 1990-05-15 The United States Of America As Represented By The United States Department Of Energy Multilayer optical dielectric coating
JPH02170575A (ja) * 1988-12-23 1990-07-02 Nec Corp イメージセンサ
US5144498A (en) * 1990-02-14 1992-09-01 Hewlett-Packard Company Variable wavelength light filter and sensor system
US5272332A (en) * 1990-04-11 1993-12-21 American Optical Corporation Laser discrimination device
JPH04129269A (ja) * 1990-09-20 1992-04-30 Nec Kyushu Ltd 固体撮像素子
JPH04179278A (ja) * 1990-11-13 1992-06-25 Sumitomo Electric Ind Ltd 受光素子
JP2958204B2 (ja) * 1992-06-29 1999-10-06 シャープ株式会社 受光素子

Also Published As

Publication number Publication date
DE69425999T2 (de) 2001-03-01
JPH0722630A (ja) 1995-01-24
US5644124A (en) 1997-07-01
EP0632508A3 (de) 1995-04-12
EP0632508A2 (de) 1995-01-04
JP3242495B2 (ja) 2001-12-25
EP0632508B1 (de) 2000-09-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee