FR2860644B1 - Composant, plaque et boitier semi-conducteur a capteur optique - Google Patents
Composant, plaque et boitier semi-conducteur a capteur optiqueInfo
- Publication number
- FR2860644B1 FR2860644B1 FR0311675A FR0311675A FR2860644B1 FR 2860644 B1 FR2860644 B1 FR 2860644B1 FR 0311675 A FR0311675 A FR 0311675A FR 0311675 A FR0311675 A FR 0311675A FR 2860644 B1 FR2860644 B1 FR 2860644B1
- Authority
- FR
- France
- Prior art keywords
- component
- plate
- optical sensor
- semiconductor housing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0311675A FR2860644B1 (fr) | 2003-10-06 | 2003-10-06 | Composant, plaque et boitier semi-conducteur a capteur optique |
US10/958,673 US20050103987A1 (en) | 2003-10-06 | 2004-10-05 | Semiconductor component, wafer and package having an optical sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0311675A FR2860644B1 (fr) | 2003-10-06 | 2003-10-06 | Composant, plaque et boitier semi-conducteur a capteur optique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2860644A1 FR2860644A1 (fr) | 2005-04-08 |
FR2860644B1 true FR2860644B1 (fr) | 2006-03-03 |
Family
ID=34307451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0311675A Expired - Fee Related FR2860644B1 (fr) | 2003-10-06 | 2003-10-06 | Composant, plaque et boitier semi-conducteur a capteur optique |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050103987A1 (fr) |
FR (1) | FR2860644B1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI256146B (en) * | 2005-07-21 | 2006-06-01 | Siliconware Precision Industries Co Ltd | Sensor semiconductor device and fabrication method thereof |
JP2019029525A (ja) * | 2017-07-31 | 2019-02-21 | Jsr株式会社 | 環境光センサおよび接着層形成用組成物 |
EP3637466A1 (fr) * | 2018-10-11 | 2020-04-15 | STMicroelectronics (Research & Development) Limited | Dispositif électronique comprenant une puce dotée d'un capteur optique |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4755666A (en) * | 1986-06-16 | 1988-07-05 | Sanyo Electric Co., Ltd. | Photosensor frame |
JP3017780B2 (ja) * | 1990-09-10 | 2000-03-13 | 株式会社東芝 | 電子内視鏡撮像装置 |
GB9301405D0 (en) * | 1993-01-25 | 1993-03-17 | Philips Electronics Uk Ltd | An image sensor |
JP3242495B2 (ja) * | 1993-07-01 | 2001-12-25 | シャープ株式会社 | 多層膜フィルタ付き受光素子及びその製造方法 |
WO1997010672A1 (fr) * | 1995-09-11 | 1997-03-20 | Gatan, Inc. | Dispositif d'imagerie a circuits integres de grand format a couplage optique |
JP3836235B2 (ja) * | 1997-12-25 | 2006-10-25 | 松下電器産業株式会社 | 固体撮像装置及びその製造方法 |
US6117193A (en) * | 1999-10-20 | 2000-09-12 | Amkor Technology, Inc. | Optical sensor array mounting and alignment |
US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
US6559439B1 (en) * | 1999-12-15 | 2003-05-06 | Olympus Optical Co., Ltd. | Image taking lens unit with frame member for positioning lens and substrate |
US6492699B1 (en) * | 2000-05-22 | 2002-12-10 | Amkor Technology, Inc. | Image sensor package having sealed cavity over active area |
AU2001253547A1 (en) * | 2000-05-23 | 2001-12-03 | Atmel Corporation | Integrated ic chip package for electronic image sensor die |
TW540157B (en) * | 2001-05-31 | 2003-07-01 | Konishiroku Photo Ind | CMOS image sensor |
FR2835653B1 (fr) * | 2002-02-06 | 2005-04-15 | St Microelectronics Sa | Dispositif semi-conducteur optique |
US20040113218A1 (en) * | 2002-12-16 | 2004-06-17 | Jachson Hsieh | Photosensitive assembly with a transparent layer and method for manufacturing the same |
US6930398B1 (en) * | 2004-03-24 | 2005-08-16 | United Microelectronics Corp. | Package structure for optical image sensing integrated circuits |
-
2003
- 2003-10-06 FR FR0311675A patent/FR2860644B1/fr not_active Expired - Fee Related
-
2004
- 2004-10-05 US US10/958,673 patent/US20050103987A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
FR2860644A1 (fr) | 2005-04-08 |
US20050103987A1 (en) | 2005-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20090630 |