WO2001097858A2
(en)
*
|
2000-06-20 |
2001-12-27 |
Idec Pharmaceuticals Corporation |
Cold anti-cd20 antibody/radiolabeled anti-cd22 antibody combination
|
DE10109787A1
(en)
|
2001-02-28 |
2002-10-02 |
Infineon Technologies Ag |
Digital camera with a light-sensitive sensor
|
CN1287585C
(en)
*
|
2001-08-28 |
2006-11-29 |
西门子公司 |
Scanning camera
|
US7469932B2
(en)
*
|
2001-09-13 |
2008-12-30 |
Entegris, Inc. |
Receptor for a separation module
|
JP2003116067A
(en)
*
|
2001-10-09 |
2003-04-18 |
Mitsubishi Electric Corp |
Manufacturing method for solid-state image sensing device
|
DE10150581A1
(en)
*
|
2001-10-12 |
2003-04-17 |
Schlafhorst & Co W |
yarn sensor
|
JP4033669B2
(en)
*
|
2001-12-04 |
2008-01-16 |
シャープ株式会社 |
The camera module
|
US7813634B2
(en)
*
|
2005-02-28 |
2010-10-12 |
Tessera MEMS Technologies, Inc. |
Autofocus camera
|
US7289230B2
(en)
*
|
2002-02-06 |
2007-10-30 |
Cyberoptics Semiconductors, Inc. |
Wireless substrate-like sensor
|
US20050224902A1
(en)
*
|
2002-02-06 |
2005-10-13 |
Ramsey Craig C |
Wireless substrate-like sensor
|
US20050224899A1
(en)
*
|
2002-02-06 |
2005-10-13 |
Ramsey Craig C |
Wireless substrate-like sensor
|
US20050233770A1
(en)
*
|
2002-02-06 |
2005-10-20 |
Ramsey Craig C |
Wireless substrate-like sensor
|
FR2835653B1
(en)
|
2002-02-06 |
2005-04-15 |
St Microelectronics Sa |
OPTICAL SEMICONDUCTOR DEVICE
|
US6900508B2
(en)
*
|
2002-04-16 |
2005-05-31 |
Stmicroelectronics, Inc. |
Embedded flat film molding
|
EP1357605A1
(en)
*
|
2002-04-22 |
2003-10-29 |
Scientek Corporation |
Image sensor semiconductor package with castellation
|
US6873024B1
(en)
|
2002-05-15 |
2005-03-29 |
Eastman Kodak Company |
Apparatus and method for wafer level packaging of optical imaging semiconductor devices
|
JP2004074627A
(en)
*
|
2002-08-20 |
2004-03-11 |
Ricoh Co Ltd |
Image formation apparatus
|
CN1685707A
(en)
|
2002-09-30 |
2005-10-19 |
皇家飞利浦电子股份有限公司 |
Method for assembling a camera module
|
FR2849275B1
(en)
|
2002-12-24 |
2005-04-15 |
St Microelectronics Sa |
METHOD FOR ASSEMBLING AN OPTICAL SYSTEM IN FRONT OF AN OPTICAL HOUSING
|
US6940058B2
(en)
*
|
2003-02-04 |
2005-09-06 |
Kingpak Technology, Inc. |
Injection molded image sensor module
|
US6939456B2
(en)
*
|
2003-02-04 |
2005-09-06 |
Kingpak Technology Inc. |
Miniaturized image sensor module
|
TWI302153B
(en)
|
2003-02-27 |
2008-10-21 |
Eternal Chemical Co Ltd |
Material composition for packaging photo-sensitive elements and method of using the same
|
EP1471730A1
(en)
*
|
2003-03-31 |
2004-10-27 |
Dialog Semiconductor GmbH |
Miniature camera module
|
KR100545133B1
(en)
*
|
2003-04-28 |
2006-01-24 |
주식회사 스마텍 |
Package structure and sensor module using package structure
|
FR2854496B1
(en)
*
|
2003-04-29 |
2005-09-16 |
St Microelectronics Sa |
SEMICONDUCTOR HOUSING
|
FR2854498B1
(en)
|
2003-04-29 |
2005-09-16 |
St Microelectronics Sa |
OPTICAL SENSOR SEMICONDUCTOR HOUSING INSERTING INSIDE AN OBJECT.
|
CN100350621C
(en)
*
|
2003-06-03 |
2007-11-21 |
胜开科技股份有限公司 |
Image sensor mould set and producing method thereof
|
US6934065B2
(en)
*
|
2003-09-18 |
2005-08-23 |
Micron Technology, Inc. |
Microelectronic devices and methods for packaging microelectronic devices
|
US7570439B2
(en)
*
|
2003-09-26 |
2009-08-04 |
Siemens Aktiengesellschaft |
Optical module and optical system
|
FR2860644B1
(en)
*
|
2003-10-06 |
2006-03-03 |
St Microelectronics Sa |
COMPONENT, PLATE AND SEMICONDUCTOR HOUSING WITH OPTICAL SENSOR
|
JP3993862B2
(en)
|
2003-10-10 |
2007-10-17 |
松下電器産業株式会社 |
Optical device and manufacturing method thereof
|
FR2861217B1
(en)
*
|
2003-10-21 |
2006-03-17 |
St Microelectronics Sa |
OPTICAL DEVICE FOR OPTICAL SEMICONDUCTOR HOUSING AND METHOD OF MANUFACTURING THE SAME
|
JP2005148254A
(en)
*
|
2003-11-13 |
2005-06-09 |
Canon Inc |
Lens holder, aligner, and device production method
|
US7583862B2
(en)
*
|
2003-11-26 |
2009-09-01 |
Aptina Imaging Corporation |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
|
US7773143B2
(en)
*
|
2004-04-08 |
2010-08-10 |
Tessera North America, Inc. |
Thin color camera having sub-pixel resolution
|
US8724006B2
(en)
*
|
2004-01-26 |
2014-05-13 |
Flir Systems, Inc. |
Focal plane coding for digital imaging
|
KR100673950B1
(en)
*
|
2004-02-20 |
2007-01-24 |
삼성테크윈 주식회사 |
Image sensor module and camera module package therewith
|
US7253397B2
(en)
*
|
2004-02-23 |
2007-08-07 |
Micron Technology, Inc. |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
|
JP4181515B2
(en)
*
|
2004-02-25 |
2008-11-19 |
シャープ株式会社 |
Optical semiconductor device and electronic device using the same
|
US6956272B2
(en)
*
|
2004-03-10 |
2005-10-18 |
Micron Technology, Inc. |
Support frame for semiconductor packages
|
JP2005284147A
(en)
*
|
2004-03-30 |
2005-10-13 |
Fuji Photo Film Co Ltd |
Imaging apparatus
|
WO2008011003A2
(en)
|
2006-07-17 |
2008-01-24 |
Tessera North America, Inc. |
Camera system and associated methods
|
US8953087B2
(en)
|
2004-04-08 |
2015-02-10 |
Flir Systems Trading Belgium Bvba |
Camera system and associated methods
|
US8049806B2
(en)
*
|
2004-09-27 |
2011-11-01 |
Digitaloptics Corporation East |
Thin camera and associated methods
|
US7253957B2
(en)
*
|
2004-05-13 |
2007-08-07 |
Micron Technology, Inc. |
Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
|
US8092734B2
(en)
*
|
2004-05-13 |
2012-01-10 |
Aptina Imaging Corporation |
Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
|
JP2005347416A
(en)
*
|
2004-06-01 |
2005-12-15 |
Sharp Corp |
Solid-state imaging apparatus, semiconductor wafer, and camera module
|
US7005728B1
(en)
|
2004-06-03 |
2006-02-28 |
National Semiconductor Corporation |
Lead configuration for inline packages
|
US20050275750A1
(en)
|
2004-06-09 |
2005-12-15 |
Salman Akram |
Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
|
US7498647B2
(en)
|
2004-06-10 |
2009-03-03 |
Micron Technology, Inc. |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
|
US7262405B2
(en)
*
|
2004-06-14 |
2007-08-28 |
Micron Technology, Inc. |
Prefabricated housings for microelectronic imagers
|
US7199439B2
(en)
*
|
2004-06-14 |
2007-04-03 |
Micron Technology, Inc. |
Microelectronic imagers and methods of packaging microelectronic imagers
|
US7294897B2
(en)
*
|
2004-06-29 |
2007-11-13 |
Micron Technology, Inc. |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
|
US7232754B2
(en)
*
|
2004-06-29 |
2007-06-19 |
Micron Technology, Inc. |
Microelectronic devices and methods for forming interconnects in microelectronic devices
|
US7416913B2
(en)
*
|
2004-07-16 |
2008-08-26 |
Micron Technology, Inc. |
Methods of manufacturing microelectronic imaging units with discrete standoffs
|
US7189954B2
(en)
*
|
2004-07-19 |
2007-03-13 |
Micron Technology, Inc. |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
|
US7402453B2
(en)
*
|
2004-07-28 |
2008-07-22 |
Micron Technology, Inc. |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
|
US20060023107A1
(en)
*
|
2004-08-02 |
2006-02-02 |
Bolken Todd O |
Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers
|
US7364934B2
(en)
*
|
2004-08-10 |
2008-04-29 |
Micron Technology, Inc. |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
|
US7223626B2
(en)
*
|
2004-08-19 |
2007-05-29 |
Micron Technology, Inc. |
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
|
US7397066B2
(en)
*
|
2004-08-19 |
2008-07-08 |
Micron Technology, Inc. |
Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
|
DE102004051379A1
(en)
*
|
2004-08-23 |
2006-03-23 |
Osram Opto Semiconductors Gmbh |
Device for an optoelectronic component and component with an optoelectronic component and a device
|
US7115961B2
(en)
*
|
2004-08-24 |
2006-10-03 |
Micron Technology, Inc. |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
|
US7429494B2
(en)
|
2004-08-24 |
2008-09-30 |
Micron Technology, Inc. |
Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
|
US7425499B2
(en)
*
|
2004-08-24 |
2008-09-16 |
Micron Technology, Inc. |
Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
|
US7276393B2
(en)
*
|
2004-08-26 |
2007-10-02 |
Micron Technology, Inc. |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
|
US20070148807A1
(en)
*
|
2005-08-22 |
2007-06-28 |
Salman Akram |
Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
|
US7511262B2
(en)
*
|
2004-08-30 |
2009-03-31 |
Micron Technology, Inc. |
Optical device and assembly for use with imaging dies, and wafer-label imager assembly
|
US7646075B2
(en)
*
|
2004-08-31 |
2010-01-12 |
Micron Technology, Inc. |
Microelectronic imagers having front side contacts
|
US7300857B2
(en)
|
2004-09-02 |
2007-11-27 |
Micron Technology, Inc. |
Through-wafer interconnects for photoimager and memory wafers
|
EP1648181A1
(en)
*
|
2004-10-12 |
2006-04-19 |
Dialog Semiconductor GmbH |
A multiple frame grabber
|
JP4091593B2
(en)
*
|
2004-11-05 |
2008-05-28 |
Smk株式会社 |
Connection structure of camera module with autofocus function and module connector
|
US7271482B2
(en)
*
|
2004-12-30 |
2007-09-18 |
Micron Technology, Inc. |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
|
DE102005000655A1
(en)
*
|
2005-01-04 |
2006-07-13 |
Robert Bosch Gmbh |
Image capture device
|
US7262493B2
(en)
*
|
2005-01-06 |
2007-08-28 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
System and method for mounting electrical devices
|
KR100740982B1
(en)
|
2005-01-31 |
2007-07-19 |
카바스(주) |
Optical axis control system of storehouse module assembly body
|
US7214919B2
(en)
*
|
2005-02-08 |
2007-05-08 |
Micron Technology, Inc. |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
|
US7303931B2
(en)
*
|
2005-02-10 |
2007-12-04 |
Micron Technology, Inc. |
Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
|
US20060177999A1
(en)
*
|
2005-02-10 |
2006-08-10 |
Micron Technology, Inc. |
Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
|
DE102005006755A1
(en)
*
|
2005-02-15 |
2006-08-17 |
Robert Bosch Gmbh |
Method for the optical adjustment of a camera
|
US7190039B2
(en)
*
|
2005-02-18 |
2007-03-13 |
Micron Technology, Inc. |
Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
|
TWI484245B
(en)
*
|
2005-02-28 |
2015-05-11 |
Digitaloptics Corp Mems |
Autofocus camera
|
CN101142754B
(en)
*
|
2005-03-03 |
2012-07-04 |
戴尔比提兹·在线股份公司 |
Mobile telephone provided with a measuring device
|
CN100543570C
(en)
*
|
2005-06-10 |
2009-09-23 |
深圳富泰宏精密工业有限公司 |
Digital camera lens lid and preparation method thereof
|
US7795134B2
(en)
*
|
2005-06-28 |
2010-09-14 |
Micron Technology, Inc. |
Conductive interconnect structures and formation methods using supercritical fluids
|
US20060290001A1
(en)
*
|
2005-06-28 |
2006-12-28 |
Micron Technology, Inc. |
Interconnect vias and associated methods of formation
|
TW200707768A
(en)
*
|
2005-08-15 |
2007-02-16 |
Silicon Touch Tech Inc |
Sensing apparatus capable of easily selecting the light-sensing curve
|
US7262134B2
(en)
*
|
2005-09-01 |
2007-08-28 |
Micron Technology, Inc. |
Microfeature workpieces and methods for forming interconnects in microfeature workpieces
|
US7622377B2
(en)
*
|
2005-09-01 |
2009-11-24 |
Micron Technology, Inc. |
Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
|
US7288757B2
(en)
|
2005-09-01 |
2007-10-30 |
Micron Technology, Inc. |
Microelectronic imaging devices and associated methods for attaching transmissive elements
|
US7897920B2
(en)
*
|
2005-09-21 |
2011-03-01 |
Analog Devices, Inc. |
Radiation sensor device and method
|
US8476591B2
(en)
|
2005-09-21 |
2013-07-02 |
Analog Devices, Inc. |
Radiation sensor device and method
|
US7893697B2
(en)
*
|
2006-02-21 |
2011-02-22 |
Cyberoptics Semiconductor, Inc. |
Capacitive distance sensing in semiconductor processing tools
|
GB2450261A
(en)
*
|
2006-02-21 |
2008-12-17 |
Cyberoptics Semiconductor Inc |
Capacitive distance sensing in semiconductor processing tools
|
KR101294419B1
(en)
*
|
2006-03-10 |
2013-08-08 |
엘지이노텍 주식회사 |
Camera module and manufacturing method thereof
|
JP2007288755A
(en)
*
|
2006-04-14 |
2007-11-01 |
Optopac Co Ltd |
Camera module
|
US20080017940A1
(en)
*
|
2006-07-18 |
2008-01-24 |
Cheng-Chieh Yang |
Image sensing module
|
US8823933B2
(en)
|
2006-09-29 |
2014-09-02 |
Cyberoptics Corporation |
Substrate-like particle sensor
|
CN100517737C
(en)
*
|
2006-10-25 |
2009-07-22 |
鸿富锦精密工业(深圳)有限公司 |
Image sensor encapsulation structure
|
US8619378B2
(en)
|
2010-11-15 |
2013-12-31 |
DigitalOptics Corporation MEMS |
Rotational comb drive Z-stage
|
US8768157B2
(en)
|
2011-09-28 |
2014-07-01 |
DigitalOptics Corporation MEMS |
Multiple degree of freedom actuator
|
US7679167B2
(en)
*
|
2007-01-08 |
2010-03-16 |
Visera Technologies Company, Limited |
Electronic assembly for image sensor device and fabrication method thereof
|
US20080246493A1
(en)
*
|
2007-04-05 |
2008-10-09 |
Gardner Delrae H |
Semiconductor Processing System With Integrated Showerhead Distance Measuring Device
|
US20090015268A1
(en)
*
|
2007-07-13 |
2009-01-15 |
Gardner Delrae H |
Device and method for compensating a capacitive sensor measurement for variations caused by environmental conditions in a semiconductor processing environment
|
CN101349793A
(en)
*
|
2007-07-20 |
2009-01-21 |
鸿富锦精密工业(深圳)有限公司 |
Camera module group
|
EP2034718A1
(en)
*
|
2007-09-05 |
2009-03-11 |
THOMSON Licensing |
System and method for positioning and fixing an image sensor to a beamsplitter
|
CN101419323A
(en)
*
|
2007-10-22 |
2009-04-29 |
鸿富锦精密工业(深圳)有限公司 |
Mini camera module and method for producing the same
|
US7709915B2
(en)
*
|
2008-05-07 |
2010-05-04 |
Aptina Imaging Corporation |
Microelectronic devices having an EMI shield and associated systems and methods
|
US20090283665A1
(en)
*
|
2008-05-13 |
2009-11-19 |
Eastman Kodak Company |
Image sensor with an aligned optical assembly
|
US20100194465A1
(en)
*
|
2009-02-02 |
2010-08-05 |
Ali Salih |
Temperature compensated current source and method therefor
|
JP5596293B2
(en)
*
|
2009-03-03 |
2014-09-24 |
オリンパス株式会社 |
Imaging unit
|
TWI384635B
(en)
*
|
2009-04-10 |
2013-02-01 |
Capella Microsystems Corp |
Light sensing module package structure and its packaging method
|
US7959364B2
(en)
*
|
2009-05-04 |
2011-06-14 |
Tdk Taiwan Corporation |
Lens protection structure for miniature lens focusing mechanism
|
KR101032212B1
(en)
*
|
2009-09-14 |
2011-05-02 |
삼성전기주식회사 |
Camera Module, focusing method of thereof and focusing device of thereof
|
GB0920946D0
(en)
*
|
2009-11-30 |
2010-01-13 |
St Microelectronics Res & Dev |
Electromagnetic shielding for camera modules
|
TWI425825B
(en)
*
|
2009-12-31 |
2014-02-01 |
Kingpak Tech Inc |
Image sensor package structure with predetermined focus
|
KR20110135757A
(en)
*
|
2010-06-11 |
2011-12-19 |
삼성전자주식회사 |
Image sensor chip and camera module comprising the same
|
US9352962B2
(en)
|
2010-11-15 |
2016-05-31 |
DigitalOptics Corporation MEMS |
MEMS isolation structures
|
US9515579B2
(en)
|
2010-11-15 |
2016-12-06 |
Digitaloptics Corporation |
MEMS electrical contact systems and methods
|
US8547627B2
(en)
|
2010-11-15 |
2013-10-01 |
DigitalOptics Corporation MEMS |
Electrical routing
|
US8521017B2
(en)
|
2010-11-15 |
2013-08-27 |
DigitalOptics Corporation MEMS |
MEMS actuator alignment
|
US8337103B2
(en)
|
2010-11-15 |
2012-12-25 |
DigitalOptics Corporation MEMS |
Long hinge actuator snubbing
|
US8947797B2
(en)
|
2010-11-15 |
2015-02-03 |
DigitalOptics Corporation MEMS |
Miniature MEMS actuator assemblies
|
US9052567B2
(en)
|
2010-11-15 |
2015-06-09 |
DigitalOptics Corporation MEMS |
Actuator inside of motion control
|
US9061883B2
(en)
|
2010-11-15 |
2015-06-23 |
DigitalOptics Corporation MEMS |
Actuator motion control features
|
US8884381B2
(en)
|
2010-11-15 |
2014-11-11 |
DigitalOptics Corporation MEMS |
Guard trench
|
US8605375B2
(en)
|
2010-11-15 |
2013-12-10 |
DigitalOptics Corporation MEMS |
Mounting flexure contacts
|
US8358925B2
(en)
|
2010-11-15 |
2013-01-22 |
DigitalOptics Corporation MEMS |
Lens barrel with MEMS actuators
|
US8637961B2
(en)
|
2010-11-15 |
2014-01-28 |
DigitalOptics Corporation MEMS |
MEMS actuator device
|
US8608393B2
(en)
|
2010-11-15 |
2013-12-17 |
DigitalOptics Corporation MEMS |
Capillary actuator deployment
|
US8941192B2
(en)
|
2010-11-15 |
2015-01-27 |
DigitalOptics Corporation MEMS |
MEMS actuator device deployment
|
US8604663B2
(en)
|
2010-11-15 |
2013-12-10 |
DigitalOptics Corporation MEMS |
Motion controlled actuator
|
US8803256B2
(en)
|
2010-11-15 |
2014-08-12 |
DigitalOptics Corporation MEMS |
Linearly deployed actuators
|
US9019390B2
(en)
|
2011-09-28 |
2015-04-28 |
DigitalOptics Corporation MEMS |
Optical image stabilization using tangentially actuated MEMS devices
|
US8430580B2
(en)
|
2010-11-15 |
2013-04-30 |
DigitalOptics Corporation MEMS |
Rotationally deployed actuators
|
US8308379B2
(en)
|
2010-12-01 |
2012-11-13 |
Digitaloptics Corporation |
Three-pole tilt control system for camera module
|
US8855476B2
(en)
|
2011-09-28 |
2014-10-07 |
DigitalOptics Corporation MEMS |
MEMS-based optical image stabilization
|
US9281763B2
(en)
|
2011-09-28 |
2016-03-08 |
DigitalOptics Corporation MEMS |
Row and column actuator control
|
US9350271B2
(en)
|
2011-09-28 |
2016-05-24 |
DigitalOptics Corporation MEMS |
Cascaded electrostatic actuator
|
US8869625B2
(en)
|
2011-09-28 |
2014-10-28 |
DigitalOptics Corporation MEMS |
MEMS actuator/sensor
|
US8853975B2
(en)
|
2011-09-28 |
2014-10-07 |
DigitalOptics Corporation MEMS |
Electrostatic actuator control
|
US8571405B2
(en)
|
2011-09-28 |
2013-10-29 |
DigitalOptics Corporation MEMS |
Surface mount actuator
|
US8616791B2
(en)
|
2011-09-28 |
2013-12-31 |
DigitalOptics Corporation MEMS |
Rotationally deployed actuator devices
|
US9029759B2
(en)
|
2012-04-12 |
2015-05-12 |
Nan Chang O-Film Optoelectronics Technology Ltd |
Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same
|
DE102012219397A1
(en)
|
2012-07-04 |
2014-01-09 |
Robert Bosch Gmbh |
Cutting length indicator
|
US9144938B2
(en)
|
2012-08-06 |
2015-09-29 |
Apple Inc. |
Methods for attaching structures using ultraviolet and visible light curing adhesive
|
US9001268B2
(en)
|
2012-08-10 |
2015-04-07 |
Nan Chang O-Film Optoelectronics Technology Ltd |
Auto-focus camera module with flexible printed circuit extension
|
TWI575271B
(en)
*
|
2013-03-06 |
2017-03-21 |
鴻海精密工業股份有限公司 |
Optical communication module and glue dispensing method for the optical communication module
|
JP2015099262A
(en)
*
|
2013-11-19 |
2015-05-28 |
ソニー株式会社 |
Solid state image sensor, camera module and an electronic apparatus
|
JP2016057384A
(en)
*
|
2014-09-08 |
2016-04-21 |
株式会社ケンコー・トキナー |
Filter unit
|
US9576177B2
(en)
*
|
2014-12-11 |
2017-02-21 |
Fingerprint Cards Ab |
Fingerprint sensing device
|
CN105789197B
(en)
*
|
2014-12-25 |
2019-03-15 |
日月光半导体制造股份有限公司 |
Optical module, its manufacturing method and the electronic device with optical module
|
US9688453B2
(en)
*
|
2015-02-09 |
2017-06-27 |
Cisco Technology, Inc. |
Heat dissipation in hermetically-sealed packaged devices
|
US11877044B2
(en)
|
2016-02-18 |
2024-01-16 |
Ningbo Sunny Opotech Co., Ltd. |
Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof
|
US10466501B2
(en)
*
|
2016-05-26 |
2019-11-05 |
Ams Sensors Singapore Pte. Ltd. |
Optoelectronic modules including an optical system tilted with respect to a focal plane
|
CN106971984A
(en)
*
|
2016-11-23 |
2017-07-21 |
创智能科技股份有限公司 |
Fingerprint sensing recognizes encapsulating structure
|
FR3060851B1
(en)
*
|
2016-12-20 |
2018-12-07 |
3D Plus |
OPTOELECTRONIC 3D IMAGING MODULE
|
US11678445B2
(en)
|
2017-01-25 |
2023-06-13 |
Apple Inc. |
Spatial composites
|
US10171715B2
(en)
*
|
2017-01-26 |
2019-01-01 |
Asia Vital Components Co., Ltd. |
Camera module with integrated chip-on-board image sensing chip
|
CN115686136A
(en)
|
2017-03-29 |
2023-02-03 |
苹果公司 |
Device with integrated interface system
|
US20180315894A1
(en)
*
|
2017-04-26 |
2018-11-01 |
Advanced Semiconductor Engineering, Inc. |
Semiconductor device package and a method of manufacturing the same
|
CN111279287B
(en)
|
2017-09-29 |
2023-08-15 |
苹果公司 |
Multipart device housing
|
US10705570B2
(en)
|
2018-08-30 |
2020-07-07 |
Apple Inc. |
Electronic device housing with integrated antenna
|
US11258163B2
(en)
|
2018-08-30 |
2022-02-22 |
Apple Inc. |
Housing and antenna architecture for mobile device
|
CN114399014A
(en)
|
2019-04-17 |
2022-04-26 |
苹果公司 |
Wireless locatable tag
|
US11503143B2
(en)
|
2019-12-03 |
2022-11-15 |
Apple Inc. |
Handheld electronic device
|
US11528399B2
(en)
*
|
2020-03-06 |
2022-12-13 |
Apple Inc. |
Housing structure for handheld electronic device
|