TW549600U - Chip scale packaged image sensor - Google Patents

Chip scale packaged image sensor

Info

Publication number
TW549600U
TW549600U TW091217441U TW91217441U TW549600U TW 549600 U TW549600 U TW 549600U TW 091217441 U TW091217441 U TW 091217441U TW 91217441 U TW91217441 U TW 91217441U TW 549600 U TW549600 U TW 549600U
Authority
TW
Taiwan
Prior art keywords
image sensor
chip scale
packaged image
scale packaged
chip
Prior art date
Application number
TW091217441U
Other languages
Chinese (zh)
Inventor
Yi-Hua Jang
Tze-Fu Shiue
Original Assignee
Taiwan Ic Packaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Ic Packaging Corp filed Critical Taiwan Ic Packaging Corp
Priority to TW091217441U priority Critical patent/TW549600U/en
Publication of TW549600U publication Critical patent/TW549600U/en

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
TW091217441U 2002-10-31 2002-10-31 Chip scale packaged image sensor TW549600U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW091217441U TW549600U (en) 2002-10-31 2002-10-31 Chip scale packaged image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091217441U TW549600U (en) 2002-10-31 2002-10-31 Chip scale packaged image sensor

Publications (1)

Publication Number Publication Date
TW549600U true TW549600U (en) 2003-08-21

Family

ID=29998469

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091217441U TW549600U (en) 2002-10-31 2002-10-31 Chip scale packaged image sensor

Country Status (1)

Country Link
TW (1) TW549600U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807296A (en) * 2017-04-28 2018-11-13 叶秀慧 Top has the chip-packaging structure and its manufacturing method of guide-joining plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807296A (en) * 2017-04-28 2018-11-13 叶秀慧 Top has the chip-packaging structure and its manufacturing method of guide-joining plate

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model