TW529770U - Chip scale package - Google Patents

Chip scale package

Info

Publication number
TW529770U
TW529770U TW90219868U TW90219868U TW529770U TW 529770 U TW529770 U TW 529770U TW 90219868 U TW90219868 U TW 90219868U TW 90219868 U TW90219868 U TW 90219868U TW 529770 U TW529770 U TW 529770U
Authority
TW
Taiwan
Prior art keywords
chip scale
scale package
package
chip
scale
Prior art date
Application number
TW90219868U
Other languages
Chinese (zh)
Inventor
Spencer Su
Hung-Tsun Lin
Chao-Chia Chang
Original Assignee
Walsin Advanced Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walsin Advanced Electronics filed Critical Walsin Advanced Electronics
Priority to TW90219868U priority Critical patent/TW529770U/en
Publication of TW529770U publication Critical patent/TW529770U/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW90219868U 2001-11-14 2001-11-14 Chip scale package TW529770U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90219868U TW529770U (en) 2001-11-14 2001-11-14 Chip scale package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90219868U TW529770U (en) 2001-11-14 2001-11-14 Chip scale package

Publications (1)

Publication Number Publication Date
TW529770U true TW529770U (en) 2003-04-21

Family

ID=28451085

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90219868U TW529770U (en) 2001-11-14 2001-11-14 Chip scale package

Country Status (1)

Country Link
TW (1) TW529770U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7579676B2 (en) 2006-03-24 2009-08-25 Chipmos Technologies (Bermuda) Ltd. Leadless leadframe implemented in a leadframe-based BGA package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7579676B2 (en) 2006-03-24 2009-08-25 Chipmos Technologies (Bermuda) Ltd. Leadless leadframe implemented in a leadframe-based BGA package

Similar Documents

Publication Publication Date Title
SG104279A1 (en) Enhanced chip scale package for flip chips
SG91352A1 (en) Semiconductor package
EP1378007A4 (en) Plastic semiconductor package
SG104291A1 (en) Die package
AU4974500A (en) Chip scale package
HK1041777A2 (en) Package
TW540816U (en) Semiconductor package
TW529770U (en) Chip scale package
AU149513S (en) Package
TW572362U (en) Dual-face chip package
TW462536U (en) Chip package structure
GB0103884D0 (en) Package
TW539241U (en) A multi-chip package
TW582627U (en) Dual chip package
TW413399U (en) Micro chip scale package
GB0118985D0 (en) Product package
TW504042U (en) Improved structure of chip package
CA93436S (en) Chip
TW483582U (en) Chip package workpiece
TW588858U (en) Multi-chip package
TW467402U (en) Chip stack package
AU147340S (en) Package
PL347378A1 (en) Package
TW530810U (en) Anti-electrostatics package
PL112246U1 (en) Package

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model