TW539241U - A multi-chip package - Google Patents

A multi-chip package

Info

Publication number
TW539241U
TW539241U TW90203192U TW90203192U TW539241U TW 539241 U TW539241 U TW 539241U TW 90203192 U TW90203192 U TW 90203192U TW 90203192 U TW90203192 U TW 90203192U TW 539241 U TW539241 U TW 539241U
Authority
TW
Taiwan
Prior art keywords
chip package
package
chip
Prior art date
Application number
TW90203192U
Other languages
Chinese (zh)
Inventor
John Liu
Yau-Rung Li
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW90203192U priority Critical patent/TW539241U/en
Publication of TW539241U publication Critical patent/TW539241U/en

Links

TW90203192U 2001-03-01 2001-03-01 A multi-chip package TW539241U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90203192U TW539241U (en) 2001-03-01 2001-03-01 A multi-chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90203192U TW539241U (en) 2001-03-01 2001-03-01 A multi-chip package

Publications (1)

Publication Number Publication Date
TW539241U true TW539241U (en) 2003-06-21

Family

ID=29546823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90203192U TW539241U (en) 2001-03-01 2001-03-01 A multi-chip package

Country Status (1)

Country Link
TW (1) TW539241U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8021921B2 (en) 2002-10-25 2011-09-20 Megica Corporation Method of joining chips utilizing copper pillar
US8294279B2 (en) 2005-01-25 2012-10-23 Megica Corporation Chip package with dam bar restricting flow of underfill

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8021921B2 (en) 2002-10-25 2011-09-20 Megica Corporation Method of joining chips utilizing copper pillar
US8421222B2 (en) 2002-10-25 2013-04-16 Megica Corporation Chip package having a chip combined with a substrate via a copper pillar
US8294279B2 (en) 2005-01-25 2012-10-23 Megica Corporation Chip package with dam bar restricting flow of underfill

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees