TW539241U - A multi-chip package - Google Patents
A multi-chip packageInfo
- Publication number
- TW539241U TW539241U TW90203192U TW90203192U TW539241U TW 539241 U TW539241 U TW 539241U TW 90203192 U TW90203192 U TW 90203192U TW 90203192 U TW90203192 U TW 90203192U TW 539241 U TW539241 U TW 539241U
- Authority
- TW
- Taiwan
- Prior art keywords
- chip package
- package
- chip
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90203192U TW539241U (en) | 2001-03-01 | 2001-03-01 | A multi-chip package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90203192U TW539241U (en) | 2001-03-01 | 2001-03-01 | A multi-chip package |
Publications (1)
Publication Number | Publication Date |
---|---|
TW539241U true TW539241U (en) | 2003-06-21 |
Family
ID=29546823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90203192U TW539241U (en) | 2001-03-01 | 2001-03-01 | A multi-chip package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW539241U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8021921B2 (en) | 2002-10-25 | 2011-09-20 | Megica Corporation | Method of joining chips utilizing copper pillar |
US8294279B2 (en) | 2005-01-25 | 2012-10-23 | Megica Corporation | Chip package with dam bar restricting flow of underfill |
-
2001
- 2001-03-01 TW TW90203192U patent/TW539241U/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8021921B2 (en) | 2002-10-25 | 2011-09-20 | Megica Corporation | Method of joining chips utilizing copper pillar |
US8421222B2 (en) | 2002-10-25 | 2013-04-16 | Megica Corporation | Chip package having a chip combined with a substrate via a copper pillar |
US8294279B2 (en) | 2005-01-25 | 2012-10-23 | Megica Corporation | Chip package with dam bar restricting flow of underfill |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |