TW580194U - Semiconductor build-up package - Google Patents

Semiconductor build-up package

Info

Publication number
TW580194U
TW580194U TW90220924U TW90220924U TW580194U TW 580194 U TW580194 U TW 580194U TW 90220924 U TW90220924 U TW 90220924U TW 90220924 U TW90220924 U TW 90220924U TW 580194 U TW580194 U TW 580194U
Authority
TW
Taiwan
Prior art keywords
package
semiconductor build
build
semiconductor
Prior art date
Application number
TW90220924U
Other languages
Chinese (zh)
Inventor
Kun-Ching Chen
Yi-Chuan Ding
In-De Ou
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW90220924U priority Critical patent/TW580194U/en
Publication of TW580194U publication Critical patent/TW580194U/en

Links

TW90220924U 2001-11-29 2001-11-29 Semiconductor build-up package TW580194U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90220924U TW580194U (en) 2001-11-29 2001-11-29 Semiconductor build-up package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90220924U TW580194U (en) 2001-11-29 2001-11-29 Semiconductor build-up package

Publications (1)

Publication Number Publication Date
TW580194U true TW580194U (en) 2004-03-11

Family

ID=32924051

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90220924U TW580194U (en) 2001-11-29 2001-11-29 Semiconductor build-up package

Country Status (1)

Country Link
TW (1) TW580194U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8232192B2 (en) 2004-05-05 2012-07-31 Megica Corporation Process of bonding circuitry components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8232192B2 (en) 2004-05-05 2012-07-31 Megica Corporation Process of bonding circuitry components

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Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model