TW580194U - Semiconductor build-up package - Google Patents
Semiconductor build-up packageInfo
- Publication number
- TW580194U TW580194U TW90220924U TW90220924U TW580194U TW 580194 U TW580194 U TW 580194U TW 90220924 U TW90220924 U TW 90220924U TW 90220924 U TW90220924 U TW 90220924U TW 580194 U TW580194 U TW 580194U
- Authority
- TW
- Taiwan
- Prior art keywords
- package
- semiconductor build
- build
- semiconductor
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90220924U TW580194U (en) | 2001-11-29 | 2001-11-29 | Semiconductor build-up package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90220924U TW580194U (en) | 2001-11-29 | 2001-11-29 | Semiconductor build-up package |
Publications (1)
Publication Number | Publication Date |
---|---|
TW580194U true TW580194U (en) | 2004-03-11 |
Family
ID=32924051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90220924U TW580194U (en) | 2001-11-29 | 2001-11-29 | Semiconductor build-up package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW580194U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8232192B2 (en) | 2004-05-05 | 2012-07-31 | Megica Corporation | Process of bonding circuitry components |
-
2001
- 2001-11-29 TW TW90220924U patent/TW580194U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8232192B2 (en) | 2004-05-05 | 2012-07-31 | Megica Corporation | Process of bonding circuitry components |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |