TW551712U - Socket for semiconductor package - Google Patents
Socket for semiconductor packageInfo
- Publication number
- TW551712U TW551712U TW91209098U TW91209098U TW551712U TW 551712 U TW551712 U TW 551712U TW 91209098 U TW91209098 U TW 91209098U TW 91209098 U TW91209098 U TW 91209098U TW 551712 U TW551712 U TW 551712U
- Authority
- TW
- Taiwan
- Prior art keywords
- socket
- semiconductor package
- package
- semiconductor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001185322A JP4615151B2 (en) | 2001-06-19 | 2001-06-19 | Socket for semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
TW551712U true TW551712U (en) | 2003-09-01 |
Family
ID=19024922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW91209098U TW551712U (en) | 2001-06-19 | 2002-06-18 | Socket for semiconductor package |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4615151B2 (en) |
CN (1) | CN1244147C (en) |
TW (1) | TW551712U (en) |
WO (1) | WO2002103372A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3942936B2 (en) * | 2002-04-09 | 2007-07-11 | 株式会社エンプラス | Socket for electrical parts |
CN100427225C (en) * | 2005-04-07 | 2008-10-22 | 力成科技股份有限公司 | Universal alternation kit for testing classifier of ball grade package |
US7172450B1 (en) * | 2006-01-11 | 2007-02-06 | Qualitau, Inc. | High temperature open ended zero insertion force (ZIF) test socket |
JP2012109081A (en) * | 2010-11-16 | 2012-06-07 | Yamaichi Electronics Co Ltd | Socket for semiconductor device |
US8808010B2 (en) * | 2011-06-06 | 2014-08-19 | Interconnect Devices, Inc. | Insulated metal socket |
KR101585182B1 (en) * | 2014-04-28 | 2016-01-14 | 황동원 | Socket device for testing an IC |
US9832899B1 (en) * | 2016-04-27 | 2017-11-28 | Alcatel Lucent | Side clamping BGA socket |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5419710A (en) * | 1994-06-10 | 1995-05-30 | Pfaff; Wayne K. | Mounting apparatus for ball grid array device |
US6069481A (en) * | 1995-10-31 | 2000-05-30 | Advantest Corporation | Socket for measuring a ball grid array semiconductor |
JP3745060B2 (en) * | 1996-12-09 | 2006-02-15 | 日本テキサス・インスツルメンツ株式会社 | socket |
JPH10293158A (en) * | 1997-04-18 | 1998-11-04 | Advantest Corp | Ic testing device |
TW421333U (en) * | 1999-02-24 | 2001-02-01 | Hung Rung Fang | IC socket |
JP3257994B2 (en) * | 1999-08-30 | 2002-02-18 | 日本テキサス・インスツルメンツ株式会社 | socket |
JP3619413B2 (en) * | 2000-01-18 | 2005-02-09 | 株式会社エンプラス | Socket for electrical parts |
-
2001
- 2001-06-19 JP JP2001185322A patent/JP4615151B2/en not_active Expired - Fee Related
-
2002
- 2002-06-13 WO PCT/US2002/018815 patent/WO2002103372A1/en active Application Filing
- 2002-06-13 CN CN 02812054 patent/CN1244147C/en not_active Expired - Fee Related
- 2002-06-18 TW TW91209098U patent/TW551712U/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2002103372A1 (en) | 2002-12-27 |
CN1244147C (en) | 2006-03-01 |
CN1529817A (en) | 2004-09-15 |
JP4615151B2 (en) | 2011-01-19 |
JP2003007415A (en) | 2003-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |