JP2003007415A - Socket for semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for a semiconductor package, in which a test or an evaluation of the semiconductor package is capable of being carried out rapidly. SOLUTION: This socket for the semiconductor package has a plurality of solder balls arranged in a grid state on the bottom face. The socket is provided with a plurality of contacts arranged in the grid state corresponding to the arrangement of the respective solder balls having the first and the second contact pieces capable of coming into contact with the respective solder balls in a form of pinching them from their both sides, with a socket main body mounted by the respective contacts, and with a boarding plate made to be moved between the boarding position of the semiconductor package the respective solder balls of the semiconductor package are boarded without coming into contact with the first as well as the second contact pieces and the contact position where the respective solder balls of the boarded semiconductor package is capable of coming into contact with the first as well as the second contact pieces.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package socket having a plurality of solder balls arranged in a grid pattern.

[0002]

2. Description of the Related Art Conventionally, as a semiconductor package socket having a plurality of solder balls arranged in a grid pattern, one shown in FIG. 13 is known. The test evaluation socket 300 includes the solder balls S of the semiconductor package 350.
The plurality of contacts 301 ... Arranged in a grid pattern corresponding to the above arrangement, the socket body 302 equipped with each contact 301, and the mounting plate 303 on which the semiconductor package 350 is mounted are provided. Each contact 30
The first and second contact pieces 304, 305 which can contact the tip of the solder ball S in a form of being sandwiched from both sides thereof.
Is provided.

An opening 306 is formed in the socket 300 having the above structure.
When the semiconductor package 350 is inserted via the solder ball S, the solder ball S of the semiconductor package 350 is positioned between the first contact piece 304 and the second contact piece 305, and the slider 306 is moved upward in the drawing, the slider 306 is moved. The inclined portions 306a and 306b provided on the side surfaces of the first and second contact pieces 304 and 305 contact the inclined portions 304a and 305a, respectively. Thereby, the first and second contact pieces 3
04 and 305 are displaced in a direction in which they are close to each other, and contact the solder ball S in a form of being sandwiched from both sides.

[0004]

DISCLOSURE OF THE INVENTION Socket 3 having the above configuration
In No. 00, since the tips of the first and second contact pieces 304 and 305 reach the upper surface (mounting surface) of the mounting plate 303, the solder balls S contact each other when the semiconductor package 350 is inserted. The solder balls S are caught by the first contact pieces 304, 305, for example.
There is a problem that it is difficult to position it between the second contact piece and the second contact piece. This problem is particularly remarkable in an IC package in which solder balls are arranged in a narrow pitch and a full grid.

The above problem is caused by the solder balls S and the first and second contact pieces 30 when the semiconductor package 350 is inserted.
It can be solved if 4,305 and 4305 correspond accurately,
Since it takes a considerable working time to make such an accurate correspondence, there arises another problem that it is difficult to quickly test or evaluate the semiconductor package.

An object of the present invention is to allow the solder balls to be quickly positioned between the first contact piece and the second contact piece when inserting the semiconductor package, and to rapidly perform the test or evaluation of the semiconductor package. A possible object is to provide a semiconductor package socket.

[0007]

In order to solve the above-mentioned problems, the present invention provides a semiconductor package socket having a plurality of solder balls arranged in a grid pattern on its bottom surface.
A plurality of contacts having first and second contact pieces arranged in a grid corresponding to the arrangement of the solder balls and capable of coming into contact with the solder balls in a sandwiched manner from both sides thereof, and a socket equipped with the contacts. The main body, a semiconductor package mounting position where each solder ball of the semiconductor package is mounted without contacting the first and second contact pieces, and each solder ball of the mounted semiconductor package is the first contact The mounting plate is configured to be moved between a piece and a contact position that can contact the second contact piece.

According to this structure, each solder ball of the semiconductor package can be mounted at the semiconductor package mounting position without coming into contact with the first and second contact pieces. Therefore, when inserting the semiconductor package, the first
Moreover, the solder ball can be quickly positioned between the first contact piece and the second contact piece without being caught by the second contact piece, and the semiconductor package can be quickly tested or evaluated.

The semiconductor package mounting position is located in the height direction of the socket body (that is, the semiconductor package socket) from the first and second contact pieces by at least a length dimension corresponding to the diameter dimension of the solder ball. Set to a position away from. With this configuration, the solder balls do not come into contact with the first and second contact pieces when mounting the semiconductor package.

The semiconductor package socket has a socket cover movable in the height direction of the socket body (that is, the semiconductor package socket) with respect to the socket body, and the socket cover is interlocked with the movement of the socket cover. The mounting plate, the socket body between the semiconductor package mounting position and the contact position (that is,
And a moving means for moving the semiconductor package socket in the height direction. If you do this,
The socket cover can be moved by a known mechanical device or the like, and the test or evaluation of the semiconductor package can be automated.

The semiconductor package socket may include fixing means for fixing the semiconductor package to the mounting plate in association with the movement of the socket cover. By doing so, it is possible to prevent the semiconductor package from being lifted, so that it is possible to obtain more stable contact.

In the semiconductor package socket, the first and second sockets are interlocked with the movement of the socket cover.
Displacement means for displacing the contact piece may be provided. This makes it possible to move the socket cover by a known mechanical device or the like to displace the first and second contact pieces between the contact position and the non-contact position with respect to the solder ball. Or the assessment can be automated.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor package socket (hereinafter simply referred to as a socket) which is an embodiment of the present invention will be described below with reference to the drawings.

1, 3 and 4 are front views of the socket according to the present invention. 2, 5, and 6 are side views of the socket according to the present invention. FIG. 7 shows the mounting plate 13 and each contact 11 located at the semiconductor package mounting position.
It is a figure for demonstrating the positional relationship with. FIG. 8 is a diagram for explaining the positional relationship between the mounting plate 13 located at the contact position and each contact 11.

As shown in FIGS. 1 and 2, the socket 10
Is a socket for test evaluation of a semiconductor package 50 having a plurality of solder balls S ... Arranged in a grid on the bottom surface, and a plurality of contacts 11 ... And a socket body equipped with each of the contacts 11. 12, a mounting plate (also referred to as an adapter) 13 on which the semiconductor package 50 is mounted, and a slider 14.

The socket 10 has a slider lifting mechanism 20 for moving the slider 14 in the height direction of the socket 10 (vertical direction in FIG. 1, hereinafter referred to as vertical direction).
And the semiconductor package 5 mounted on the mounting plate 13.
0 is fixed to the plate 13 and a fixing mechanism 30 for moving the mounting plate 13 in association with the movement of the socket cover 21. The fixing mechanism 30 mainly corresponds to the moving means and the fixing means of the present invention, and the slider elevating mechanism 20 mainly corresponds to the displacing means of the present invention.

The contacts 11 are arranged in a grid pattern corresponding to the arrangement of the solder balls S. Each contact 1
As shown in FIGS. 1 and 7, reference numeral 1 denotes a contact base portion 11c formed of a press-punched conductive metal plate and fixed to the socket body 12, and the contact base portion 11c.
It has first and second contact pieces 11a and 11b that extend upward from the tip of c via the inclined portions 11d and 11e and can contact each solder ball S in a form of being sandwiched from both sides thereof.

Inclined portions 11d and 11e of each contact 11
The slider 14 moves upward in the height direction of the socket 10 (upward in FIG. 7, hereinafter referred to as “upper”).
The inclined portions 14a and 14b provided on the contact portion abut on each other to displace the first contact portion 11a and the second contact portion 11b in a direction in which they approach each other (see FIG. 8). As a result, the first and second contact pieces 11a and 11b come into contact with the solder balls S of the semiconductor package 50 mounted on the mounting plate 13 in such a manner as to be sandwiched from both sides thereof.

Since the contact 11 has elasticity, when the slider 14 moves downward and the contact with the contact 11 is released, the first and second contact pieces 11 are released.
The a and 11b return to their original shapes (see FIG. 7). The distance between the first contact piece 11a and the second contact piece 11b at the time of this return is
It is set to be slightly larger than the diameter of the solder ball S.

The mounting plate 13 is used for the semiconductor package 5
0 of each solder ball S corresponds to the first and second contact pieces 11a,
The semiconductor package mounting position (the position of the mounting plate 13 shown in FIGS. 1 and 7) on which the semiconductor package is mounted without contacting 11b and the solder balls S of the mounted semiconductor package 50 are the first contact pieces 11a. And a contact position where the second contact piece 11b can be contacted (the mounting plate 13 shown in FIGS. 3 and 8).
Position).

As shown in FIG. 7, the semiconductor package mounting position is located at a position separated from the tips of the first and second contact pieces 11a and 11b by at least a length dimension H1 corresponding to the diameter dimension of the solder ball S. Is set to. With this configuration, the semiconductor package 50 can be mounted without the solder balls S coming into contact with the first and second contact pieces 11a and 11b of the contacts 11.

The mounting plate 13 is formed in a substantially rectangular plate shape in a plan view, and the semiconductor package 50 is formed on the upper surface thereof.
A mounting surface 13a on which the is mounted is provided. At the four corners of the bottom surface of the mounting plate 13, leg portions 13f provided with engaging claws 13b at their tips are formed so as to be symmetrical with respect to the center lines C1 and C2 of the socket 10, respectively. Each engaging claw 13b is engaged with four vertically extending grooves 12a formed in the inner wall of the socket body 12, and guides the moving direction of the mounting plate 13 with respect to the socket body 12. .

A spring (not shown) is axially arranged between the mounting plate 13 and the socket body 12 (vertical direction in FIG. 1).
It is arranged in a contracted state. The mounting plate 13 is
It is pushed up by the force of the spring to return to its original shape and moves upward. When the mounting plate 13 moves upward by a predetermined amount, the engaging claws 13b move to the socket body 1.
Since it abuts on the upper end surface of the groove 12a formed in 2, the mounting plate 13 is stopped from further upward movement and stopped. This stop position is the semiconductor package mounting position.

At the four corners of the upper surface of the mounting plate 13, semiconductor package guiding portions 13c for guiding the semiconductor package 50 inserted from above the socket 10 to the mounting surface 13a are provided. Semiconductor package guiding unit 13
In c, the mounting surface 1 of the mounting plate 13 is arranged so that the semiconductor package 50 is guided to a predetermined position on the mounting surface 13a.
An inclined surface 13d inclined with respect to 3a is formed.

The semiconductor package 50 to be inserted has a mounting surface 1 whose peripheral edge extends along at least one inclined surface 13d.
Slide down towards 3a. As a result, the semiconductor package 50 is placed at a predetermined position on the placing surface 13a.

As shown in FIG. 7, the mounting plate 13 has a solder ball insertion hole 13e penetrating from the mounting surface 13a to the bottom surface and extending in the left-right direction in the figure.

The slider 14 is supported by the socket body 12 via a spring 23. The slider 14 is provided with inclined portions 14a and 14b that come into contact with the inclined portions 11d and 11e of the contact 11.

Next, the slider elevating mechanism 20 will be described. As shown in FIGS. 1 and 2, the slider lifting mechanism 20
Mainly includes the socket cover 21, the cross link 22, and
And a spring 23.

The socket cover 21 is the socket body 12.
The socket body 12 so that it can move vertically with respect to
Is attached to. The cross links 22 are arranged on both sides of the mounting plate 14.

The cross link 22 has a pair of crossed levers 22a and 22b. Levers 22a, 22b
The rotary shafts 22c provided at their respective ends and located at the target positions with respect to the center line C1 are inserted into the shaft holes (not shown) formed in the socket body 12, and each rotary shaft 2
It can swing around 2c.

At the end of the levers 22a and 22b, there are provided slider body pressing portions 22d at the target positions with respect to the center line C1 extending from the side surfaces in a flange shape. Each slider body pressing portion 22d abuts on the upper surface of the slider 14 and prevents further swinging of the levers 22a and 22b. At the tips of the levers 22a and 22b, arcuate sliding portions 22 located at target positions with respect to the center line C1 that slides along the inner upper surface 21a of the socket cover 21.
e is provided.

The socket cover 21 has an inner upper surface 21.
The sliding portions 22e of the levers 22a and 22b are attached to the socket main body 12 in a state of being in contact with a.

Next, the operation of the slider elevating mechanism 20 will be described with reference to FIGS.

1 and 2 show a state in which the slider 14 and the socket cover 21 are located at the upper limit position. When the socket cover 21 is pushed down from the upper limit position by a mechanical device or the like and moved downward in FIGS. 1 and 2, the sliding portions 22e of the levers 22a and 22b slide along the inner upper surface 21a of the socket cover 21. With this,
The levers 22a and 22b swing about the rotary shafts 22c, and the slider body pressing portions 22d push down the sliders 14 to move them to the lower limit position in the lower part of FIG. 3 and 5
Shows the state where the slider 14 and the socket cover 21 are located at the lower limit position. 4 and 6 show a state where the slider 14 and the socket cover 21 are located between the upper limit position and the lower limit position.

When the slider 14 moves from the upper limit position to the lower limit position, the spring 23 arranged between the slider 14 and the socket body 12 is contracted in the axial direction (vertical direction in FIG. 1). When the force applied to push down the socket cover 21 is removed, the slider 14 is pushed up by the force of the spring 23 to return to its original shape and moves to the upper limit position.

Next, the fixing mechanism 30 will be described. As shown in FIGS. 1 and 2, the fixing mechanism 30 mainly includes a pusher 31, a pusher pressing member 32, and a spring 3.
3 and 3.

The pushers 31 are arranged on both sides of the mounting plate 14. The pusher 31 has its rotating shaft 3
1a is a shaft hole formed in the socket body 12 (not shown)
And is swingable around the coaxial shaft 31a. End 31b of pusher 31 and socket body 1
A spring 33, which is contracted in the axial direction, is disposed between the spring 33 and 2.

The pusher 31 swings toward the mounting plate 13 by the force of the spring 33 to return to its original shape, and its tip 31c abuts the upper surface of the mounting plate 13 and further swings in the same direction. try to. Therefore, when the semiconductor package 50 is mounted on the mounting surface 13 a of the mounting plate 13, the semiconductor package 50 is sandwiched between the tip 31 c of the pusher 31 and the mounting plate 13. In this way, the semiconductor package 50 is fixed to the mounting plate 13.

Further, as described above, the tip 31c of the pusher 31 abuts on the mounting plate 13 (the upper surface of the semiconductor package 50 when the semiconductor package 50 is mounted) and tries to swing in the same direction. Place plate 1
3 is pushed down to lower the socket 10 in the height direction (see FIG. 7).
Move downward in the middle, below).

When the mounting plate 13 moves downward by a predetermined amount, the lower surface of the mounting plate 13 comes into contact with a protrusion (not shown) formed on the socket body 12, so that the mounting plate 1
Further downward movement of 3 is blocked and stopped. This stop position is the contact position. Further, by moving the mounting plate 13 downward, a spring (not shown) arranged between the mounting plate 13 and the socket body 12 is contracted in the axial direction.

Next, the operation of the fixing mechanism 30 will be described with reference to FIGS. 1 to 6.

FIGS. 1 and 2 show a state in which the mounting plate 13 is located at the contact position (lower limit position) and the socket cover 21 is located at the upper limit position. When the socket cover 21 is pushed down from the upper limit position by a mechanical device or the like and moved downward in FIGS. 1 and 2, the tip of the pusher pressing member 32 extending downward from the inner upper surface 21a of the socket cover 21 contacts the end 31c of the pusher 31. Contact. When the socket cover 21 is further pushed down in this state, the pusher 31 swings around the rotation shaft 31a.

As a result, the fixation of the pusher 31 to the mounting plate 13 is released, and the mounting force is applied by the force of the spring (not shown) arranged between the mounting plate 13 and the socket body 12 to return to its original shape. The plate 13 is pushed up and moved to the semiconductor package mounting position (upper limit position). Further, the swinging of the pusher 31 causes the end 31b of the pusher 31 to contract the spring 33 in the axial direction. 3 and 5 show a state in which the mounting plate 13 is located at the semiconductor package mounting position (upper limit position). 4 and 6 show the contact position (lower limit position)
And the mounting plate 13 are located between the semiconductor package mounting position (upper limit position).

When the force applied to push down the socket cover 21 is removed, the pusher 31 swings in the direction opposite to the swinging direction up to now due to the force of the spring 33 to return to its original shape. It is moved and returns to the original position.

Next, the semiconductor package 5 is attached to the socket 10.
The operation of inserting 0 will be described. 9 to 12 are views for explaining a process of inserting and mounting the semiconductor package in the semiconductor package socket according to the present invention.

As shown in FIGS. 3 and 5, when the socket cover 21 is pushed down to the lower limit position, the slider 14 is pushed down by the slider elevating mechanism 20 and moved to the lower limit position, and the contact of the slider 14 with the contact 11 is released. It Therefore, the first and second contact pieces 11a and 11b of the contact 11 return to their original shapes, and a space slightly larger than the diameter of the solder ball S is formed between the first contact piece and the second contact piece. It

Further, when the socket cover 21 is pushed down to the lower limit position, the fixing of the pusher 31 to the mounting plate 31 is released by the fixing mechanism 30, so that it is arranged between the mounting plate 13 and the socket body 12 in the drawing. The mounting plate 13 is pushed up by the action of the spring, and is moved to the semiconductor plate mounting position (upper limit position) along the groove 12a of the socket body 12.

When the semiconductor package 50 is inserted from above the socket 10 with the mounting plate 13 positioned at the semiconductor plate mounting position in this way, as shown in FIGS. 9 to 11, the peripheral edge of the semiconductor package 50 is the semiconductor. It slides down toward the mounting surface 13a along the inclined surface 13d forming the package guiding portion 13c. As a result, the solder balls S of the semiconductor package 50 are inserted into the solder ball insertion holes 13e formed in the mounting plate 13, and the semiconductor package 50 is mounted at a predetermined position on the mounting surface 13a (see FIG. 12). .

The semiconductor plate mounting position is at least the solder ball S from the first and second contact pieces 11a and 11b.
Is set at a position separated upward by a length dimension H1 corresponding to the diameter dimension of. Therefore, the semiconductor package 50
The solder ball S does not come into contact with the first and second contact pieces 11a and 11b during insertion.

Next, when the force applied to push down the socket cover 21 is removed, the pusher 31 swings toward the mounting plate 13 side by the action of the spring 33 constituting the fixing mechanism 60. Since the semiconductor package 50 is mounted on the mounting surface 13 a, the semiconductor package 50 is sandwiched between the tip 31 c of the pusher 31 and the mounting plate 13. In this way, the semiconductor package 50 is fixed to the mounting plate 13.

Further, since the tip end 31a of the pusher 31 tries to swing in the same direction even after the tip 31a of the pusher 31 comes into contact with the upper surface of the semiconductor package 50, the mounting plate 13 is pushed down and contacts the groove 12a of the socket body 12. Move to the position (lower limit position) (see FIG. 8). At the contact position, the semiconductor package 5 mounted on the mounting plate 13
The solder balls of 0 are the first contact piece 11a and the second contact piece 11a.
It will be located between b. Since the distance between the first contact piece and the second contact piece 11b is set to be slightly larger than the diameter of the solder ball S, the solder ball can be inserted relatively smoothly.

A little later than this, the slider 14 is pushed up by the slider elevating mechanism 20 and moved to the upper limit position to contact the contact 11. Specifically, the slider 1
The inclined parts 14a and 14b provided on the
Contacting the inclined portions 11d and 11e of the first contact portion 11a
And the second contact portion 11b are displaced in a direction in which they approach each other (see FIG. 8).

As a result, the first and second contact pieces 11
The a and 11b come into contact with the solder balls S of the semiconductor package 50 mounted on the mounting plate 13 located at the contact position in a manner of being sandwiched from both sides thereof.

[0054]

As described above, according to the present invention,
Provided is a socket for a semiconductor package, in which a solder ball can be quickly positioned between a first contact piece and a second contact piece when a semiconductor package is inserted, and a semiconductor package can be quickly tested or evaluated. It will be possible.

[Brief description of drawings]

FIG. 1 is a front view of a semiconductor package socket according to the present invention.

FIG. 2 is a side view of a semiconductor package socket according to the present invention.

FIG. 3 is a front view of a semiconductor package socket according to the present invention.

FIG. 4 is a front view of a semiconductor package socket according to the present invention.

FIG. 5 is a side view of a semiconductor package socket according to the present invention.

FIG. 6 is a side view of a semiconductor package socket according to the present invention.

FIG. 7 is a diagram for explaining the positional relationship between the mounting plate 13 positioned at the semiconductor package mounting position and each contact 11.

FIG. 8 is a diagram for explaining a positional relationship between a mounting plate 13 located at a contact position and each contact 11.

FIG. 9 is a view for explaining a process of inserting and mounting the semiconductor package in the semiconductor package socket according to the present invention.

FIG. 10 is a diagram for explaining a process of inserting and mounting the semiconductor package in the semiconductor package socket according to the present invention.

FIG. 11 is a view for explaining a process of inserting and mounting the semiconductor package in the semiconductor package socket according to the present invention.

FIG. 12 is a view for explaining a process of inserting and mounting the semiconductor package in the semiconductor package socket according to the present invention.

FIG. 13 is a view for explaining a problem of the conventional example of the semiconductor package socket according to the present invention.

[Explanation of symbols]

10 sockets (semiconductor package sockets) 11 contacts 11a first contact piece 11b Second contact piece 11c Contact base 11d slope 11e inclined part 12 socket body 12a groove 13 Placement plate 13a mounting surface 13b engagement claw 13c Semiconductor package induction part 13d slope 13e Solder ball insertion hole 13f leg 14 Slider 14a inclined part 14b slope 20 Slider lifting mechanism 21 Socket cover 21a Inside upper surface 22 Interlink 22a lever 22b lever 22c rotating shaft 22d slider pressing part 22e Sliding part 23 spring 30 fixing mechanism 31 pusher 31a rotating shaft 31b end 31c tip 32 Pusher pressing member 33 spring 50 semiconductor packages S Solder ball

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kiyoshi Adachi             1-5-4 Fukami Higashi, Yamato City, Kanagawa Prefecture             Inside Molex Co., Ltd. (72) Inventor Kinshige             1-5-4 Fukami Higashi, Yamato City, Kanagawa Prefecture             Inside Molex Co., Ltd. F-term (reference) 2G003 AA07 AG01 AG12 AH04                 2G011 AA16 AC14 AE22 AF02                 5E024 CA18 CA19 CB02

Claims (5)

[Claims] 1. A semiconductor package socket having a plurality of solder balls arranged in a grid on a bottom surface, the sockets being arranged in a grid corresponding to the arrangement of the solder balls, and the solder balls are arranged on both sides of the solder ball from both sides thereof. A plurality of contacts having first and second contact pieces that can contact in a sandwiched form; a socket body equipped with the contacts; and solder balls of the semiconductor package contacting the first and second contact pieces. And a mounting plate that is moved between a mounting position of a semiconductor package that is mounted without any contact and a contact position where each solder ball of the mounted semiconductor package can contact the first contact piece and the second contact piece. For semiconductor package. 2. The semiconductor package mounting position is set at a position separated from the first and second contact pieces in the height direction of the socket body by at least a length dimension corresponding to a diameter dimension of the solder ball. The socket for a semiconductor package according to claim 1, wherein: 3. A socket cover movable in the height direction of the socket body with respect to the socket body, and the mounting plate in contact with the semiconductor package mounting position in association with the movement of the socket cover. 3. The semiconductor package socket according to claim 1, further comprising a moving unit that moves the socket body in a height direction between the position and a position. 4. Interlocking with the movement of the socket cover,
The semiconductor package socket according to claim 3, further comprising fixing means for fixing the semiconductor package to the mounting plate. 5. Interlocking with the movement of the socket cover,
The semiconductor package socket according to claim 3, further comprising a displacement unit that displaces the first and second contact pieces.