JP2004063268A - Ic socket for land grid array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket for LGA that comprises a mechanism of biasing and positioning the IC package in which the IC package can be positioned precisely with a simple structure, when mounting the IC package on an IC socket. <P>SOLUTION: The IC socket comprises a base body on which a depressing member is fitted rotatably and a plurality of cylindrical contact pins are penetrated in vertical direction and fixed, a floating plate which is supported on the base body in free movement in vertical direction and has a plurality of through holes in which the top end part of the plural cylindrical contact pins are inserted, and a cover which clips the IC package between itself and the floating plate and is fitted on the base body by the depressing member. A mechanism of biasing and positioning the IC package is arranged on the floating plate. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LGA IC socket having an IC package biasing mechanism, and more particularly, to an LGA IC socket having a mechanism for biasing and positioning the IC package when the IC package is mounted on the IC socket. About.
[0002]
[Prior art]
A conventional IC socket mounting an LGA (Land Grid Array) type IC package provided with a large number of high-density bumps on one surface will be described below with reference to FIG. 4 including a positioning mechanism of the IC package. .
[0003]
FIG. 4 is a cross-sectional view of the IC socket 10 on which the IC package 6 is mounted.
[0004]
In FIG. 1, reference numeral 1 denotes a base constituting the IC socket 10, and a plurality of cylindrical contact pins 2 (also referred to as "pogo pins (registered trademark)") which are elastically deformable in a vertical direction are provided at predetermined positions. Is vertically implanted and fixed. A floating plate 4 which covers an upper portion of the cylindrical contact pin 2 protruding from the base 1 and has a through hole 4c into which the upper portion of the cylindrical contact pin 2 is inserted, is provided on the base 1. Is provided so as to be movable in the vertical (vertical) direction along the cylindrical contact pin 2 which is implanted and fixed in the vertical direction.
[0005]
The floating plate 4 is always held horizontally by a spring 5 by being elastically pressed by a stopper 3a provided at an upper end of a guide pin 3 fixed vertically to the base 1 in a vertical direction. On the upper surface of the floating plate 4, a concave portion 4 a that matches the outer shape of the IC package 6 is formed for positioning the IC package 6. The through holes 4c are all provided with depressions 4b that engage with the bumps 6a of the IC package 6, and are opened at the bottom of the recess 4a.
[0006]
Reference numeral 7 denotes a cover body that constitutes the IC socket 10. The cover body 7 engages with a holding member 8 that is rotatably provided on the base 1 so that the IC package 6 is connected to the floating plate 4. And presses the floating plate 4 downward, that is, in the direction of the base 1.
[0007]
In mounting the IC package 6 on the IC socket 10, first, the IC package 6 is removed from the recess 4 a of the floating plate 4 while the cover 7 is disengaged from the pressing member 8 and is detached from the base 1. Put on. Next, the cover 7 is placed on the IC package 6, the holding member 8 is engaged with the cover 7, and the IC package 6 is held between the cover 7 and the floating plate 4 while the floating plate 4 is held down. Press At this time, since the cylindrical contact pin 2 is movable within the through hole 4c of the floating plate 4 as described above, the tip of the cylindrical contact pin 2 engages with the recess 4b of the through hole 4c. The bump 6a.
[0008]
[Problems to be solved by the invention]
As described above, in the LGA IC socket 10, the positioning of the IC package 6 is merely provided with the concave portion 4 a corresponding to the outer shape of the IC package 6 in the floating plate 4. Therefore, regarding the processing of the concave portion 4a itself, particularly the four inner side walls, processing accuracy is required in relation to the through hole 4c. In addition, accuracy is required to properly fit the IC package 6 into the recess of the floating plate 4. In particular, in an apparatus for processing a large amount in an automatic IC package mounting machine, the accuracy is required. If the IC package 6 is slightly deviated, the IC package 6 does not enter the concave portion 4a, and the IC package 6 may be damaged.
[0009]
On the other hand, if the recess 4a has a margin, the positioning of the IC package 6 itself becomes loose, and the contact between the pad 6a of the IC package 6 and the cylindrical contact pin 2 may be deteriorated.
[0010]
The present invention solves the above-mentioned conventional problems and, when mounting an IC package on an IC socket, enables accurate positioning of the IC package with a simple structure, and is particularly suitable for an IC package automatic mounting machine. An object of the present invention is to provide an LGA IC socket having a mechanism for biasing and positioning an IC package.
[0011]
[Means to solve the problem]
In order to achieve the above object, an LGA IC socket of the present invention includes a base in which a plurality of contact pins elastically deformable in a vertical direction are vertically penetrated and fixed, and A floating plate movably supported and having a plurality of through holes into which tips of the plurality of contact pins are inserted, and a mechanism for biasing and positioning the IC package is disposed on the floating plate. It is characterized by having been done.
[0012]
The mechanism for biasing and positioning the IC package has one end fixed to the floating plate, the other end moving the IC package in the horizontal direction, and the middle portion projecting vertically upward. It is preferable to include a biasing mechanism including a curved leaf spring and a positioning mechanism having a surface orthogonal to a direction in which the IC package is moved by the other end of the leaf spring.
[0013]
Further, it is preferable that two sets of the offset mechanisms are provided on the floating plate at orthogonal positions.
[0014]
Further, a push member for moving the IC package may be provided at the other end of the leaf spring of the biasing mechanism.
[0015]
Further, the other end of the leaf spring of the biasing mechanism has a bent portion curved in a convex shape in the horizontal direction and a vertical portion extending upward, and the bent portion and the vertical portion are formed by the pressing member. May be accommodated in the hollow part formed in the fin.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a top view of the IC socket of the present invention without a cover and a holding member. FIG. 2 is a cross-sectional view of the IC socket of the present invention in a state where the cover body and the holding member are aligned, and is taken along the line AA of FIG. FIG. 3 is a drawing for explaining in detail the biasing mechanism of the IC package in the IC socket of the present invention. The same numbers as those in the conventional example of FIG. 4 indicate the same parts or configurations.
[0017]
As shown in FIGS. 1 and 2, the IC socket 10 of the present invention is substantially the same as the conventional socket shown in FIG. This is different in that the IC package shifting mechanism including the pushing members 12 and 12 'for moving the IC package is provided one by one in two orthogonal directions. Other structures are substantially the same as those of the conventional one, but a brief structure will be briefly described.
[0018]
The IC socket 10 is formed from the base 1 and the cover 7. The base 1 has a plurality of cylindrical contact pins 2 constituting contacts for electrically connecting an IC package 6 and an inspection board (not shown), which are vertically penetrated through the base 1 and implanted. A pair of pressing members 8 that are fixed and engage with the cover body are provided on a pair of opposing sides, and a floating plate 4 is provided on the upper surface. The pair of pressing members 8 are rotatably provided in the installation recesses 1b on a pair of opposite sides of the base 1, and have an engaging projection 8a that engages with the cover body 7.
[0019]
The floating plate 4 is guided movably in a vertical (vertical) direction by a guide pin 3 fixed vertically to the base 1, and is always provided at an upper end of the guide pin 3 by a spring (not shown). It is pressed horizontally by the stopper 3a. The floating plate 4 is formed with a through hole 4c which is implanted and fixed to the base 1 and into which the tips of a plurality of cylindrical contact pins 2 projecting from the base 1 are inserted. Numeral 4 is relatively movable with respect to the plurality of cylindrical contact pins 2.
[0020]
In the present embodiment, the cylindrical contact pins 2 are employed as contacts for electrically connecting the IC package 6 and the test board, but the present invention is not limited to this. That is, the contact only needs to be elastically deformable in the vertical direction as typified by the cylindrical contact pin 2 and the contact pin made of a curved leaf spring.
[0021]
Further, on the floating play 4, there are provided the two IC package shift mechanisms described above and four positioning members 13 as positioning mechanisms for finally determining the position of the IC package by the shift mechanism. The positioning of the IC package is determined by the two biasing mechanisms and the surfaces 13a and 13b of the positioning member 13 facing the two biasing mechanisms. Further, the four positioning members 13 also function as a rough positioning mechanism of the IC package when the IC package 6 is first placed on the floating plate 4.
[0022]
In addition, 1a is a cover body guiding wall formed on the base 1, 4e and 4e 'are fixing projections for fixing the leaf spring members 11, 11', and 9 is a base for fixing the base 1 to an inspection board. Bolt holes for
[0023]
The cover body 7 has an IC package pressing portion 7a, a leaf spring pressing portion 7b, and an engaging concave portion 7c which engages with an engaging convex portion 8a formed on the pressing member 8.
[0024]
Here, the IC package shifting mechanism and its operation will be described in detail with reference to FIG.
[0025]
As shown in FIGS. 3B to 3D, the distal end portion of the leaf spring member 11 includes a bent portion 11 a that is convexly curved in the horizontal direction and a vertical portion 11 b that extends vertically upward. Is formed. The intermediate portion 11c of the leaf spring member 11 is curved convexly upward in the vertical direction as shown in the figure, and is pressed downward in the vertical direction by the leaf spring pressing portion 7b of the cover body 7 as described later. And elasticity is added so that the length may be extended in the horizontal direction. The base end 11d of the leaf spring member 11 is raised vertically and fixed to a leaf spring fixing projection 4e formed on the floating plate 4.
[0026]
The pushing member 12 for moving the IC package is advanced or retracted by the expansion and contraction of the leaf spring member 11 so that the bent portion 11a and the vertical portion 11b of the distal end of the leaf spring member 11 are connected in the cavity 14 thereof. It is accommodated via a passage 14c.
[0027]
The operation of the IC package shifting mechanism will be described. FIGS. 3A and 3B are views showing a state in which the IC package 6 is roughly positioned on the floating plate 4 by being guided by the four positioning members 13, and FIG. In this figure, the IC package 6 is not shown.), (B) is a side view. In this state, when the cover body 7 is guided by the wall 1a of the base 1 and vertically lowered, the leaf spring pressing portion 7b of the cover body 7 is curved in a convex shape above the leaf spring 11. Press the intermediate portion 11c (press in the direction of arrow Z in the figure).
[0028]
As shown in FIG. 3C, the leaf spring 11 is extended, and the bent portion 11a at the distal end of the leaf spring 11 comes into contact with the front wall 14a of the hollow portion 14 of the pushing member 12 to advance the pushing member 12 (see FIG. 3C). Is moved in the direction of arrow X). Subsequently, the front surface 12a of the pressing member 12 contacts the side of the IC package 6, and moves the IC package 6 in the direction of the arrow X.
[0029]
In this embodiment, the front surface 12a of the pressing member 12 is linear when viewed from above (see FIG. 3A), but the front surface 12a is moved by simply pressing the IC package 6. Any shape may be used, such as an arc shape.
[0030]
Finally, the IC package 6 is positioned in the X direction by abutting the surface 13a of the positioning member 13 facing the IC package shifting mechanism. At the same time, the other IC package shifting mechanism operates in the same manner, and the position in the Y direction (see FIG. 1) is determined.
[0031]
Thereafter, a pressing force is further applied to the intermediate portion 11c of the leaf spring member 11 in order to make contact between the bumps of the IC package 6 and the cylindrical contact pins 2 which will be described later. Escapes upward along the front wall 14a of the cavity portion 14 to release the pressing force, so that no extra load in the X direction is applied to the IC package 6. Since the bent portion 11a and its vicinity are for releasing excessive pressing force, it is more preferable to form the bent portion 11a with a material having a smaller spring constant, that is, a softer spring member.
[0032]
Next, when the pressing force by the cover body 7 is released, the leaf spring 11 returns to its original state by its elastic force. At this time, the vertical portion 11b at the distal end of the leaf spring 11 comes into contact with the rear wall 14b of the hollow portion 14 of the pushing member 12 to retreat the pushing member 12 and return the pushing member 12 to its original position (FIG. 3 (d)).
[0033]
Returning to FIG. 2, the entire operation of mounting the IC package on the IC socket 10 will be described.
[0034]
As shown in FIG. 2A, with the cover 7 removed from the base 1, the IC package 6 is guided by the positioning member 13 and placed on the floating plate 4. Subsequently, the cover 7 is guided by the wall 1 a of the base 1 and is lowered toward the floating plate 4. At this time, first, the leaf spring pressing portions 7b and 7b 'provided on the cover body 7 are connected to the intermediate portions (convex curved portions) of the leaf springs 11 and 11' arranged on the floating plate 4 in the X and Y directions. ) Contacting 11c, 11c ', extending the leaf springs 11, 11', and advancing the pushing members 12, 12 '. As a result, the IC package 6 is pushed against the walls 13a, 13b of the positioning member 13, and X , Y direction (see FIG. 1).
[0035]
Regarding the above positioning, in the present embodiment, it is only necessary that the surfaces 13a and 13b opposed to the two leaf springs 11 and 11 'constituting the one-side moving mechanism have accurate accuracy between the surfaces 13a and 13b and the through hole 4c. That is, it is not necessary that all of the surfaces 13a, 13b, 13c, and 13d of the positioning member 13 have accuracy between the positioning member 13 and the through hole 4c. Further, in the present embodiment, since the precision on the surfaces 13c and 13d is not required, the outer shape of the IC package 6 can be shifted to a position outside the corresponding position, that is, the surfaces 13a, 13b, 13c and 13d. Can be formed into a shape slightly larger than the outer shape of the IC package 6, thereby easily and reliably guiding the IC package 6 onto the floating plate 4 when the IC package 6 is placed. It also does not require the accuracy of IC package placement in automated machines and the like.
[0036]
Thereafter, the floating plate 4 is sandwiched between the cover 7 and the floating plate 4 so that the correctly positioned bumps of the IC package 6 are brought into contact with the tips of the cylindrical contact pins 2. The cover 7 is further lowered to push it down. When the cover body 7 is lowered by a predetermined stroke, the bumps of the IC package 6 and the tips of the cylindrical contact pins 2 come into contact with each other, and the pressing member 8 formed on the base 1 is engaged with the cover body 7. Thus, the mounting of the IC package on the IC socket 10 is completed.
[0037]
The removal of the IC package 6 from the IC socket 10 is performed in a reverse operation to the above mounting. That is, by disengaging the base 1 and the cover 7 and removing the cover 7 from the floating plate 4, the IC package 6 becomes free and can be taken out from the IC socket 10.
[0038]
In the above embodiment, the cover body 7 has a separate structure from the base body 1. For example, the cover body 7 is rotatably attached to a base side different from the side of the base provided with the pair of pressing members. Alternatively, it may be provided on the side of the base opposite to the side of the base on which one pressing member is provided (a so-called clamshell type socket may be used).
[0039]
Further, the cover body 7 which is engaged with the holding member 8 and fixed to the base 1 may not be provided. In this case, the pressing of the leaf spring member 11 is performed by a pressing member provided in an automatic machine for mounting an IC package, and the pressing and fixing of the IC package 6 is performed by a pressing member similarly provided in an automatic machine. This is executed by a latch mechanism or the like that is rotated in conjunction with a cover that is moved up and down (a so-called open top socket may be used).
[0040]
【The invention's effect】
As described above, by arranging the IC socket 10 as in the present invention, it is possible to accurately position the IC package with a simple structure, and to add the vertical shifting mechanism (vertical direction) to the horizontal shifting mechanism. Since the force can be used, it can be easily applied to an automatic machine or the like.
[0041]
Further, the processing accuracy is not required as much as required for the conventional positioning mechanism. Therefore, the manufacturing cost of the IC socket including the floating plate is reduced.
[Brief description of the drawings]
FIG. 1 is a top view of an IC socket of the present invention in a state where a cover body and a holding member are removed.
FIG. 2 is a sectional view taken along line AA of FIG. 1 including a cover body and a pressing member. (A) when the IC package is placed on the floating plate, (b) when the one-side moving mechanism starts to move, (c) when the IC package is positioned, and the bumps and the cylindrical contact pins are positioned. Indicates when contact has been completed.
FIG. 3 is a drawing for explaining in detail a mechanism for shifting an IC package in an IC socket of the present invention. (A) is a top view of the mechanism, (b) is when the mechanism is free, (c) is when the mechanism is operating, and (d) is when the mechanism is free again. Indicates when the state is reached.
FIG. 4 is a sectional view of a conventional LGA IC package.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 2 Cylindrical contact pin 3 (which can be elastically deformed in the vertical direction) 3 Guide pin 4 Floating plate 4a Locating recess 4b Depression 4c Through hole 5 Spring 6 IC package 7 Cover body 7a (IC body pressing part of cover body) 7b Leaf spring pressing part 7c Engagement concave part 8 Holding member 8a Engagement convex part 9 Bolt hole 10 IC socket 11 Leaf spring member 11a Bent part (of leaf spring member) Vertical part 11c (of leaf spring member) 11c (of leaf spring member) ) Intermediate portion 11d Base end portion (of the leaf spring member) 12 Push member 12a Front surface (of the push member) 13 Positioning members 13a, 13b, 13c, 13d Surface (of the positioning member) 14 Cavity portion 14a (of the push member) (cavity) Front wall 14b (of the cavity) rear wall 14c (of the cavity) ) Communicating passage

Claims (5)

A plurality of contact pins that are elastically deformable in the vertical direction, penetrate in the vertical direction, and are fixed,
A floating plate which is supported movably in the vertical direction on the base body and has a plurality of through holes into which tips of the plurality of contact pins are inserted,
With
An LGA IC socket, wherein a mechanism for biasing and positioning the IC package is disposed on the floating plate. The mechanism for offsetting and positioning the IC package includes:
A biasing mechanism including a leaf spring having one end fixed to the floating plate, the other end moving the IC package in a horizontal direction, and an intermediate portion curved vertically upward in a convex shape;
A positioning mechanism having a surface orthogonal to a direction in which the IC package is moved by the other end of the leaf spring;
The LGA IC socket according to claim 1, further comprising: 3. The LGA IC socket according to claim 2, wherein two sets of the offset mechanisms are provided on the floating plate at orthogonal positions. 4. 4. The LGA IC socket according to claim 2, wherein a push member that moves the IC package is provided at the other end of the leaf spring of the bias mechanism. 5. The other end of the leaf spring of the bias mechanism has a bent portion curved in a convex shape in the horizontal direction, and a vertical portion extending upward.
The LGA IC socket according to claim 4, wherein the bent portion and the vertical portion are accommodated in a cavity formed in the pressing member.

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