JP2012109081A - Socket for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid interference of the electrode of a semiconductor device and the tip of the movable contact of a contact terminal reliably when the semiconductor device is attached.SOLUTION: When a cover member 12 is made to descend for a socket body 10 and approaches the socket body 10, a positioning member 14 to which a semiconductor device DV is attached is pushed up temporarily by the abutting part 26t of lever members 26, 26' for the contact part of the movable side contact piece 20m and the fixed side contact piece 20f of a contact terminal 20ai so as to be separated.

Description

  The present invention relates to a semiconductor device socket for electrically connecting a semiconductor device to be tested to a printed wiring board.

  In a semiconductor device mounted on an electronic device or the like, generally, for example, a burn-in test effective for removing an initial malfunction integrated circuit is performed in order to remove a potential defect in a stage before being mounted. This is done through a semiconductor device socket.

  The socket for a semiconductor device used for such a test is generally called an IC socket, and is arranged on a printed wiring board (test board) as disclosed in Patent Document 1, for example.

  For example, in an open top type socket, a semiconductor device socket includes a socket body having a housing portion that houses a contact actuating member, which will be described later, movably relative to a pair of movable contact portions of a contact terminal, and a semiconductor device For example, a positioning member that has a housing portion to which a BGA type (Ball Grid Array) semiconductor device is mounted, guides the semiconductor device to the housing portion, and positions the relative position of the electrode portion of the semiconductor device to the contact terminal; A contact actuating member disposed in the socket main body so as to be reciprocable along a predetermined direction and moving one movable contact portion of the contact terminal close to or away from the other movable contact portion, and manual operation by an operator Contouring force or operating force applied by the robot handler And a cover member that transmits the driving force to the contact actuating member via the drive mechanism for the actuating member.

  The socket body has an accommodating portion on the inside from which a pair of movable contact portions of a plurality of contact terminals protrude. Each contact terminal is a base-side fixed side terminal provided in the socket body corresponding to each electrode portion of the semiconductor device to be mounted, and selectively sandwiching each electrode portion of the semiconductor device coupled to the terminal, or And a pair of movable contact portions to be released. The pair of movable contact portions are close to each other in accordance with the movement of the contact actuating member, sandwich each electrode portion of the semiconductor device, or are separated from each other to release each electrode portion of the semiconductor device.

  The contact actuating member is arranged in the accommodating portion of the socket body so as to be movable along a direction substantially orthogonal to the direction of movement of the movable contact portion of each contact terminal, for example. In addition, as disclosed in Patent Document 2, the contact actuating member is also practically used in the socket main body accommodating part so as to be movable along the moving direction of the movable contact part of each contact terminal. Has been.

  The contact actuating member has openings vertically and horizontally inside from which the movable contact portions of the contact terminals protrude. Each opening in a different row is partitioned by a partition wall.

  In the contact actuating member, between the adjacent openings from which the movable contact portions of the contact terminals in the same row project, the one movable contact portion and the other movable contact portion are formed so as to partition each other. A movable contact pressing portion (referred to as a partition wall in Patent Document 1) is provided. Further, an urging member that urges the contact actuating member to return to the initial position is provided between one end of the contact actuating member and the inner peripheral part of the housing portion of the socket body.

  Further, the contact actuating member is connected to a drive mechanism including a pivotable lever member and an actuating shaft as shown in Patent Document 1. One end of the lever member of the drive mechanism is in contact with the cam surface of the cover member that is lowered.

  Thus, when the contact actuating member is moved against the urging force of the urging means by rotating one end of the lever member according to the lowering operation of the cover member, the above-mentioned movable contact pressing portion is One movable contact part and the other movable contact part of each contact terminal are moved apart from each other. On the other hand, according to the raising operation of the cover member, the contact operating member is moved to the initial position by the restoring force of the urging force of the urging means.

  The cover member is supported by the socket body so as to be movable up and down with respect to the socket body. Moreover, the cover member has an opening on the inner side so as to surround the outer periphery of the positioning member.

  In such a configuration, when the semiconductor device held by the handler of the transfer robot or the operator's finger or the like is mounted in the positioning member housing through the opening of the cover member, first, the cover member is moved by the handler of the transfer robot or the like. The semiconductor device is lowered while being lowered to the lowermost position. As a result, the contact actuating member is moved against the urging force of the urging means. At that time, with the contact actuating member held at the lowermost position, the protruding one movable contact portion and the other movable contact portion are held apart.

  Next, the semiconductor device is placed on the positioning member housing portion by dropping from a predetermined height, so that the electrode portion of the semiconductor device is connected to one movable contact portion and the other movable contact portion of each contact terminal. Positioned relative to the gap.

  When the cover member is raised in a state where each electrode of the semiconductor device is disposed between the pair of movable contact portions of each contact terminal, the contact operating member is caused by the restoring force of the urging force of the urging means. By being raised to the initial position, the movable contact pressing portion is raised, and one movable contact portion and the other movable contact portion are close to each other.

  Therefore, each electrode part of the semiconductor device is electrically connected to each contact terminal by sandwiching each electrode part of the semiconductor device between the pair of movable contact parts of each contact terminal.

JP 2004-1111215 A JP 2004-47137 A

  When the contact actuating member is held at the lowermost position as described above, when the protruding one movable contact portion and the other movable contact portion are held apart, the tips of the pair of movable contact portions The portion protrudes from the semiconductor device mounting surface of the positioning member by a predetermined length.

  In such a case, for example, when the semiconductor device is dropped on the semiconductor device mounting surface of the positioning member by an operator's manual operation, the electrode portion of the semiconductor device that is in a tilted posture is the tip of the movable contact portion. There is a possibility of interfering with the part. In particular, when the weight of the semiconductor device is relatively heavy, for example, when the semiconductor device has a heat spreader or the semiconductor device has a relatively large size in which the total number of electrodes exceeds 2200, the electrode portion of such a semiconductor device is movable. By interfering with the tip of the contact portion, the tip of the pair of movable contact portions may be deformed or damaged.

  In view of the above problems, the present invention is a socket for a semiconductor device for electrically connecting a semiconductor device to be tested to a printed wiring board, and the electrode of the semiconductor device when the semiconductor device is mounted. An object of the present invention is to provide a socket for a semiconductor device capable of reliably avoiding interference between the contact portion and the tip of the movable contact portion of the contact terminal.

  In order to achieve the above-described object, a socket for a semiconductor device according to the present invention includes a socket body including a contact terminal having a pair of contact pieces for selectively holding and electrically connecting terminals of the semiconductor device, and a socket. A pressing portion that is movably arranged on the main body and moves at least one contact piece so that one contact piece of the pair of contact pieces of the contact terminal is relatively close to or separated from the other contact piece. A contact actuating member having a contact actuating member and a contact actuating member and a pair of contact pieces of the contact terminal. A positioning member having a semiconductor device housing portion for positioning a pair of contact pieces of a contact terminal of the electrode portion; and a contact actuating member A lever member that is swingably disposed between the positioning member and moves the positioning member close to or away from the contact actuating member, and is movably supported by the socket body and is attached to and detached from the semiconductor device housing portion. When the contact operating member is operated, the pair of contact pieces of the contact terminals are brought into contact with or separated from the terminals of the semiconductor device, and when the semiconductor device is mounted on the semiconductor device housing portion, The lever member is configured to include a positioning member that accommodates the semiconductor device, and a cover member that performs an operation of separating the contact member from the contact actuating member and the contact terminal portion of the contact terminal, and then bringing the contact member into proximity. The

  According to the semiconductor device socket according to the present invention, the cover member causes the pressing portion of the contact actuating member to operate in accordance with attachment / detachment of the semiconductor device to / from the semiconductor device housing portion, and the pair of contact pieces of the contact terminal. Is placed in contact with or separated from the terminal of the semiconductor device, and when the semiconductor device is mounted on the semiconductor device housing portion, a positioning member housing the semiconductor device is placed on the lever member as a pair of the contact operating member and the contact terminal. When the semiconductor device is mounted, the semiconductor device terminals do not collide with the pair of contact pieces of the contact terminals by causing the contact piece portions to be separated from each other and then approaching each other. Interference between the electrode portion of the apparatus and the tip of the movable contact portion of the contact terminal can be avoided.

It is a fragmentary sectional view which expands and shows the principal part of an example of the socket for semiconductor devices which concerns on this invention partially. It is a top view which shows the structure in the example shown by FIG. It is sectional drawing which shows the structure in the example shown by FIG. It is sectional drawing with which it uses for operation | movement description in the example shown by FIG. It is a top view which shows the slider member used in the example shown by FIG. 1 with a lever member. It is a top view which shows the slider member used in the example shown by FIG. (A) is a perspective view which shows the lever member used in the example shown by FIG. 1, (B) is a side view in (A). It is sectional drawing with which it uses for operation | movement description in the example shown by FIG. It is sectional drawing with which it uses for operation | movement description in the example shown by FIG.

  FIG. 1 is an enlarged view of an example of a socket for a semiconductor device according to the present invention, together with a printed wiring board as a test board. In FIG. 1, one of the plurality of semiconductor device sockets arranged on the printed wiring board is shown as a representative.

  The semiconductor device sockets are respectively arranged at predetermined positions in a conductor pattern formed on the printed wiring board 18 having a predetermined plate thickness. A plated through hole group is formed at a predetermined position in the conductor pattern, to which a fixed terminal of a contact terminal, which will be described later, is fixed by soldering. In addition, a hole into which each positioning pin portion of a socket body described later is inserted is formed around the conductor pattern.

  As shown in FIGS. 1 and 2, the semiconductor device socket is arranged in a socket main body 10 fixed on the above-described printed wiring board 18 and a central contact accommodating portion in the socket main body 10, and will be described later. A plurality of contact terminals 20ai (i = 1 to n, n are positive integers) that electrically connect the conductor pattern of the printed wiring board 18 and a latch mechanism that is supported by the socket body 10 so as to be movable up and down. A cover member 12 for transmitting an operating force, a slider member 22 having a positioning member 14 for detachably housing the semiconductor device DV and positioning a relative position of the electrode portion of the semiconductor device DV with respect to a contact terminal, and a positioning member 14 The semiconductor device DV is held while pressing each electrode portion of the accommodated semiconductor device DV toward the plurality of contact terminals. And a latch mechanism comprising a Ruosae members 16A and 16B is configured to include as main components.

  A semiconductor device DV provided in such a socket for a semiconductor device is, for example, a BGA type substantially square semiconductor device having a side of about 50 mm, and a plurality of spherical electrode portions DVa exceeding about 2200 are formed vertically and horizontally. It has an electrode surface (see FIG. 8).

  The resin socket main body 10 is configured so that when a cover member 12 described later is lowered, the lower ends of the arm portions and the recesses (not shown) into which the base end portions of the pressing members 16A and 16B enter are opposed to each other. Respectively. As shown in FIG. 3, a contact housing portion in which a plurality of contact terminals 20ai are arranged corresponding to the electrode portions of the semiconductor device DV is formed in the center of the socket body 10.

  The contact accommodating portion is composed of a concave portion that opens toward the surface of the printed wiring board 18 and a plurality of cells that communicate with the concave portion and accommodate the respective contact terminals 20ai. Each cell is formed vertically and horizontally at a predetermined interval. Adjacent cells in the same row are partitioned by a partition wall 10Pai (i = 1 to n, n is a positive integer). A press-fit portion that supports the fixed portion 20B of the contact terminal 20ai on the inner wall surface is formed inside the cell. A flat surface on which a slider member 22 as a contact actuating member, which will be described later, is movably disposed is formed on the upper surface of the contact accommodating portion where the open end of the cell opens.

  The contact terminals 20ai are integrally formed by pressing with an elastic thin plate-like metal material, and extend in a direction substantially orthogonal to the surface of the printed wiring board 18 as shown in an enlarged manner in FIG. The contact terminal 20ai is soldered to a pair of the movable contact piece 20m and the fixed contact piece 20f that selectively sandwich the spherical electrode portion DVa in the semiconductor device DV and the plated through hole of the printed wiring board 18. The fixed side terminal 20C is fixed, and includes a movable side contact piece 20m, a fixed side contact piece 20f, and a fixed portion 20B that connects the fixed side terminal 20C.

  The movable side contact piece 20m has elasticity so as to be close to or separated from the fixed side contact piece 20f. At the upper ends of the movable-side contact piece 20m and the fixed-side contact piece 20f, contact portions that contact the spherical electrode portions of the semiconductor device DV are formed. Each contact portion projects through the slit 22b of the slider member 22 to a position near the pore of the positioning member 14 as shown in an enlarged manner in FIG.

  Further, in FIG. 4, when the slider member 22 is moved in the direction indicated by the arrow F, the contact portion of the movable contact piece 20m is pressed by the pressing portion 22a of the slider member 22 as indicated by a broken line, The fixed side contact piece 20f is separated from the contact portion. On the other hand, when the slider member 22 is moved in the direction indicated by the arrow R and returned from the separated position to the initial position, the contact portion of the movable contact piece 20m is close to the contact portion of the fixed contact piece 20f. I'm damned.

  The slider member 22 is moved in a direction indicated by an arrow F in FIG. 5 by a cam mechanism (not shown) according to the lowering operation of the cover member 12. The cam mechanism is configured to include a lever member and a coil spring as disclosed in Japanese Patent Application Laid-Open No. 2003-17207, for example.

  Further, as shown in an enlarged view in FIG. 3, the slider member 22 has slits 22b through which the pair of movable side contact piece portions 20m and fixed side contact piece portions 20f of the contact terminals 20ai pass vertically and horizontally. Adjacent slits 22b in the same row are partitioned by a pressing portion 22a formed inside. The slits 22b between adjacent rows are separated by a partition wall. Further, a reinforcing rib 22ra having a predetermined length and height (i = 1 to n, n is defined on the upper surface corresponding to the slits 22b between the adjacent different rows in the substantially central portion of the slider member 22. A positive integer) is formed.

  As shown in FIG. 5, the slider member 22 has legs (not shown) of a first guide post of a positioning member to be described later around a slit 22b group on a side parallel to the coordinate axis X in a mutually orthogonal coordinate system. Are inserted at two predetermined intervals along the coordinate axis X. Between the hole 22R and the hole 22R along the coordinate axis X, two holes 22H through which a hook portion (not shown) of the second guide post of the positioning member passes are formed at two predetermined intervals. The slider member 22 is supported on the upper surface portion of the contact accommodating portion so as to be able to reciprocate along the coordinate axis X.

  Grooves 22GA, 22GB, 22GC, and 22GD in which the lever members 26 and 26 'are swingably provided are formed at positions close to the outer peripheral portion and adjacent to the respective holes 22R and separated from the slit 22b group. ing.

  As shown in FIG. 6, the elongated groove 22GA includes a slope portion 22BS formed along the coordinate axis X, a flat portion 22Bf connected to one end of the slope portion 22BS, and an end portion of the flat portion 22Bf along the coordinate axis Y. It is comprised from the hollow 22Bd formed so that it may be bent.

  As shown in FIG. 3, the slope portion 22BS has a predetermined slope that slopes downward to the right. A concave portion 22Bp that receives a protrusion 26BP as a pivot point of a lever member 26 described later is formed at a boundary portion between the slope portion 22BS and the flat portion 22Bf.

  A groove 22GB formed on a common straight line facing the groove 22GA along the coordinate axis X includes a slope portion 22BS formed along the coordinate axis X, a flat portion 22Bf connected to one end of the slope portion 22BS, and a flat portion. The recess 22Bd is formed so as to be bent in the same direction as the bending direction of the recess 22Bd of the groove 22GA from the end of 22Bf along the coordinate axis Y.

  As shown in FIG. 3, the slope portion 22BS has a predetermined slope that slopes toward the lower left. At the boundary portion between the slope portion 22BS and the flat portion 22Bf, a concave portion 22Bp is formed for receiving a projection portion 26BP as a rotation fulcrum in a lever member 26 'described later.

  The groove 22GC formed to face the groove 22GB along the coordinate axis Y includes a slope portion 22BS formed along the coordinate axis X, a flat portion 22Bf connected to one end of the slope portion 22BS, and an end portion of the flat portion 22Bf. A recess 22Bd is formed along the coordinate axis Y so as to be bent in a direction opposite to the bending direction of the recess 22Bd of the grooves 22GA and 22GB.

  As shown in FIG. 3, the slope portion 22BS has a predetermined slope that slopes toward the lower left. A concave portion 22Bp that receives a protrusion 26BP as a pivot point of a lever member 26 described later is formed at a boundary portion between the slope portion 22BS and the flat portion 22Bf.

  A groove 22GD formed on a common straight line facing the groove 22GC along the coordinate axis X includes a slope portion 22BS formed along the coordinate axis X, a flat portion 22Bf connected to one end of the slope portion 22BS, and a flat portion. The recess 22Bd is formed so as to bend in the direction opposite to the bending direction of the recess 22Bd of the grooves 22GA and 22GB from the end of 22Bf along the coordinate axis Y.

  As shown in FIG. 3, the slope portion 22BS has a predetermined slope that slopes downward to the right. At the boundary portion between the slope portion 22BS and the flat portion 22Bf, a concave portion 22Bp is formed for receiving a projection portion 26BP as a rotation fulcrum in a lever member 26 'described later.

  Since the lever members 26 and 26 'have the same structure except for a guide portion described later, the lever member 26 will be described and the description of the lever member 26' will be omitted.

  The lever member 26 is disposed in the above-described grooves 22GA and 22GC, while the lever member 26 'is disposed in the above-described grooves 22GB and 22GD.

  As shown in FIGS. 7A and 7B in an enlarged manner, the lever member 26 is formed of a resin material and is formed at one end of the arm portion 26B. The arm portion 26B has a protrusion 26BP as a fulcrum. Cover member abutting portion 26UR and a guide portion 26C formed at the other end of the arm portion 26B.

  The arm portion 26B is placed on the slope portion 22BS and the flat portion 22Bf in the above-described grooves 22GA and 22GC. The protruding portion 26BP is raised by a predetermined height on the surface of the arm portion 26B placed on the groove. The protrusion 26BP is formed at a position substantially close to the cover member contact portion 26UR side.

  The cover member contact portion 26UR is formed so as to be substantially orthogonal to the central axis of the arm portion 26B in FIG. 7A and project toward the cover member 12 (ie, upward). As a result, when the cover member 12 is lowered, the tip of the cover member contact portion 26UR comes into contact with the inner peripheral surface of the cover member 12 as a force point, as shown in an enlarged manner in FIG.

  The guide part 26C is formed so as to be substantially orthogonal to one side on a common plane with respect to the central axis of the arm part 26B in FIG. As shown in FIG. 7B, one end of the guide portion 26C protrudes downward. On the same plane as the arm portion 26B in the guide portion 26C, an abutting portion 26t that abuts on a lower surface of a positioning member 14 described later is formed as an action point.

  Unlike the guide portion 26C of the lever member 26, the guide portion 26C in the lever member 26 'is substantially orthogonal to the other on the common plane with respect to the central axis of the arm portion 26B in FIG. 7A. It is formed as follows.

  The positioning member 14 mounted on the upper surface of the slider member 22 via the lever member 26 and the lever member 26 ′ accommodates the semiconductor device DV and the electrodes of the semiconductor device DV as shown in FIG. A semiconductor device housing portion 14A having a guide portion for positioning each contact portion of the contact terminal 20ai. The semiconductor device housing portion 14A has a semiconductor device mounting surface 14as that forms part of the bottom.

  As shown in FIG. 3, when the cover member 12 is spaced apart from the socket body 10 and is at the uppermost position, the movable-side contact piece 20 m of the contact terminal 20 ai and the fixed portion are fixed in the semiconductor device housing portion 14 </ b> A. A contact portion of the side contact piece 20f protrudes. On the other hand, as shown in FIG. 4, when the cover member 12 is close to the socket body 10 and is at the lowermost position, the positioning member 14 is moved by the contact portion 26 t of the guide portions 26 C of the lever members 26 and 26 ′. It is pushed up by a predetermined distance so as to be separated from the member 22, and the contact portions of the movable contact piece 20m and the fixed contact piece 20f of the contact terminal 20ai do not protrude into the semiconductor device housing portion 14A. State.

  Opening portions through which pressing members 16A and 16B, which will be described later, respectively pass, are formed in opposing wall portions forming the semiconductor device housing portion 14A.

  The cover member 12 has an opening at the center where the positioning member 14 is movably disposed. When the semiconductor device DV is attached to or detached from the positioning member 14, the semiconductor device DV passes through the opening.

  The cover member 12 has a plurality of leg portions (not shown) supported by the respective grooves formed on the outer peripheral portion of the socket body 10 so as to be movable up and down. Further, as shown in FIG. 1, the cover member 12 is provided between the spring receiving portion of the cover member 12 and the socket body 10 in the direction in which the cover member 12 is separated upward from the socket body 10. A plurality of coil springs 17 are provided. At that time, a claw provided at the tip of the leg of the cover member 12 is engaged with the end of the groove. As a result, the cover member 12 is held at the uppermost position. 1 and 3 each show a state where the cover member 12 is held at the uppermost position.

  As shown in FIG. 4, the cover member 12 has an arm portion (not shown) that presses the proximal end portions of the pressing members 16 </ b> A and 16 </ b> B constituting the latch mechanism when the cover member 12 is lowered.

  As shown in FIG. 5, the pressing members 16 </ b> A and 16 </ b> B are rotatably supported on each side parallel to the coordinate axis X in the slider member 12.

  In addition, the base end portions of the pressing members 16A and 16B are urged by coil springs (not shown) in a direction in which the semiconductor device DV mounted on the positioning member 14 is pressed by the distal end portion thereof. Thereby, the front ends of the pressing members 16A and 16B are arranged at positions above the positioning member 14. On the other hand, when the base ends of the pressing members 16A and 16B are pressed against the biasing force of the coil spring 17 by the arm portion of the cover member 12, the distal ends of the pressing members 16A and 16B are separated from the positioning member 14. And placed at a predetermined standby position.

  In such a configuration, when testing the semiconductor device DV, first, the pressing surface portion of the pressing member provided in the transport robot (not shown) is brought into contact with the upper surface of the cover member 12 to attach the coil spring 17 described above. It is pressed down to a predetermined lowermost position with a predetermined stroke in a downward direction against the force. At this time, as shown in FIG. 4, the cover member contact portion 26UR of the lever members 26 and 26 'is pushed down, so that the positioning member 14 is pushed up by a predetermined distance by the contact portion 26t.

  As a result, the pressing members 16A and 16B are separated from each other and set to the standby position. Further, for example, the semiconductor device DV as an object to be inspected is sucked and held by a transfer arm of a transfer robot (not shown) and transferred to a position directly above the opening of the cover member 12 and the positioning member 14.

  Next, the semiconductor device DV sucked and held by the transfer arm is lowered through the opening of the cover member 12 and positioned and mounted in the semiconductor device housing portion 14A of the positioning member 14.

  At this time, as shown in FIG. 8, even when the semiconductor device DV is erroneously mounted so that the posture of the semiconductor device DV dropped from a predetermined height is inclined, the electrode portion DVa of the semiconductor device DV is Since the movable contact piece 20m and the fixed contact piece 20f are spaced apart from each other by a predetermined distance, the movable contact piece 20m and the fixed contact piece 20f are not damaged.

  Further, as shown in FIG. 9, the electrode portion DVa of the semiconductor device DV dropped from a predetermined height is erroneously moved to one of the contact portions of the movable contact piece 20m and the fixed contact piece 20f of the contact terminal 20ai. Even when the semiconductor device DV is mounted so as to be biased to the side, the electrode portion DVa of the semiconductor device DV is separated by a predetermined distance from the contact portions of the movable contact piece 20m and the fixed contact piece 20f. Therefore, there is no possibility that the contact portions in the movable contact piece 20m and the fixed contact piece 20f are damaged.

  Subsequently, the cover member 12 is raised to the uppermost position by the urging force of the coil spring 17 and the like when the pressure surface portion of the pressure member is raised with the upper surface of the cover member 12 being in contact therewith. . At that time, the contact portions at the tips of the pressing members 16A and 16B are rotated at substantially the same timing, and press the semiconductor device DV toward the contact terminal 20ai. At the same time when the cover member 12 starts to rise, the cover member contact portions 26UR of the lever members 26 and 26 'are pushed up by their own weight, so that the positioning member 14 is pushed down by a predetermined distance, and then the slider is moved at a predetermined timing. Since the movement of the member 12 to the initial position is started, the electrode part DVa of the semiconductor device DV is held between the contact parts of the movable side contact piece part 20m and the fixed side contact piece part 20f.

  When an inspection signal is supplied to the input / output unit of the printed wiring board 18 with the cover member 12 maintained at the uppermost position, the inspection signal is supplied to the semiconductor device DV through the contact terminal 20ai and When a circuit abnormality is detected, an abnormality detection signal from the semiconductor device DV is supplied to an external failure diagnosis device through the input / output unit.

  In the above example, when the slider member 22 that slides on the flat surface of the upper surface portion of the contact accommodating portion is moved in a predetermined direction, the contact portion of the movable contact piece portion 20m is Although applied to a socket for a semiconductor device having a configuration that is pressed by the pressing portion 22a of the slider member 22 and separated from the contact portion of the fixed-side contact piece 20f, the present invention is not limited to such an example. As shown also in Patent Document 1, both of the pair of contact pieces are obtained by moving a moving plate including a partition wall disposed between the pair of contact pieces along the vertical direction of the socket body. It goes without saying that the present invention may be applied to a socket for a semiconductor device having a configuration in which these are moved apart from each other.

DESCRIPTION OF SYMBOLS 10 Socket main body 12 Cover member 14 Positioning member 20ai Contact terminal 22 Slider member 26, 26 'Lever member DV Semiconductor device

Claims (2)

A socket body including a contact terminal having a pair of contact pieces for selectively holding and electrically connecting terminals of a semiconductor device;
At least one of the contact pieces is disposed so as to be movable in the socket body, and one contact piece of the pair of contact pieces of the contact terminal is relatively close to or separated from the other contact piece. A contact actuating member having a pressing portion to be moved;
The contact actuating member and the contact terminal are arranged on the contact actuating member so as to be close to or separated from a pair of contact pieces, and the semiconductor device is detachably accommodated, and the contact of the electrode portion of the semiconductor device A positioning member having a semiconductor device housing for positioning the pair of contact pieces of the terminal;
A lever member that is swingably disposed between the contact actuating member and the positioning member, and moves the positioning member toward or away from the contact actuating member;
The pressing portion of the contact actuating member is operated according to attachment / detachment of the semiconductor device to / from the semiconductor device housing portion supported movably on the socket body, and the pair of contact pieces of the contact terminal are connected to the semiconductor device. The contact member is brought into contact with or separated from a terminal of the device, and when the semiconductor device is mounted in the semiconductor device housing portion, the positioning member in which the semiconductor device is housed is attached to the lever member. A cover member for performing an operation of bringing the contact terminals into contact with each other after being separated from the pair of contact pieces of the contact terminal;
A socket for a semiconductor device comprising:   The said cover member has an opening part through which the said semiconductor device attached to or detached from the semiconductor device accommodating part of the said positioning member passes, and is supported so that raising / lowering is possible with respect to the said socket main body. Socket for semiconductor devices.

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