TW584316U - A BGA package - Google Patents

A BGA package

Info

Publication number
TW584316U
TW584316U TW90211932U TW90211932U TW584316U TW 584316 U TW584316 U TW 584316U TW 90211932 U TW90211932 U TW 90211932U TW 90211932 U TW90211932 U TW 90211932U TW 584316 U TW584316 U TW 584316U
Authority
TW
Taiwan
Prior art keywords
bga package
bga
package
Prior art date
Application number
TW90211932U
Other languages
Chinese (zh)
Inventor
Jansen Chiu
James Lai
Original Assignee
Walton Advanced Electronics Lt
Walsin Advanced Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walton Advanced Electronics Lt, Walsin Advanced Electronics filed Critical Walton Advanced Electronics Lt
Priority to TW90211932U priority Critical patent/TW584316U/en
Publication of TW584316U publication Critical patent/TW584316U/en

Links

TW90211932U 2001-07-12 2001-07-12 A BGA package TW584316U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90211932U TW584316U (en) 2001-07-12 2001-07-12 A BGA package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90211932U TW584316U (en) 2001-07-12 2001-07-12 A BGA package

Publications (1)

Publication Number Publication Date
TW584316U true TW584316U (en) 2004-04-11

Family

ID=34057454

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90211932U TW584316U (en) 2001-07-12 2001-07-12 A BGA package

Country Status (1)

Country Link
TW (1) TW584316U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7579676B2 (en) 2006-03-24 2009-08-25 Chipmos Technologies (Bermuda) Ltd. Leadless leadframe implemented in a leadframe-based BGA package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7579676B2 (en) 2006-03-24 2009-08-25 Chipmos Technologies (Bermuda) Ltd. Leadless leadframe implemented in a leadframe-based BGA package

Similar Documents

Publication Publication Date Title
GB2378178B (en) Packaging
GB0123535D0 (en) A package
GB2372491B (en) Packaging
HK1041777A2 (en) Package
TW584316U (en) A BGA package
TW539241U (en) A multi-chip package
GB0319390D0 (en) A package
GB0127480D0 (en) Packaging
GB0106529D0 (en) Packaging
AU149514S (en) Package
GB0226391D0 (en) A package
AU146719S (en) A package
GB0122080D0 (en) Packaging
GB0103884D0 (en) Package
TW507938U (en) A multi-chip package without outer leads
GB2377686B (en) Packaging
TW467400U (en) Irregular BGA package structure
TW580194U (en) Semiconductor build-up package
GB0127324D0 (en) Packaging
TW588858U (en) Multi-chip package
TW530810U (en) Anti-electrostatics package
PL347378A1 (en) Package
AU147340S (en) Package
PL112246U1 (en) Package
PL112177U1 (en) Package

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees