TW471709U - Chip-stacked multi-chip package structure - Google Patents
Chip-stacked multi-chip package structureInfo
- Publication number
- TW471709U TW471709U TW90200567U TW90200567U TW471709U TW 471709 U TW471709 U TW 471709U TW 90200567 U TW90200567 U TW 90200567U TW 90200567 U TW90200567 U TW 90200567U TW 471709 U TW471709 U TW 471709U
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- package structure
- stacked multi
- chip package
- stacked
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90200567U TW471709U (en) | 2001-01-10 | 2001-01-10 | Chip-stacked multi-chip package structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90200567U TW471709U (en) | 2001-01-10 | 2001-01-10 | Chip-stacked multi-chip package structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TW471709U true TW471709U (en) | 2002-01-01 |
Family
ID=21680459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90200567U TW471709U (en) | 2001-01-10 | 2001-01-10 | Chip-stacked multi-chip package structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW471709U (en) |
-
2001
- 2001-01-10 TW TW90200567U patent/TW471709U/en not_active IP Right Cessation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |