TW471709U - Chip-stacked multi-chip package structure - Google Patents

Chip-stacked multi-chip package structure

Info

Publication number
TW471709U
TW471709U TW90200567U TW90200567U TW471709U TW 471709 U TW471709 U TW 471709U TW 90200567 U TW90200567 U TW 90200567U TW 90200567 U TW90200567 U TW 90200567U TW 471709 U TW471709 U TW 471709U
Authority
TW
Taiwan
Prior art keywords
chip
package structure
stacked multi
chip package
stacked
Prior art date
Application number
TW90200567U
Other languages
Chinese (zh)
Inventor
John Liu
Y J Lee
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW90200567U priority Critical patent/TW471709U/en
Publication of TW471709U publication Critical patent/TW471709U/en

Links

TW90200567U 2001-01-10 2001-01-10 Chip-stacked multi-chip package structure TW471709U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90200567U TW471709U (en) 2001-01-10 2001-01-10 Chip-stacked multi-chip package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90200567U TW471709U (en) 2001-01-10 2001-01-10 Chip-stacked multi-chip package structure

Publications (1)

Publication Number Publication Date
TW471709U true TW471709U (en) 2002-01-01

Family

ID=21680459

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90200567U TW471709U (en) 2001-01-10 2001-01-10 Chip-stacked multi-chip package structure

Country Status (1)

Country Link
TW (1) TW471709U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees