TW504042U - Improved structure of chip package - Google Patents

Improved structure of chip package

Info

Publication number
TW504042U
TW504042U TW90210162U TW90210162U TW504042U TW 504042 U TW504042 U TW 504042U TW 90210162 U TW90210162 U TW 90210162U TW 90210162 U TW90210162 U TW 90210162U TW 504042 U TW504042 U TW 504042U
Authority
TW
Taiwan
Prior art keywords
chip package
improved structure
improved
package
chip
Prior art date
Application number
TW90210162U
Other languages
Chinese (zh)
Inventor
Chih-Yu Ting
Original Assignee
Opcom Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Opcom Inc filed Critical Opcom Inc
Priority to TW90210162U priority Critical patent/TW504042U/en
Publication of TW504042U publication Critical patent/TW504042U/en

Links

TW90210162U 2001-06-18 2001-06-18 Improved structure of chip package TW504042U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90210162U TW504042U (en) 2001-06-18 2001-06-18 Improved structure of chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90210162U TW504042U (en) 2001-06-18 2001-06-18 Improved structure of chip package

Publications (1)

Publication Number Publication Date
TW504042U true TW504042U (en) 2002-09-21

Family

ID=27608228

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90210162U TW504042U (en) 2001-06-18 2001-06-18 Improved structure of chip package

Country Status (1)

Country Link
TW (1) TW504042U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100368869C (en) * 2003-09-19 2008-02-13 精工爱普生株式会社 Electrooptical device,flexible wiring substrate,manufacturing method of electrooptical device and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100368869C (en) * 2003-09-19 2008-02-13 精工爱普生株式会社 Electrooptical device,flexible wiring substrate,manufacturing method of electrooptical device and electronic device

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees