TW512976U - Heat sink structure of IC package - Google Patents
Heat sink structure of IC packageInfo
- Publication number
- TW512976U TW512976U TW90209902U TW90209902U TW512976U TW 512976 U TW512976 U TW 512976U TW 90209902 U TW90209902 U TW 90209902U TW 90209902 U TW90209902 U TW 90209902U TW 512976 U TW512976 U TW 512976U
- Authority
- TW
- Taiwan
- Prior art keywords
- package
- heat sink
- sink structure
- heat
- sink
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90209902U TW512976U (en) | 2001-06-13 | 2001-06-13 | Heat sink structure of IC package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90209902U TW512976U (en) | 2001-06-13 | 2001-06-13 | Heat sink structure of IC package |
Publications (1)
Publication Number | Publication Date |
---|---|
TW512976U true TW512976U (en) | 2002-12-01 |
Family
ID=27731478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90209902U TW512976U (en) | 2001-06-13 | 2001-06-13 | Heat sink structure of IC package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW512976U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI632655B (en) * | 2016-02-05 | 2018-08-11 | 萬國半導體股份有限公司 | Power semiconductor device and manufacturing method thereof |
-
2001
- 2001-06-13 TW TW90209902U patent/TW512976U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI632655B (en) * | 2016-02-05 | 2018-08-11 | 萬國半導體股份有限公司 | Power semiconductor device and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |