TW512976U - Heat sink structure of IC package - Google Patents

Heat sink structure of IC package

Info

Publication number
TW512976U
TW512976U TW90209902U TW90209902U TW512976U TW 512976 U TW512976 U TW 512976U TW 90209902 U TW90209902 U TW 90209902U TW 90209902 U TW90209902 U TW 90209902U TW 512976 U TW512976 U TW 512976U
Authority
TW
Taiwan
Prior art keywords
package
heat sink
sink structure
heat
sink
Prior art date
Application number
TW90209902U
Other languages
Chinese (zh)
Inventor
Yi-Shiou Chen
Ming-Cheng Lin
Original Assignee
Advanced Thermal Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Thermal Technologies filed Critical Advanced Thermal Technologies
Priority to TW90209902U priority Critical patent/TW512976U/en
Publication of TW512976U publication Critical patent/TW512976U/en

Links

TW90209902U 2001-06-13 2001-06-13 Heat sink structure of IC package TW512976U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90209902U TW512976U (en) 2001-06-13 2001-06-13 Heat sink structure of IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90209902U TW512976U (en) 2001-06-13 2001-06-13 Heat sink structure of IC package

Publications (1)

Publication Number Publication Date
TW512976U true TW512976U (en) 2002-12-01

Family

ID=27731478

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90209902U TW512976U (en) 2001-06-13 2001-06-13 Heat sink structure of IC package

Country Status (1)

Country Link
TW (1) TW512976U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI632655B (en) * 2016-02-05 2018-08-11 萬國半導體股份有限公司 Power semiconductor device and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI632655B (en) * 2016-02-05 2018-08-11 萬國半導體股份有限公司 Power semiconductor device and manufacturing method thereof

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees