TW581382U - Heat dissipating structure of chip - Google Patents

Heat dissipating structure of chip

Info

Publication number
TW581382U
TW581382U TW90219838U TW90219838U TW581382U TW 581382 U TW581382 U TW 581382U TW 90219838 U TW90219838 U TW 90219838U TW 90219838 U TW90219838 U TW 90219838U TW 581382 U TW581382 U TW 581382U
Authority
TW
Taiwan
Prior art keywords
chip
heat dissipating
dissipating structure
heat
dissipating
Prior art date
Application number
TW90219838U
Other languages
Chinese (zh)
Inventor
Ming-Cheng Lin
Jr-Tsung Hu
Original Assignee
Advanced Thermal Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Thermal Technologies filed Critical Advanced Thermal Technologies
Priority to TW90219838U priority Critical patent/TW581382U/en
Publication of TW581382U publication Critical patent/TW581382U/en

Links

TW90219838U 2001-11-16 2001-11-16 Heat dissipating structure of chip TW581382U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90219838U TW581382U (en) 2001-11-16 2001-11-16 Heat dissipating structure of chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90219838U TW581382U (en) 2001-11-16 2001-11-16 Heat dissipating structure of chip

Publications (1)

Publication Number Publication Date
TW581382U true TW581382U (en) 2004-03-21

Family

ID=32924047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90219838U TW581382U (en) 2001-11-16 2001-11-16 Heat dissipating structure of chip

Country Status (1)

Country Link
TW (1) TW581382U (en)

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees