TW532510U - Improved heat dissipation structure of CPU - Google Patents

Improved heat dissipation structure of CPU

Info

Publication number
TW532510U
TW532510U TW90220204U TW90220204U TW532510U TW 532510 U TW532510 U TW 532510U TW 90220204 U TW90220204 U TW 90220204U TW 90220204 U TW90220204 U TW 90220204U TW 532510 U TW532510 U TW 532510U
Authority
TW
Taiwan
Prior art keywords
cpu
heat dissipation
dissipation structure
improved heat
improved
Prior art date
Application number
TW90220204U
Other languages
Chinese (zh)
Inventor
Ching-Lin Jou
Original Assignee
Topower Computer Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topower Computer Ind Co Ltd filed Critical Topower Computer Ind Co Ltd
Priority to TW90220204U priority Critical patent/TW532510U/en
Publication of TW532510U publication Critical patent/TW532510U/en

Links

TW90220204U 2001-11-20 2001-11-20 Improved heat dissipation structure of CPU TW532510U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90220204U TW532510U (en) 2001-11-20 2001-11-20 Improved heat dissipation structure of CPU

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90220204U TW532510U (en) 2001-11-20 2001-11-20 Improved heat dissipation structure of CPU

Publications (1)

Publication Number Publication Date
TW532510U true TW532510U (en) 2003-05-11

Family

ID=28788295

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90220204U TW532510U (en) 2001-11-20 2001-11-20 Improved heat dissipation structure of CPU

Country Status (1)

Country Link
TW (1) TW532510U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees