TW556879U - Improved heat sink structure of CPU - Google Patents

Improved heat sink structure of CPU

Info

Publication number
TW556879U
TW556879U TW90216287U TW90216287U TW556879U TW 556879 U TW556879 U TW 556879U TW 90216287 U TW90216287 U TW 90216287U TW 90216287 U TW90216287 U TW 90216287U TW 556879 U TW556879 U TW 556879U
Authority
TW
Taiwan
Prior art keywords
cpu
heat sink
improved heat
sink structure
improved
Prior art date
Application number
TW90216287U
Other languages
Chinese (zh)
Inventor
Miau-Neng Su
Original Assignee
Iwill Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwill Corp filed Critical Iwill Corp
Priority to TW90216287U priority Critical patent/TW556879U/en
Publication of TW556879U publication Critical patent/TW556879U/en

Links

TW90216287U 2001-09-24 2001-09-24 Improved heat sink structure of CPU TW556879U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90216287U TW556879U (en) 2001-09-24 2001-09-24 Improved heat sink structure of CPU

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90216287U TW556879U (en) 2001-09-24 2001-09-24 Improved heat sink structure of CPU

Publications (1)

Publication Number Publication Date
TW556879U true TW556879U (en) 2003-10-01

Family

ID=32294595

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90216287U TW556879U (en) 2001-09-24 2001-09-24 Improved heat sink structure of CPU

Country Status (1)

Country Link
TW (1) TW556879U (en)

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