TWI384635B - Light sensing module package structure and its packaging method - Google Patents

Description

Light sensing module packaging structure and packaging method thereof

The invention relates to a light sensing module package structure and a packaging method thereof, in particular to a package structure in which a light emitting component and a light sensing component are integrated in the same module.

At present, light sensing components have been widely used in daily life, for example, using light sensing components to detect ambient light to determine the turn on/turn off of the light emitting device, and the combined application can achieve power saving effect. Or use a proximity sensor in combination with a light-emitting diode to detect whether the foreign object is close, or to further detect the distance between the foreign object and the approaching sensor. This application is commonly used in handheld devices. The device determines whether the face of the user is close to determine the opening and closing of the screen. The above applications can make life more convenient, or further improve the efficiency of the use of electronic devices.

However, in the prior art, the light sensing element and the light emitting element are separately disposed in the electronic device, which causes the complexity of the circuit and mechanism of the manufacturer to design the electronic device. Therefore, some manufacturers have packaged the light-emitting element and the light-sensing element in the same module. As shown in FIG. 1, it is a first exemplary side view of the light sensing module package structure of the prior art. In the figure, the light sensing module package structure comprises a substrate 11, a light sensing component 12, a light emitting component 13, a light transmissive cap 20 and an isolation wall. The substrate has a first recess 14 and a second recess 15 , and the light sensing element 12 is disposed in the first recess 14 , and the light emitting component 13 is disposed in the second recess 15 . The light-transmissive top cover 20 is disposed on the upper surface of the substrate 11 . Since the light-transmitting top cover 20 interface may reflect the light emitted by the light-emitting element 13 to cause noise light, the spacer 22 needs to be disposed on the substrate 11 and the transparent top cover 20 . Between the light sensing element 12 and the light emitting element 13, the spacer 22 blocks the noise light reflected by the transparent cover 20.

However, when the surfaces of the grooves are all at the same height, the optical sensing module package structure of the prior art is inevitably mechanically tolerated during manufacture, and the spacer is not easily adhered to the package, such as the second. As shown in the figure, the light emitted by the light-emitting element 13 is leaked to the light sensing element 12 at the bottom of the spacer 22, causing misdetection.

In view of the above problems of the prior art, one of the objects of the present invention is to provide a light sensing module package structure and a packaging method thereof to improve the usability.

One of the objectives of the present invention is to provide a light sensing module package structure and a packaging method thereof to reduce the complexity of the circuit and mechanism of the electronic device using the light sensing module.

According to the above object of the present invention, a light sensing module package structure includes a substrate, a light sensing component and a light emitting component. The substrate has a first recess and a second recess, and the upper surface of the second sidewall of the second recess is higher than the upper surface of the first sidewall of the first recess, and the inner surface of the second recess is There is a reflective layer or a photoresist layer, and the light sensing component is disposed in the first recess, and the light emitting component is disposed in the second recess.

The material of the substrate is an opaque material or a light absorbing material.

Wherein, the reflective layer or the photoresist layer is located on the inner side or the bottom surface of the second groove.

The light sensing module package structure further comprises a transparent top cover and an isolation wall, the transparent cover covers the substrate, and the isolation system is located on the substrate and the transparent cover Between, and between the light sensing element and the light emitting element.

According to the above object of the present invention, a method for packaging a light sensing module is provided, which comprises the following steps. First, a substrate having a first recess and a second recess is provided, and the upper surface of the second sidewall of the second recess is higher than the upper surface of the first sidewall of the first recess, and then in the second recess a portion of the surface of the trench or a photoresist or a light reflecting layer. Finally, a light sensing element is disposed in the first recess, and a light emitting component is disposed in the second recess.

The material of the substrate is an opaque material or a light absorbing material.

Wherein, the packaging method further comprises: providing a transparent top cover to cover the substrate, and providing a spacer between the substrate and the transparent cover, and between the light sensing component and the light emitting component.

Please refer to FIG. 3A, FIG. 3B and FIG. 5 . FIG. 3A is a plan view of the first embodiment of the optical sensing module package structure of the present invention, and FIG. 3B is a cross-sectional line AA of FIG. 3A. 'Sectional side view. Fig. 5 is a perspective view showing a first embodiment of the package structure of the light sensing module of the present invention. In the figure, the light sensing module package structure comprises a substrate 31, a light sensing component 32 and a light emitting component 33.

The substrate has a first recess 34 and a second recess 35. The second sidewall upper surface 351 of the second recess 35 is higher than the first sidewall upper surface 341 of the first recess 34. A thin layer 36 may be further disposed on a portion of the surface of the second recess 35. The thin layer 36 may be a reflective layer or a photoresist layer to enhance the effect of light reflection or photoresist.

For example, a reflective material such as gold or a gold alloy, copper or copper alloy, aluminum or aluminum alloy, silver or a silver alloy may be coated on the inner or bottom surface of the second groove 35 to form the thin layer 36. The thin layer 36 can reflect the light emitted by the light-emitting element 33 to be directed to the outside of the light-sensing module package structure and block the side or bottom from leaking light to the light-sensing element. The light-emitting element 33 is disposed in the second recess 35, preferably a light-emitting diode, particularly a light-emitting diode that emits non-visible light.

The light sensing component 32 is disposed in the first recess 34 for sensing a light beam and converting the energy of the light beam into electrical energy to generate an electrical signal representative of the light intensity, such as a voltage signal or a current signal. Then, the electrical signal is transmitted to the external circuit through the connection line 39 for signal processing. The light sensing element 32 can be used to detect ambient light or as a proximity sensor for sensing the reflected light of the light emitted by the light-emitting element 33 being reflected by a foreign object.

In the first embodiment of the present invention, after the light sensing element 32 and the light emitting element 33 are respectively disposed on the first groove 34 and the second groove 35, the light sensing element 32 and the light emitting element 33 may be coated with a light transmissive material. To form the protective layer 38, the protective layer 38 can prevent the light sensing element 32 and the light emitting element 33 from being damaged by dust or moisture.

The material of the substrate 31 is preferably an opaque material or a light absorbing material. The opaque material contains ceramic or plastic, and the absorbing material contains non-reflective black paint or black material to reduce the proportion of light reflection. The light sensing element 32 and the light emitting element 33 are disposed in different recesses to prevent the light sensing element 32 from directly receiving the light emitted by the light emitting element 33.

Please refer to FIG. 4, which is a side view of the first embodiment of the light sensing module package structure of the present invention combined with the cover. The difference between the first embodiment and the first embodiment is that in the second embodiment, the light sensing module package structure further comprises a light transmissive top cover 40 and a first isolation wall 42 (isolation). Wall). The light transmissive top cover 40 covers the substrate 31. The light-transmissive top cover 40 reflects the light emitted by the light-emitting element 33 to form noise light, causing interference of the light-sensing element 32 to cause misjudgment. Light reflected by the thin layer 36 may also form noise light causing interference from the light sensing element 32. Therefore, the first spacer 42 needs to be disposed between the substrate 31 and the light-transmitting top cover 40 and between the light sensing element 32 and the light-emitting element 33. Thereby, the first spacer 42 can block the noise light reflected by the transparent cover 40 and the noise light reflected by the thin layer 36, thereby avoiding the interference of the light sensing component 32.

According to this first embodiment of the present invention, even if the first spacer 42 may have a mechanical tolerance during the manufacturing process, there may be a gap d, d in each direction of the first spacer 42 and the substrate 31 after assembly. ', d'. At this time, the second sidewall upper surface 351 of the second recess 35 can shield the noise light reflected by the transparent cover 40 or the noise reflected by the thin layer 36, thereby avoiding In addition, the second sidewall upper surface 351 of the second recess 35 may also serve as an alignment of the first spacer 42 as needed, and the alignment function allows the first spacer 42 to be used. The setting position is more flexible, and can have a setting tolerance of directional displacement such as d, d', d", etc., without strictly requiring the edge of the second groove 35 to be aligned when the package is required.

Please refer to Figures 7A, 7B and 8. 7A is a top view of a second embodiment of the light sensing module package structure of the present invention. Fig. 7B is a cross-sectional side view taken along line BB' in Fig. 7A. Figure 8 is a second embodiment of the optical sensing module package structure of the present invention. The difference between the side view and the first embodiment is the first embodiment of the light sensing module package structure of the second embodiment. The groove 34 is spaced apart from the second groove 35, and the spaced portion thereof forms a third groove 70. The sidewall upper edge 741 of one of the first recesses 34 is higher than the sidewall upper edge 751 of the second recess 35. As such, the sidewall upper edge 741 of the first recess 34 can further block the light emitted by the light-emitting element 33 from entering the first recess 34 to affect the light sensing component 32.

In the actual manufacturing, the second embodiment can also be formed by forming a first groove 34, a second groove 35 and a third groove 70 on the substrate 31, wherein the third groove 70 is located at the A light sensing element 32 is disposed in the first groove 34 and a light emitting element 33 is disposed in the second groove 35. The effect of blocking the light emitted by the light-emitting element can be achieved by the arrangement of the upper edge 741 of the sidewall of the first recess 34 being higher than the upper edge 751 of the sidewall of the second recess 35.

Further, as shown in FIG. 8, the second embodiment can effectively make the position of the first spacer 42 more elastic than the first embodiment, and can have directions such as d, d', d", and the like. The tolerance of the displacement setting is such that the edge of the first groove 34 or the second groove 35 is aligned when the package is not strictly required.

Please refer to FIG. 6 , which is a flow chart of the implementation steps of the packaging method of the light sensing module of the present invention. In the figure, this encapsulation method consists of the following steps. In step S1, a substrate having a first recess and a second recess is provided, and an upper surface of the second sidewall of the second recess is higher than an upper surface of the first sidewall of the first recess. Among them, a method of forming a groove on a substrate is well known to those skilled in the art, and thus will not be described herein. The substrate can be made of an opaque material or a light absorbing material. The opaque material contains ceramic or plastic, and the absorbing material contains non-reflective black paint or black material to reduce the proportion of light reflection. In step S2, a reflective layer or a photoresist layer may be further formed on a portion of the surface of the second recess to enhance the effect of light reflection or photoresist. In step S3, a light sensing element and a light emitting element are respectively disposed in the first groove and the second groove.

In step S4, a transparent top cover is disposed to cover the substrate, and an isolation wall is disposed between the substrate and the transparent cover, and between the light sensing element and the light emitting element. Wherein, the spacer can be aligned according to the sidewall of the second recess.

In addition, the packaging method may further include spacing the first groove and the second groove as needed, and the spacing portion forms a third groove. The upper edge of one of the first grooves is higher than the upper edge of one of the second grooves. In this way, the effect of blocking the noise light emitted by the light-emitting element can be achieved, and the position of the spacer is made more flexible.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

11. . . Substrate

12. . . Light sensing component

13. . . Light-emitting element

14. . . First groove

15. . . Second groove

20. . . Light-transmissive top cover

twenty two. . . Isolator

31. . . Substrate

32. . . Light sensing component

33. . . Light-emitting element

34. . . First groove

341. . . First side surface

35. . . Second groove

351. . . Second side surface

36. . . Thin layer

38. . . The protective layer

39. . . Cable

40. . . Light-transmissive top cover

42. . . First spacer

70. . . Third groove

741, 751. . . Upper edge of the side wall

AA’, BB’. . . Section line

as well as

d, d', d"... gap

S1, S2, S3, S4. . . step

1 is a first exemplary side view of a light sensing module package structure of the prior art;

2 is a second exemplary side view of a light sensing module package structure of the prior art;

3A is a plan view showing a first embodiment of the light sensing module package structure of the present invention;

3B is a cross-sectional side view of the light sensing module package structure of the present invention along section line AA' of FIG. 3A;

4 is a side view of the first embodiment of the light sensing module package structure of the present invention combined with the cover;

Figure 5 is a 3D diagram of the package of the light sensing module of the present invention;

Figure 6 is a flow chart showing the steps of the packaging method of the light sensing module of the present invention;

7A is a plan view showing a second embodiment of the light sensing module package structure of the present invention;

7B is a cross-sectional side view of the light sensing module package structure of the present invention along a section line BB' of FIG. 7A;

Figure 8 is a side view of the second embodiment of the light sensing module package structure of the present invention in combination with the cover.

31. . . Substrate

32. . . Light sensing component

33. . . Light-emitting element

34. . . First groove

341. . . First side surface

35. . . Second groove

351. . . Second side surface

36. . . Thin layer

38. . . The protective layer

40. . . Light-transmissive top cover

42. . . First spacer

as well as

d, d', d"... gap

Claims (22)

A light sensing module package structure includes: a substrate having a first recess and a second recess, and a second sidewall of the second recess is higher than the first recess a first sidewall upper surface; a light sensing component disposed in the first recess; and a light emitting component disposed in the second recess. A light sensing module package structure includes: a substrate having a first groove, a second groove and a third groove, wherein the third groove is located in the first groove and the second groove And the upper surface of the first side wall of the first groove is higher than the upper surface of the second side wall of the second groove; a light sensing element is disposed on the first groove; and a light is emitted The component is disposed in the second groove. The light sensing module package structure of claim 1 or 2, wherein a portion of the second recess is further provided with a photoresist layer or a light reflecting layer. The light sensing module package structure of claim 1 or 2, wherein the light sensing component is a proximity sensor for sensing light emitted by the light emitting component. Reflected light reflected by a foreign object. The light sensing module package structure according to claim 1 or 2, wherein the light emitting element is a light emitting diode. The light sensing module package structure according to claim 1 or 2, wherein the material of the substrate is an opaque material. The light sensing module package structure according to claim 6, wherein the opaque material comprises ceramic or plastic. The light sensing module package structure according to claim 1 or 2, wherein the material of the substrate is a light absorbing material. The light sensing module package structure of claim 8, wherein the light absorbing material comprises a non-reflective black paint or a black material. The optical sensing module package structure of claim 1, further comprising a transparent cover and an isolation wall, the transparent cover covering the substrate, the isolation system is located Between the substrate and the light transmissive top cover, and between the light sensing element and the light emitting element. The optical sensing module package structure of claim 2, further comprising a transparent cover and an isolation wall, the transparent cover covering the substrate, the isolation system is located Between the substrate and the light transmissive top cover, and above the third recess. A method for packaging a light sensing module, comprising the steps of: providing a substrate, the substrate having a first groove and a second groove, and a second sidewall of the second groove is higher than the first surface a concave upper surface of the first groove sidewall; a light sensing element disposed on the first groove; and a light emitting element disposed on the second groove. The method of packaging a light sensing module according to claim 12, further comprising the step of forming a photoresist layer or a light reflecting layer on a portion of the surface of the second recess. The method of packaging a light sensing module according to claim 12, wherein the light sensing component is a proximity sensor for sensing light emitted by the light emitting component. The reflected light reflected by the object. The method of packaging a light sensing module according to claim 12, wherein the light emitting element is a light emitting diode. The method for packaging a light sensing module according to claim 12, wherein the material of the substrate is an opaque material. The method for packaging a light sensing module according to claim 16, wherein the opaque material comprises ceramic or plastic. The method for packaging a light sensing module according to claim 12, wherein the material of the substrate is a light absorbing material. The method for packaging a light sensing module according to claim 18, wherein the light absorbing material comprises a non-reflective black paint or a black material. The method for packaging a light sensing module according to claim 12, further comprising providing a transparent cover to cover the substrate. The method for packaging a light sensing module according to claim 20, further comprising: providing an isolation wall between the substrate and the transparent cover, and the light sensing element and the light emitting Between components. The method for packaging a light sensing module according to claim 21, wherein the isolation wall is aligned with the upper surface of the first side wall or the upper surface of the second side wall. Settings.