201037850 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種光感測模組封裝結構及其封裝方法，特 別是有關於一種整合發光元件及光感測元件於同一模組之封裝社 構。 、。 【先前技術】 〇 目前’光感測元件已經普遍應用於曰常生活中，例如使用光 感測元件來偵測環境光以決定發光裝置的啟閉(tum on/tum 0均，此 結合應用可達到節省耗電的功效；或是使用趨近感應器㈣獅以 sensor)與發光二極體結合應用，以偵測外物是否接近，或進一步 偵測外物與趨近感應器之間的距離，此應用普遍應用於手持式裝 置以判斷使用者的臉部是否靠近來決定螢幕的啟閉。而上述應用 可讓生活更便利，或是進一步提高電子裝置的使用效率。 然而，在習知技藝中’光感測元件及發光元件係分開設置於 〇 電此舉造成朗輯t+裝路及機翻複雜度 提高。因此，亦有廠商將發光元件與光感測元件封裝於同一模組 中，如第1圖所示，其係為習知技藝之光感測模組封裝結構的第1 示例側視圖。圖中，光感測模組封裝結構包含一基板11、一光感 測元件12、一發光元件13、一透光頂蓋2〇及一隔離體22(is〇lati〇n wall)。基板具有一第一凹槽14及一第二凹槽15，而光感測元件 12係設置於第一凹槽14中，發光元件13係設置於第二凹槽15 中。透光頂蓋20係覆蓋於基板u上方，由於透光頂蓋2〇介面可 能會反射發光元件13所發出的光造成雜訊光，因此需要將隔離體 201037850 22設置於基板11及透光頂蓋2〇之間，以及光感測元件ι2及發光 元件13之間，隔離體22可擋住透光頂蓋20所反射的雜訊光。 然而，當上述凹槽的表面皆相同高度時，習知技藝之光感測 模組封裝結構在製造時難免有機械公差(Mechanical划沉⑽⑻存 在，造成隔離體不易與封裝體密合，如第2圖所示，使得發光元 件13所發出的光會於隔離體22底部漏到光感測元件I)而造成誤 測。 【發明内容】 有鑑於上述習知技藝之問題，本發明之其中一目的就是在提 供種光感測模組封裝結構及其封裝方法，以提高使用便利性。 本發明之其中一目的就是在提供一種光感測模組封裝結構及 其封裝方法，以降低使用此光感測模組的電子裝置之電路及機構 的複雜度。 八根據上述本發明之目的，提出一種光感測模組封裝結構，包 =了基板、一光感測元件及一發光元件。基板具有一第一凹槽及 第一凹槽，且第二凹槽之第二側壁上表面係高於第一凹槽之第 :侧壁上表面，而第二凹槽之部分内表面上可具有—反射層或— 光P、’邑層，而光感測元件係設置於第一凹槽，發光元件係設 第二凹槽。 、 其中，基板之材料係為不透光材質或吸光材質。 其中’反射層或光阻絕層係位於第二凹槽之内側或底表面。 "中，此光感測模組封裝結構於應用時更包含一透光頂蓋及 201037850 一隔離體(isolation wall) ’此透光頂蓋係覆蓋於基板，而此隔離體 係位於基板及透光頂蓋之間，以及光感測元件及發光元件之間。 根據上述本發明之目的，提出一種光感測模組之封裝方法， 包含下列步驟。首先，提供一具有一第一凹槽及一第二凹槽的基 板，且第二凹槽之第二側壁上表面係高於該第一凹槽之第一側壁 上表面，接著在第二凹槽之部分表面或一光阻絕層或一光反射 層。最後，設置一光感測元件於第一凹槽，設置一發光元件於第 二凹槽。 ❸ 其中，基板之材料係為不透光材質或吸光材質。 其中，此封裝方法於實際應用時更包含設置一透光頂蓋覆蓋 基板，並設置一此隔離體於基板及透光頂蓋之間，以及光感測元 件及發光元件之間。 【實施方式】 請參閱第3A圖、第3B圖及第5圖，第3A圖為本發明之光 ❹感測模組封裝結構之第1實施例俯視圖，而第3B圖係為第3A圖 中沿著剖面線AA，的剖面侧視圖。第5圖為本發明之光感測模組 2裝結構之第1實施例立體圖。圖巾，光制模組封裝結構包含 一基板31、一光感測元件32及一發光元件33。 基，具有-第-凹槽34及一第二凹槽35，其中，第二凹槽 35之第二侧壁上表面351係高於第一凹槽％之第一側壁上表: 第一凹槽35之部分表面上可進一步設置一薄層36，此薄層 可為一反射層或一光阻絕層，以增強光反射或光阻絕之效果。 列如，可在第二凹槽35的内側或底表面塗佈(⑺的反射材質，例如 5 201037850 金或金合金、銅或銅合金、鋁或鋁合金、銀或銀合金以形成此薄 層36°騎36可反祕光元件33所發出的光使其射向光感測模 組封裝結構的外部並阻絕側部或底部漏光至光感測元件。發光元 件33係設置於第二凹槽35中，較佳的是發光二極體，特別是可 發出非可見光的發光二極體。 光感測元件32係設置於第一凹槽34中，用以感側一光束， 並將光束的能量轉為電能，以產生一代表光強度的電性訊號，例 如電壓訊號或電流訊號。接著，再透過連接線39將此電性訊號傳 送至外部電路進行訊號處理。光感測元件32可用以偵測環境光， 或是作為一趨近感應器(proximity sens〇r)，用以感應發光元件33 所發出的光被一外物反射的反射光。 在本發明第1實施例中’光感測元件32及發光元件33分別 設置於第一凹槽34及第二凹槽35後，可使用透光材質包覆光感 測元件32及發光元件33以形成保護層38，此保護層38可避免光 感測元件32及發光元件33受到灰塵或水氣影響而損害。 其中’基板31之材料較佳為不透光材質或吸光材質。不透光 材質包含陶瓷(Ceramic)或塑料，而吸光材質包含不反光黑色塗料 或黑材質，以降低光反射的比例。光感測元件及發光元件 置於不同的凹槽的設置方式，可避免光感測元件32直接接收到發 光元件33所發出的光。 請續參閱第4圖，其係為本發明之光感測模組封裝結構的第1 實施例結合蓋體之侧視圖。在此第1實施例與第丨實施例之差異 在於在第2實施例中，光感測模組封裝結構更包含裝配有一透光 頂蓋 40 及一第一隔離體(is〇iati〇n wau)42(is〇lation wall)。透光頂蓋 201037850 40係覆蓋於基板31上方。透光頂蓋40會反射發光元件33所發出 的光而形成雜訊光，造成光感測元件32之干擾而導致誤判。而由 薄層36所反射的光亦可能形成雜訊光而造成光感測元件幻之干 擾。因此需要將第一隔離體42設置於基板31及透光頂蓋4〇之間， 以及光感測元件32及發光元件33之間。藉此，第一隔離體42可 擋住透光頂蓋40所反射的雜訊光及由薄層36所反射的雜訊光， 進而避免光感測元件32之干擾。 根據本發明此第1實施例，即使第一隔離體42在製造過程中 可能有機械公差(Mechanical Toleranee)存在，造成組裝後第一隔離 體42與基板31之各方向可能會有間隙d、d，、d”。此時，第二凹 槽35較高的第二側壁上表面351可遮蔽由透光頂蓋初所反射的 雜訊光或由薄層36所反射的雜訊光，而避免上述干擾現象。此外， 第二凹槽35較高的第二側壁上表面351視需要亦可做為第一隔離 體42之對準位置(alignment)，此對準功能可讓第一隔離體的設 置位，更具彈性，可具有d、d，、d，，等方向位移的設置容忍度，而 不需嚴格要求封裝時要對準第二凹槽35的邊緣。 =閱第7A圖、第7B圖及第8圖。其中，第从圖為本發201037850 VI. Description of the Invention: [Technical Field] The present invention relates to a light sensing module package structure and a packaging method thereof, and more particularly to an integrated light emitting device and a light sensing component packaged in the same module Social organization. ,. [Prior Art] 〇 Currently, 'light sensing components have been widely used in normal life, such as using light sensing components to detect ambient light to determine the opening and closing of the illuminating device (tum on / tum 0, this combination can be applied To achieve power-saving effect; or use the proximity sensor (4) lion to use the sensor to combine with the light-emitting diode to detect whether the foreign object is close, or to further detect the distance between the foreign object and the approaching sensor. This application is commonly used in handheld devices to determine whether the user's face is close to determine the opening and closing of the screen. The above applications can make life more convenient or further improve the efficiency of the use of electronic devices. However, in the prior art, the light sensing element and the light emitting element are separately disposed in the electric device, which causes the Lange t+ loading and the machine turning complexity to be improved. Therefore, some manufacturers have packaged the light-emitting element and the light-sensing element in the same module. As shown in Fig. 1, it is a first exemplary side view of the light sensing module package structure of the prior art. In the figure, the light sensing module package structure comprises a substrate 11, a light sensing component 12, a light emitting component 13, a light transmissive top cover 2, and a spacer 22 (is 〇 〇 〇 。 wall). The substrate has a first recess 14 and a second recess 15 , and the light sensing element 12 is disposed in the first recess 14 , and the light emitting component 13 is disposed in the second recess 15 . The light-transmissive top cover 20 is disposed above the substrate u. Since the transparent cover 2 interface may reflect the light emitted by the light-emitting element 13 to cause noise light, the spacer 201037850 22 needs to be disposed on the substrate 11 and the transparent top. Between the cover 2, and between the light sensing element ι2 and the light-emitting element 13, the spacer 22 blocks the noise light reflected by the transparent cover 20. However, when the surfaces of the grooves are all at the same height, the optical sensing module package structure of the prior art is inevitably subjected to mechanical tolerances during manufacture (mechanical sinking (10) (8) exists, and the spacer is not easily adhered to the package, such as As shown in Fig. 2, the light emitted by the light-emitting element 13 is caused to leak to the photo-sensing element I) at the bottom of the spacer 22, causing misdetection. SUMMARY OF THE INVENTION In view of the above problems of the prior art, one of the objects of the present invention is to provide a light sensing module package structure and a packaging method thereof to improve ease of use. One of the objects of the present invention is to provide a light sensing module package structure and a package method thereof to reduce the complexity of the circuit and mechanism of the electronic device using the light sensor module. According to the above object of the present invention, a light sensing module package structure is proposed, which comprises a substrate, a light sensing component and a light emitting component. The substrate has a first recess and a first recess, and the upper surface of the second sidewall of the second recess is higher than the upper surface of the first recess; and the inner surface of the second recess is There is a reflective layer or a light P, '邑 layer, and the light sensing element is disposed in the first groove, and the light emitting element is provided with the second groove. The material of the substrate is an opaque material or a light absorbing material. Wherein the 'reflective layer or the photoresist layer is located on the inner side or the bottom surface of the second groove. In the application, the light sensing module package structure further comprises a transparent top cover and an 201037850 isolation wall. The transparent top cover covers the substrate, and the isolation system is located on the substrate and is transparent. Between the light top covers, and between the light sensing elements and the light emitting elements. According to the above object of the present invention, a packaging method of a light sensing module is provided, which comprises the following steps. First, a substrate having a first recess and a second recess is provided, and the upper surface of the second sidewall of the second recess is higher than the upper surface of the first sidewall of the first recess, and then in the second recess a portion of the surface of the trench or a photoresist or a light reflecting layer. Finally, a light sensing element is disposed in the first recess, and a light emitting element is disposed in the second recess. ❸ The material of the substrate is opaque or light absorbing material. Wherein, the package method further comprises: providing a transparent top cover to cover the substrate, and providing a spacer between the substrate and the transparent cover, and between the light sensing element and the light emitting element. [Embodiment] Please refer to FIG. 3A, FIG. 3B and FIG. 5, and FIG. 3A is a plan view showing a first embodiment of the package structure of the diaphragm sensing module of the present invention, and FIG. 3B is a diagram of FIG. 3A. A cross-sectional side view along the section line AA. Fig. 5 is a perspective view showing a first embodiment of the optical sensing module 2 assembly structure of the present invention. The light-emitting module package structure comprises a substrate 31, a light sensing component 32 and a light-emitting component 33. The base has a first groove 34 and a second groove 35, wherein the second sidewall upper surface 351 of the second groove 35 is higher than the first sidewall of the first groove %. A thin layer 36 may be further disposed on a portion of the surface of the groove 35. The thin layer may be a reflective layer or a photoresist layer to enhance the effect of light reflection or photoresist. For example, a reflective material of (7) may be coated on the inner or bottom surface of the second recess 35, such as 5 201037850 gold or gold alloy, copper or copper alloy, aluminum or aluminum alloy, silver or silver alloy to form the thin layer. The 36° ride 36 can emit light from the anti-mystery element 33 to the outside of the light sensing module package structure and block the side or bottom from leaking light to the light sensing element. The light-emitting element 33 is disposed in the second groove. 35, preferably a light-emitting diode, in particular, a light-emitting diode capable of emitting non-visible light. The light sensing element 32 is disposed in the first groove 34 for sensing a light beam and The energy is converted into electrical energy to generate an electrical signal representative of the light intensity, such as a voltage signal or a current signal. Then, the electrical signal is transmitted to an external circuit for signal processing through the connection line 39. The light sensing component 32 can be used. Detecting ambient light, or as a proximity sensor, for sensing the reflected light of the light emitted by the light-emitting element 33 being reflected by a foreign object. In the first embodiment of the present invention, the light sense The measuring element 32 and the light emitting element 33 are respectively disposed at the After the recess 34 and the second recess 35, the light sensing material 32 and the light emitting element 33 may be coated with a light transmissive material to form a protective layer 38. The protective layer 38 may prevent the light sensing element 32 and the light emitting element 33 from being exposed to dust. Or the moisture affects and damages. The material of the substrate 31 is preferably an opaque material or a light absorbing material. The opaque material comprises ceramic or plastic, and the light absorbing material comprises a non-reflective black paint or a black material to reduce The ratio of light reflection. The light sensing element and the light-emitting element are placed in different grooves to prevent the light-sensing element 32 from directly receiving the light emitted by the light-emitting element 33. Please refer to FIG. 4, which is The first embodiment of the light sensing module package structure of the present invention is combined with the side view of the cover body. The difference between the first embodiment and the second embodiment is that in the second embodiment, the light sensing module package structure The invention further comprises a light-transmissive top cover 40 and a first isolation body (is〇iati〇n wau) 42. The light-transmissive top cover 201037850 40 is over the substrate 31. The transparent top cover 40 will Reflecting light emitted by the light-emitting element 33 The light causes the interference of the light sensing component 32 to cause a false positive. The light reflected by the thin layer 36 may also form the noise light, causing the light sensing component to illusion. Therefore, the first spacer 42 needs to be disposed on the light. Between the substrate 31 and the light-transmissive top cover 4, and between the light sensing element 32 and the light-emitting element 33. The first spacer 42 can block the noise light reflected by the transparent cover 40 and the thin layer 36 reflected noise light, thereby avoiding interference of the light sensing element 32. According to the first embodiment of the present invention, even if the first spacer 42 may have a mechanical tolerance in the manufacturing process, the assembly is caused. There may be gaps d, d, d" in each direction of the first spacer 42 and the substrate 31. At this time, the second sidewall upper surface 351 of the second recess 35 can shield the noise light reflected by the transparent cover or the noise reflected by the thin layer 36 to avoid the above interference phenomenon. In addition, the second sidewall upper surface 351 of the second recess 35 can also be used as an alignment of the first spacer 42 as needed, and the alignment function can make the first spacer set. It has elasticity and can have a set tolerance of d, d, d, and the like, and does not require strict alignment of the edge of the second groove 35 when the package is required. = read Figure 7A, Figure 7B and Figure 8. Among them, the first picture is the hair
4 ’第-凹槽34之-侧壁上緣741可進—步阻 斤發出的光射到第—凹槽34中而影響光感測元件％。 隔發光元件33 明之光感繼崎裝結構之第2實施例俯視圖 7A圖中沿著杳丨而綠，丛 ^ Λ _ 201037850 槽2實施例亦可以在基板31上形成-第-凹 4-凹槽35及一第三凹槽7〇的方式 凹槽7〇係位於第一凹槽34及第二凹槽之間35列、三 設置於第—凹槽34中而發光元 7^感冽兀件32 由第-凹槽34之—側壁 ：二其中藉 751 -π- t 、乐—凹糟35之一側壁上缕 1之汉置，可相阻隔發光元件所發出的光的效果。 緣 如第8 _示，第2實施例與第1實施例相比，亦可 ^效地讓第-隱體42的設錄置更具彈性，柯且有d、d，= 位㈣設置容忍度，不纽格要求封鱗要對凹 34或第二凹槽35的邊緣。 凹槽 請參_ 6圖’其係為本㈣之域測馳之_方 。圖中，此封裝方法包含下列步驟。在步驟S!，^ =-具有—第—凹槽及—第二凹槽之基板，且第二凹槽之第^ 壁上表面膽第-凹槽之第—_上表面。其中 凹槽的方法已為此領域技術者所熟知，故在此不再贅&。此農、 透光材Γ吸光材質製成。不透光材質包含陶紙二 2料’而吸光材質包含不反光黑色塗料或黑财，叫 射的比例。在步驟S2，可進-步於第二凹槽之部分表面上形 反射層或-光阻絕層，以增強光反射或光阻絕之效果。在步驟Μ， 將-光感麻件及-發光it件分別設置於第—凹槽及第二凹槽。 在步驟S4設置-透光頂蓋覆蓋基板，並設置一隔離體 _ati〇n wall)聽板及奴職巧，⑽光制元件及 件之間。其巾’锻隔離斜可以根據第二凹槽之_進行解。 此外’此封裝方法視需要更可包含將第一凹槽與第二凹槽間 8 201037850 隔設置，其間隔部分形成—第三凹槽。其中第-凹槽之-侧壁上 ==第之—侧壁上緣。如此亦可達成阻隔發光元件所 發出的雜减的效果，而且讓隔離體的設置位置更具彈性。 ♦胜x上所賴為舉例性，巾料限讎者。任何未脫離本發明 :==對其進行之等效修改或變更，均應包含於後附 之申請專利範圍中。 【圖式簡單說明】 第1圖係為習知技藝之光感測模組封襄結構之第i示例側視圖； 第2圖係為習知技藝之光感測模組封裝結構之第2示姻視圖； 第3A圖係為本發明之域峨組職結構之第丨實細俯視圖·， 第3B圖係為本發明之光感測模組封襄結構沿著第3A圖之剖面 線AA’的剖面侧視圖； 第4圖係為本發明之光感峨組封裝結構之第丨實施例結合蓋體 之側視圖； 第5圖係為本發明之光感測模組之封裝3D圖； 第6圖係為本個之光制触之域妓之細流程圖； 第7A圖係為本發明之光感測模組封裝結構之第2實施例俯視圖； 第7B圖係為本發明之光感測模組封裝結構沿著第7A圖之剖面 線BB’的剖面側視圖；以及 第8圖係為本發明之光感峨_裝結構之第2實施例結合蓋體 的側視圖。 201037850 【主要元件符號說明】 11 :基板； 12 :光感測元件； 13 :發光元件； 14 :第一凹槽； 15 :第二凹槽； 20 :透光頂蓋； 22 :隔離體； 31 :基板； 32 :光感測元件； 33 :發光元件； 34 :第一凹槽； 341 :第一側壁上表面； 35 :第二凹槽； 351 :第二側壁上表面； 36 :薄層； 38 :保護層； 39 :連接線； 40 :透光頂蓋； 42 :第一隔離體； 70 :第三凹槽； 741、751 :側壁上緣； AA’、BB’ ：剖面線；以及 d、d’、d” ：間隙； SI、S2、S3、S4 :步驟。The upper edge 741 of the fourth recess 34 can advance the light from the first recess 34 to affect the photo sensing element %. The second embodiment of the light-emitting element 33 is shown in the top view of FIG. 7A along the green and the green layer, and the embodiment of the groove 2 can also form a --concave 4-concave on the substrate 31. The groove 35 and the third groove 7 are in a manner that the groove 7 is located between the first groove 34 and the second groove 35, and the third groove is disposed in the first groove 34 and the light-emitting element 7 is sensed. The member 32 has the effect of blocking the light emitted by the light-emitting element by the side wall of the first groove 34, the second side of the wall of one of the 751-π-t and the music-concave grain 35. For example, as shown in the eighth embodiment, the second embodiment can also make the setting of the first-hidden body 42 more flexible than that of the first embodiment, and has d, d, = bit (four) setting tolerance. Degrees, not New Zealand requires the seal to be on the edge of the recess 34 or the second recess 35. Groove Please refer to _ 6 图' which is the domain of the (4) domain. In the figure, this encapsulation method consists of the following steps. In the step S!, ^ = - the substrate having the - first groove and the second groove, and the upper surface of the upper surface of the second groove of the second groove. The method of the groove is well known to those skilled in the art and is therefore no longer referred to herein. This agricultural and translucent material is made of light absorbing material. The opaque material consists of ceramic paper 2 and the material absorbs the proportion of non-reflective black paint or black money. In step S2, a reflective layer or a photoresist layer may be further formed on a portion of the surface of the second recess to enhance the effect of light reflection or photoresist. In the step Μ, the light-sensing member and the light-emitting member are respectively disposed in the first groove and the second groove. In step S4, a light-transmissive top cover is disposed to cover the substrate, and a spacer _ati〇n wall is provided, and the (10) light-made component and the component are disposed. The towel's forging isolation can be solved according to the second groove. In addition, the packaging method may further include disposing the first groove and the second groove 8 201037850 as needed, and the spacing portion forms a third groove. Wherein the first groove - on the side wall == the first - the upper edge of the side wall. In this way, the effect of blocking the noise emitted by the light-emitting element can be achieved, and the position of the spacer can be made more flexible. ♦ Winning x depends on the example, the towel limiter. Any departure from the invention: == Equivalent modifications or alterations thereto shall be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a second side view of a light sensing module sealing structure of a prior art; FIG. 2 is a second embodiment of a light sensing module package structure of the prior art. 3A is a third detailed view of the domain structure of the present invention. FIG. 3B is a sectional view of the light sensing module of the present invention along the section line AA of FIG. 3A. FIG. 4 is a side view of a third embodiment of the light sensing package of the present invention combined with a cover; FIG. 5 is a 3D view of the package of the light sensing module of the present invention; 6 is a detailed flow chart of the light touch field of the present invention; FIG. 7A is a top view of the second embodiment of the light sensing module package structure of the present invention; FIG. 7B is a light sense of the present invention A cross-sectional side view of the test module package structure along section line BB' of FIG. 7A; and FIG. 8 is a side view of the second embodiment of the light-sensing 峨-package structure of the present invention in combination with the cover body. 201037850 [Description of main component symbols] 11: substrate; 12: light sensing element; 13: light emitting element; 14: first groove; 15: second groove; 20: light transmissive top cover; 22: spacer; : substrate; 32: light sensing element; 33: light emitting element; 34: first groove; 341: first side wall upper surface; 35: second groove; 351: second side wall upper surface; 36: thin layer; 38: protective layer; 39: connecting line; 40: transparent top cover; 42: first spacer; 70: third groove; 741, 751: upper edge of the side wall; AA', BB': hatching; , d', d": gap; SI, S2, S3, S4: steps.