DE69329374D1 - Verfahren zur Herstellung eines Halbleitersubstrates mittels eines Verbundverfahrens - Google Patents

Verfahren zur Herstellung eines Halbleitersubstrates mittels eines Verbundverfahrens

Info

Publication number
DE69329374D1
DE69329374D1 DE69329374T DE69329374T DE69329374D1 DE 69329374 D1 DE69329374 D1 DE 69329374D1 DE 69329374 T DE69329374 T DE 69329374T DE 69329374 T DE69329374 T DE 69329374T DE 69329374 D1 DE69329374 D1 DE 69329374D1
Authority
DE
Germany
Prior art keywords
producing
semiconductor substrate
composite
composite method
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69329374T
Other languages
English (en)
Other versions
DE69329374T2 (de
Inventor
Kiyofumi Sakaguchi
Takao Yonehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69329374D1 publication Critical patent/DE69329374D1/de
Application granted granted Critical
Publication of DE69329374T2 publication Critical patent/DE69329374T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE69329374T 1992-12-25 1993-12-22 Verfahren zur Herstellung eines Halbleitersubstrates mittels eines Verbundverfahrens Expired - Fee Related DE69329374T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34672992 1992-12-25
JP5308047A JPH06244389A (ja) 1992-12-25 1993-12-08 半導体基板の作製方法及び該方法により作製された半導体基板

Publications (2)

Publication Number Publication Date
DE69329374D1 true DE69329374D1 (de) 2000-10-12
DE69329374T2 DE69329374T2 (de) 2001-03-08

Family

ID=26565390

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69329374T Expired - Fee Related DE69329374T2 (de) 1992-12-25 1993-12-22 Verfahren zur Herstellung eines Halbleitersubstrates mittels eines Verbundverfahrens

Country Status (4)

Country Link
US (1) US5763288A (de)
EP (1) EP0603849B1 (de)
JP (1) JPH06244389A (de)
DE (1) DE69329374T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2723787B2 (ja) * 1993-08-20 1998-03-09 信越半導体株式会社 結合型基板の製造方法
AT403859B (de) * 1994-08-17 1998-06-25 Thallner Aya Maria Reinstraum, insbesondere für soi-bondungen
TW308707B (en) * 1995-12-15 1997-06-21 Komatsu Denshi Kinzoku Kk Manufacturing method of bonding SOI wafer
JPH09331049A (ja) * 1996-04-08 1997-12-22 Canon Inc 貼り合わせｓｏｉ基板の作製方法及びｓｏｉ基板
JP3501642B2 (ja) 1997-12-26 2004-03-02 キヤノン株式会社 基板処理方法
JP2965981B1 (ja) * 1998-09-30 1999-10-18 モトローラ株式会社 フリップチップボンディングの最適化条件検出方法
JP2002184960A (ja) 2000-12-18 2002-06-28 Shin Etsu Handotai Co Ltd Ｓｏｉウェーハの製造方法及びｓｏｉウェーハ
JP4822582B2 (ja) * 2000-12-22 2011-11-24 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 ボロンドープされたシリコンウエハの熱処理方法
FR2851846A1 (fr) * 2003-02-28 2004-09-03 Canon Kk Systeme de liaison et procede de fabrication d'un substrat semi-conducteur
EP1620583A4 (de) * 2003-05-06 2009-04-22 Canon Kk Halbleitersubstrat, halbleitervorrichtung, leuchtdiode und herstellungsverfahren dafür
JP2004335642A (ja) * 2003-05-06 2004-11-25 Canon Inc 基板およびその製造方法
US7608520B2 (en) * 2003-11-06 2009-10-27 Panasonic Corporation Method for bonding substrate, bonded substrate, and direct bonded substrate
JP4771510B2 (ja) * 2004-06-23 2011-09-14 キヤノン株式会社 半導体層の製造方法及び基板の製造方法
US7495313B2 (en) * 2004-07-22 2009-02-24 Board Of Trustees Of The Leland Stanford Junior University Germanium substrate-type materials and approach therefor
US20070023850A1 (en) * 2005-07-30 2007-02-01 Chien-Hua Chen Bonding surfaces together via plasma treatment on both surfaces with wet treatment on only one surface
JP5171016B2 (ja) * 2006-10-27 2013-03-27 キヤノン株式会社 半導体部材、半導体物品の製造方法、その製造方法を用いたｌｅｄアレイ
JP2009094144A (ja) * 2007-10-04 2009-04-30 Canon Inc 発光素子の製造方法
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
US8652935B2 (en) 2010-12-16 2014-02-18 Tessera, Inc. Void-free wafer bonding using channels
JP5861604B2 (ja) * 2012-09-21 2016-02-16 信越化学工業株式会社 太陽電池の製造方法
FR3034566A1 (fr) * 2015-03-31 2016-10-07 Commissariat Energie Atomique Procede d'assemblage de substrats
CN112599468B (zh) * 2020-12-31 2022-10-14 福建江夏学院 一种基于溶剂处理制备二硫化钼薄层及其薄膜晶体管的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111940B2 (ja) * 1987-09-11 1995-11-29 日産自動車株式会社 半導体基板の接合方法
DE69114531T2 (de) * 1990-02-07 1996-04-25 Harris Corp Löten von Wafern unter Verwendung von eingeschlossenem oxydierendem Dampf.
US5266135A (en) * 1990-02-07 1993-11-30 Harris Corporation Wafer bonding process employing liquid oxidant
JP3176072B2 (ja) * 1991-01-16 2001-06-11 キヤノン株式会社 半導体基板の形成方法
JP3112106B2 (ja) * 1991-10-11 2000-11-27 キヤノン株式会社 半導体基材の作製方法

Also Published As

Publication number Publication date
EP0603849B1 (de) 2000-09-06
JPH06244389A (ja) 1994-09-02
EP0603849A3 (de) 1997-09-24
DE69329374T2 (de) 2001-03-08
EP0603849A2 (de) 1994-06-29
US5763288A (en) 1998-06-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee