DE69329097T2 - Neue Anordnung für eine Vorrichtung mit vielen HV-LDMOS Transistoren und einer Schaltung innerhalb einer schwebenden Wanne - Google Patents
Neue Anordnung für eine Vorrichtung mit vielen HV-LDMOS Transistoren und einer Schaltung innerhalb einer schwebenden WanneInfo
- Publication number
- DE69329097T2 DE69329097T2 DE69329097T DE69329097T DE69329097T2 DE 69329097 T2 DE69329097 T2 DE 69329097T2 DE 69329097 T DE69329097 T DE 69329097T DE 69329097 T DE69329097 T DE 69329097T DE 69329097 T2 DE69329097 T2 DE 69329097T2
- Authority
- DE
- Germany
- Prior art keywords
- many
- circuit
- new arrangement
- ldmos transistors
- floating tub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0922—Combination of complementary transistors having a different structure, e.g. stacked CMOS, high-voltage and low-voltage CMOS
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/971,382 US5446300A (en) | 1992-11-04 | 1992-11-04 | Semiconductor device configuration with multiple HV-LDMOS transistors and a floating well circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69329097D1 DE69329097D1 (de) | 2000-08-31 |
DE69329097T2 true DE69329097T2 (de) | 2001-03-22 |
Family
ID=25518309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69329097T Expired - Fee Related DE69329097T2 (de) | 1992-11-04 | 1993-10-28 | Neue Anordnung für eine Vorrichtung mit vielen HV-LDMOS Transistoren und einer Schaltung innerhalb einer schwebenden Wanne |
Country Status (5)
Country | Link |
---|---|
US (1) | US5446300A (de) |
EP (1) | EP0596565B1 (de) |
JP (1) | JPH06260601A (de) |
DE (1) | DE69329097T2 (de) |
TW (1) | TW244394B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0587968B1 (de) * | 1992-09-18 | 1996-01-03 | Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno | Monolithisch integrierte Brückenschaltung mit Transistoren und entsprechendes Herstellungsverfahren |
JP4775357B2 (ja) * | 1995-04-12 | 2011-09-21 | 富士電機株式会社 | 高耐圧ic |
JP4013785B2 (ja) * | 1995-04-12 | 2007-11-28 | 富士電機デバイステクノロジー株式会社 | 高耐圧ic |
JP3228093B2 (ja) * | 1995-06-28 | 2001-11-12 | 富士電機株式会社 | 高耐圧ic |
JP3565181B2 (ja) * | 1995-06-28 | 2004-09-15 | 富士電機デバイステクノロジー株式会社 | 高耐圧ic |
DE69530216T2 (de) * | 1995-12-19 | 2004-02-12 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno - Corimme | Monolithische Halbleiteranordnung mit Randstruktur und Verfahren zur Herstellung |
JP3917211B2 (ja) * | 1996-04-15 | 2007-05-23 | 三菱電機株式会社 | 半導体装置 |
EP0977264B1 (de) * | 1998-07-31 | 2006-04-26 | Freescale Semiconductor, Inc. | Halbleiterstruktur für Treiberschaltkreise mit Pegelverschiebung |
DE19919130B4 (de) * | 1999-04-27 | 2005-10-06 | Infineon Technologies Ag | Monolithisch integrierte Halbleiteranordnung mit einem Steuerbereich und einem spannungsaufnehmenden Bereich |
US6184700B1 (en) | 1999-05-25 | 2001-02-06 | Lucent Technologies, Inc. | Fail safe buffer capable of operating with a mixed voltage core |
JP4610786B2 (ja) * | 2001-02-20 | 2011-01-12 | 三菱電機株式会社 | 半導体装置 |
DE10225860B4 (de) | 2001-06-11 | 2006-11-09 | Fuji Electric Co., Ltd., Kawasaki | Halbleiterbauteil |
JP4545548B2 (ja) * | 2004-10-21 | 2010-09-15 | ルネサスエレクトロニクス株式会社 | 半導体集積回路及び半導体装置 |
WO2007035862A2 (en) * | 2005-09-21 | 2007-03-29 | International Rectifier Corporation | Semiconductor package |
KR101463076B1 (ko) * | 2008-03-28 | 2014-12-05 | 페어차일드코리아반도체 주식회사 | 레벨 시프트 소자들을 구비하는 고압 반도체소자 및 그의제조방법 |
US8207580B2 (en) * | 2009-05-29 | 2012-06-26 | Power Integrations, Inc. | Power integrated circuit device with incorporated sense FET |
TWI448055B (zh) | 2010-06-07 | 2014-08-01 | Richtek Technology Corp | 切換式電源供應器之控制電路及其控制方法以及用於其中之電晶體元件 |
JP6379509B2 (ja) * | 2014-02-18 | 2018-08-29 | セイコーエプソン株式会社 | 回路装置及び電子機器 |
TWI595653B (zh) * | 2016-09-13 | 2017-08-11 | 立積電子股份有限公司 | 用於增加信號振幅範圍的電晶體 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1358573A (fr) * | 1963-03-06 | 1964-04-17 | Csf | Circuit électrique intégré |
JPS58135666A (ja) * | 1983-01-14 | 1983-08-12 | Hitachi Ltd | 高耐圧半導体装置 |
US4678936A (en) * | 1984-02-17 | 1987-07-07 | Analog Devices, Incorporated | MOS-cascoded bipolar current sources in non-epitaxial structure |
US4661838A (en) * | 1985-10-24 | 1987-04-28 | General Electric Company | High voltage semiconductor devices electrically isolated from an integrated circuit substrate |
IT1213027B (it) * | 1986-01-24 | 1989-12-07 | Sgs Microelettrica Spa | Densita'.!circuito integrato a semiconduttore, in particolare del tipo comprendente dispositivi ad alta tensione e dispositivi di elaborazione di segnale ad alta |
IT1188465B (it) * | 1986-03-27 | 1988-01-14 | Sgs Microelettronica Spa | Rpocedimento per la fabbricazione di circuiti integrati a semiconduttore includenti dispositiv cmos e dispositivi elettronici ad alta tensione |
JPH0812918B2 (ja) * | 1986-03-28 | 1996-02-07 | 株式会社東芝 | 半導体装置の製造方法 |
JPH0691193B2 (ja) * | 1986-07-11 | 1994-11-14 | 株式会社日立マイコンシステム | 半導体装置 |
JPS63153910A (ja) * | 1986-12-17 | 1988-06-27 | Nec Corp | レベルシフト回路 |
DE3856174T2 (de) * | 1987-10-27 | 1998-09-03 | Nec Corp | Halbleiteranordnung mit einem isolierten vertikalen Leistungs-MOSFET. |
IT1235843B (it) * | 1989-06-14 | 1992-11-03 | Sgs Thomson Microelectronics | Dispositivo integrato contenente strutture di potenza formate con transistori ldmos complementari, strutture cmos e pnp verticali con aumentata capacita' di supportare un'alta tensione di alimentazione. |
US5003362A (en) * | 1989-07-28 | 1991-03-26 | Dallas Semiconductor Corporation | Integrated circuit with high-impedance well tie |
US5192989A (en) * | 1989-11-28 | 1993-03-09 | Nissan Motor Co., Ltd. | Lateral dmos fet device with reduced on resistance |
US5386136A (en) * | 1991-05-06 | 1995-01-31 | Siliconix Incorporated | Lightly-doped drain MOSFET with improved breakdown characteristics |
US5146298A (en) * | 1991-08-16 | 1992-09-08 | Eklund Klas H | Device which functions as a lateral double-diffused insulated gate field effect transistor or as a bipolar transistor |
-
1992
- 1992-11-04 US US07/971,382 patent/US5446300A/en not_active Expired - Lifetime
-
1993
- 1993-10-28 DE DE69329097T patent/DE69329097T2/de not_active Expired - Fee Related
- 1993-10-28 EP EP93203015A patent/EP0596565B1/de not_active Expired - Lifetime
- 1993-11-04 JP JP5275531A patent/JPH06260601A/ja active Pending
- 1993-12-27 TW TW082111009A patent/TW244394B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP0596565A3 (en) | 1997-06-04 |
JPH06260601A (ja) | 1994-09-16 |
DE69329097D1 (de) | 2000-08-31 |
EP0596565A2 (de) | 1994-05-11 |
EP0596565B1 (de) | 2000-07-26 |
TW244394B (de) | 1995-04-01 |
US5446300A (en) | 1995-08-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |