DE69320433T2 - Programmierbare Identifikationsschaltungen für Halbleiterwürfel - Google Patents

Programmierbare Identifikationsschaltungen für Halbleiterwürfel

Info

Publication number
DE69320433T2
DE69320433T2 DE69320433T DE69320433T DE69320433T2 DE 69320433 T2 DE69320433 T2 DE 69320433T2 DE 69320433 T DE69320433 T DE 69320433T DE 69320433 T DE69320433 T DE 69320433T DE 69320433 T2 DE69320433 T2 DE 69320433T2
Authority
DE
Germany
Prior art keywords
cubes
semiconductor
identification circuits
programmable identification
specific information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69320433T
Other languages
English (en)
Other versions
DE69320433D1 (de
Inventor
Clark W Jernigan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE69320433D1 publication Critical patent/DE69320433D1/de
Publication of DE69320433T2 publication Critical patent/DE69320433T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/006—Identification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69320433T 1992-07-09 1993-06-25 Programmierbare Identifikationsschaltungen für Halbleiterwürfel Expired - Lifetime DE69320433T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US91113892A 1992-07-09 1992-07-09

Publications (2)

Publication Number Publication Date
DE69320433D1 DE69320433D1 (de) 1998-09-24
DE69320433T2 true DE69320433T2 (de) 1999-03-25

Family

ID=25429793

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69320433T Expired - Lifetime DE69320433T2 (de) 1992-07-09 1993-06-25 Programmierbare Identifikationsschaltungen für Halbleiterwürfel

Country Status (4)

Country Link
US (1) US5642307A (de)
EP (1) EP0578410B1 (de)
JP (1) JP3659981B2 (de)
DE (1) DE69320433T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10115280A1 (de) * 2001-03-28 2002-10-24 Infineon Technologies Ag Verfahren zum Klassifizieren von Bauelementen

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5742526A (en) * 1996-01-03 1998-04-21 Micron Technology, Inc. Apparatus and method for identifying an integrated device
SG54995A1 (en) * 1996-01-31 1998-12-21 Texas Instr Singapore Pet Ltd Method and apparatus for aligning the position of die on a wafer table
KR0182926B1 (ko) * 1996-06-29 1999-05-15 김광호 바-코드 시스템을 이용한 품질관리시스템 및 품질관리방법
US6078845A (en) * 1996-11-25 2000-06-20 Schlumberger Technologies, Inc. Apparatus for carrying semiconductor devices
IT1290156B1 (it) * 1996-12-18 1998-10-19 Texas Instruments Italia Spa Chip di memoria contenente un registro di memoria non volatile per la memorizzazione permanente di informazioni relative alla qualita' del
US6100486A (en) 1998-08-13 2000-08-08 Micron Technology, Inc. Method for sorting integrated circuit devices
US5927512A (en) * 1997-01-17 1999-07-27 Micron Technology, Inc. Method for sorting integrated circuit devices
US5844803A (en) * 1997-02-17 1998-12-01 Micron Technology, Inc. Method of sorting a group of integrated circuit devices for those devices requiring special testing
US5915231A (en) * 1997-02-26 1999-06-22 Micron Technology, Inc. Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
US5856923A (en) 1997-03-24 1999-01-05 Micron Technology, Inc. Method for continuous, non lot-based integrated circuit manufacturing
US5959912A (en) * 1997-04-30 1999-09-28 Texas Instruments Incorporated ROM embedded mask release number for built-in self-test
US5984190A (en) * 1997-05-15 1999-11-16 Micron Technology, Inc. Method and apparatus for identifying integrated circuits
FR2764392B1 (fr) * 1997-06-04 1999-08-13 Sgs Thomson Microelectronics Procede d'identification d'un circuit integre et dispositif associe
US7120513B1 (en) * 1997-06-06 2006-10-10 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs
US5907492A (en) * 1997-06-06 1999-05-25 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
US5835430A (en) * 1997-07-25 1998-11-10 Rockwell International Corporation Method of providing redundancy in electrically alterable memories
US6446017B1 (en) 1997-08-21 2002-09-03 Micron Technology, Inc. Method and system for tracking manufacturing data for integrated circuit parts
US6018686A (en) * 1997-10-31 2000-01-25 Cypress Semiconductor Corp. Electrically imprinting a semiconductor die with identifying information
US6154872A (en) * 1997-11-20 2000-11-28 Cypress Semiconductor Corporation Method, circuit and apparatus for preserving and/or correcting product engineering information
US6001662A (en) * 1997-12-02 1999-12-14 International Business Machines Corporation Method and system for providing a reusable configurable self-test controller for manufactured integrated circuits
US6148279A (en) * 1997-12-04 2000-11-14 Cypress Semiconductor Corporation Apparatus for recording and/or reading program history
US6052319A (en) * 1997-12-04 2000-04-18 Cypress Semiconductor Corp. Apparatus and method for controlling experimental inventory
US6049624A (en) * 1998-02-20 2000-04-11 Micron Technology, Inc. Non-lot based method for assembling integrated circuit devices
US6181615B1 (en) 1998-03-30 2001-01-30 Cypress Semiconductor Corporation Circuitry, apparatus and method for embedding quantifiable test results within a circuit being tested
US6209110B1 (en) 1998-03-30 2001-03-27 Cypress Semiconductor Corporation Circuitry, apparatus and method for embedding a test status outcome within a circuit being tested
US6047579A (en) * 1998-04-17 2000-04-11 The Minster Machine Company RF tag attached to die assembly for use in press machine
US6268228B1 (en) 1999-01-27 2001-07-31 International Business Machines Corporation Electrical mask identification of memory modules
US6161213A (en) * 1999-02-17 2000-12-12 Icid, Llc System for providing an integrated circuit with a unique identification
US6253076B1 (en) 1999-02-25 2001-06-26 Ericsson Inc. Manufacturing method for wireless communications devices employing potentially different versions of integrated circuits
DE60029290T2 (de) 1999-04-27 2007-07-12 Seiko Epson Corp. Integrierte schaltung
JP2001208795A (ja) * 2000-01-28 2001-08-03 Ando Electric Co Ltd キャリア識別システム、キャリア識別方法および記憶媒体
JP2001230164A (ja) * 2000-02-18 2001-08-24 Mitsubishi Electric Corp 半導体装置の製造履歴情報搭載方法およびその方法により製造された半導体装置
AU2001272081A1 (en) * 2000-02-28 2001-09-03 Ericsson Inc. Integrated circuit package with device specific data storage
US6492706B1 (en) 2000-12-13 2002-12-10 Cypress Semiconductor Corp. Programmable pin flag
US20020082746A1 (en) * 2000-12-27 2002-06-27 Honeywell International Inc. Replaceable media with programmable device
KR100393214B1 (ko) * 2001-02-07 2003-07-31 삼성전자주식회사 패드의 수를 최소화하기 위한 칩 식별 부호 인식 장치 및이를 내장한 반도체 장치
JP3959264B2 (ja) * 2001-09-29 2007-08-15 株式会社東芝 積層型半導体装置
DE10219346B4 (de) * 2002-04-30 2010-10-07 Osram Opto Semiconductors Gmbh Verfahren zum Abbilden und Zuordnen von Eigenschaften von einer Mehrzahl auf einem Wafer angeordneter Funktionschips und Wafer mit einer Mehrzahl von Funktionschips und Referenzchips
US7046536B2 (en) * 2002-05-29 2006-05-16 Micron Technology, Inc. Programable identification circuitry
US7131033B1 (en) * 2002-06-21 2006-10-31 Cypress Semiconductor Corp. Substrate configurable JTAG ID scheme
AT412453B (de) * 2002-07-01 2005-03-25 Trumpf Maschinen Austria Gmbh Fertigungseinrichtung, insbesondere abkantpresse, mit elektronischer werkzeugerfassung
US6802447B2 (en) * 2002-08-26 2004-10-12 Icid, Llc Method of authenticating an object or entity using a random binary ID code subject to bit drift
DE10241141B4 (de) * 2002-09-05 2015-07-16 Infineon Technologies Ag Halbleiter-Bauelement-Test-Verfahren für ein Halbleiter-Bauelement-Test-System mit reduzierter Anzahl an Test-Kanälen
JP3736525B2 (ja) * 2002-12-25 2006-01-18 ソニー株式会社 半導体集積回路装置および回路基板
US6988314B2 (en) * 2003-02-03 2006-01-24 Honda Giken Kogyo Kabushiki Kaisha Assembly, tolerance matching and post-manufacturing quality assurance method
US6880140B2 (en) * 2003-06-04 2005-04-12 Lsi Logic Corporation Method to selectively identify reliability risk die based on characteristics of local regions on the wafer
US7415317B2 (en) * 2004-02-25 2008-08-19 Micron Technology, Inc. Method and system for correlating and combining production and non-production data for analysis
US7395130B2 (en) * 2004-02-27 2008-07-01 Micron Technology, Inc. Method and system for aggregating and combining manufacturing data for analysis
US7818640B1 (en) 2004-10-22 2010-10-19 Cypress Semiconductor Corporation Test system having a master/slave JTAG controller
US20080121709A1 (en) * 2004-12-13 2008-05-29 Tokyo Electron Limited Semiconductor Chip With Identification Codes, Manufacturing Method Of The Chip And Semiconductor Chip Management System
US7531907B2 (en) * 2005-04-29 2009-05-12 Hitachi Global Storage Technologies Netherlands B.V. System and method for forming serial numbers on HDD wafers
US7883019B2 (en) * 2005-09-02 2011-02-08 Hynix Semiconductor Inc. Integrated circuit with embedded FeRAM-based RFID
US7787034B2 (en) * 2006-04-27 2010-08-31 Avago Technologies General Ip (Singapore) Pte. Ltd. Identification of integrated circuits using pixel or memory cell characteristics
WO2009008151A1 (ja) * 2007-07-09 2009-01-15 Panasonic Corporation 半導体装置及び半導体装置の特性の調整方法
JP2009021398A (ja) * 2007-07-12 2009-01-29 Seiko Epson Corp 半導体チップ及び半導体チップへのプロセス・デバイス情報書き込み方法
US8482307B2 (en) 2009-06-05 2013-07-09 Hubbell Incorporated Method and apparatus for the prevention of untested or improperly tested printed circuit boards from being used in a fire pump control system
EP2625708A4 (de) 2010-10-04 2014-10-08 Sandisk Semiconductor Shanghai Co Ltd Rückverfolgbarkeit von einzelnen komponenten und vorverfolgbarkeit von halbleiterbauelementen
KR20120105828A (ko) * 2011-03-16 2012-09-26 삼성전자주식회사 반도체 발광다이오드 칩, 그 제조방법 및 품질관리방법
TWI467574B (zh) * 2011-11-01 2015-01-01 Phison Electronics Corp 記憶體儲存裝置、記憶體控制器與其資料傳輸方法
JP5337273B2 (ja) * 2012-04-18 2013-11-06 力晶科技股▲ふん▼有限公司 半導体記憶装置とそのｉｄコード及び上位アドレスの書き込み方法、並びにテスタ装置、テスタ装置のためのテスト方法
IN2014DN07350A (de) * 2012-08-08 2015-04-24 Varonis Sys Ltd
US9214211B2 (en) * 2014-05-15 2015-12-15 Winbond Electronics Corporation Methods of and apparatus for determining unique die identifiers for multiple memory die within a common package
US10483213B2 (en) * 2017-09-13 2019-11-19 Stmicroelectronics S.R.L. Die identification by optically reading selectively blowable fuse elements

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4055802A (en) * 1976-08-12 1977-10-25 Bell Telephone Laboratories, Incorporated Electrical identification of multiply configurable circuit array
GB1584343A (en) * 1977-06-07 1981-02-11 Tokyo Shibaura Electric Co Apparatus for marking identification symbols on wafer
US4150331A (en) * 1977-07-29 1979-04-17 Burroughs Corporation Signature encoding for integrated circuits
EP0057645A1 (de) * 1981-02-04 1982-08-11 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Elektrisch kodierte Identifizierung von integrierten Schaltungsanordnungen
US4419747A (en) * 1981-09-14 1983-12-06 Seeq Technology, Inc. Method and device for providing process and test information in semiconductors
US4451903A (en) * 1981-09-14 1984-05-29 Seeq Technology, Inc. Method and device for encoding product and programming information in semiconductors
JPS59150464A (ja) * 1983-02-15 1984-08-28 Toshiba Corp 半導体装置
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
ATE82646T1 (de) * 1988-07-20 1992-12-15 Siemens Ag Verfahren zum unterscheidbarmachen von elektronischen schaltungen mit nichtfluechtigem speicher.
US5031152A (en) * 1989-09-29 1991-07-09 Sgs-Thomson Microelectronics, Inc. Test circuit for non-volatile storage cell
US5079725A (en) * 1989-11-17 1992-01-07 Ibm Corporation Chip identification method for use with scan design systems and scan testing techniques
US5056061A (en) * 1989-12-20 1991-10-08 N. A. Philips Corporation Circuit for encoding identification information on circuit dice using fet capacitors
US5254482A (en) * 1990-04-16 1993-10-19 National Semiconductor Corporation Ferroelectric capacitor test structure for chip die
KR920007535B1 (ko) * 1990-05-23 1992-09-05 삼성전자 주식회사 식별회로를 구비한 반도체 집적회로 칩

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10115280A1 (de) * 2001-03-28 2002-10-24 Infineon Technologies Ag Verfahren zum Klassifizieren von Bauelementen
DE10115280C2 (de) * 2001-03-28 2003-12-24 Infineon Technologies Ag Verfahren zum Klassifizieren von Bauelementen

Also Published As

Publication number Publication date
JPH0697240A (ja) 1994-04-08
DE69320433D1 (de) 1998-09-24
US5642307A (en) 1997-06-24
EP0578410A3 (de) 1995-01-18
JP3659981B2 (ja) 2005-06-15
EP0578410B1 (de) 1998-08-19
EP0578410A2 (de) 1994-01-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC. MAPLES CORPORATE SERVICES, KY