DE69316055D1 - Lichtquelle - Google Patents
LichtquelleInfo
- Publication number
- DE69316055D1 DE69316055D1 DE69316055T DE69316055T DE69316055D1 DE 69316055 D1 DE69316055 D1 DE 69316055D1 DE 69316055 T DE69316055 T DE 69316055T DE 69316055 T DE69316055 T DE 69316055T DE 69316055 D1 DE69316055 D1 DE 69316055D1
- Authority
- DE
- Germany
- Prior art keywords
- light source
- source
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0045—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide
- G02B6/0046—Tapered light guide, e.g. wedge-shaped light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0038—Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/0418—Constructional details
- G09F2013/05—Constructional details indicating exit way or orientation
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/18—Edge-illuminated signs
- G09F2013/1804—Achieving homogeneous illumination
- G09F2013/1822—Stair-cased profiled window
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Discharging, Photosensitive Material Shape In Electrophotography (AREA)
- Facsimile Scanning Arrangements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5268692 | 1992-03-11 | ||
JP23045192A JP3025109B2 (ja) | 1992-03-11 | 1992-08-28 | 光源および光源装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69316055D1 true DE69316055D1 (de) | 1998-02-12 |
DE69316055T2 DE69316055T2 (de) | 1998-07-02 |
Family
ID=26393326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69316055T Expired - Lifetime DE69316055T2 (de) | 1992-03-11 | 1993-03-11 | Lichtquelle |
Country Status (4)
Country | Link |
---|---|
US (1) | US5418384A (de) |
EP (1) | EP0560605B1 (de) |
JP (1) | JP3025109B2 (de) |
DE (1) | DE69316055T2 (de) |
Families Citing this family (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW305035B (de) * | 1993-01-19 | 1997-05-11 | Canon Kk | |
US6426807B1 (en) | 1993-01-19 | 2002-07-30 | Canon Kabushiki Kaisha | Light guide, illuminating device having the light guide, and image reading device and information processing apparatus having the illuminating device |
US5555329A (en) * | 1993-11-05 | 1996-09-10 | Alliesignal Inc. | Light directing optical structure |
US6268600B1 (en) | 1994-08-01 | 2001-07-31 | Matsushita Electric Industrial Co., Ltd. | Linear illumination device |
US5969343A (en) * | 1995-08-24 | 1999-10-19 | Matsushita Electric Industrial Co., Ltd. | Linear illumination device |
US5927845A (en) | 1995-08-28 | 1999-07-27 | Stantech | Integrally formed linear light strip with light emitting diodes |
US5848837A (en) * | 1995-08-28 | 1998-12-15 | Stantech | Integrally formed linear light strip with light emitting diodes |
JP3318171B2 (ja) * | 1995-11-10 | 2002-08-26 | 株式会社リコー | 発光ダイオードアレイおよび光書込装置 |
JP3444065B2 (ja) * | 1995-12-06 | 2003-09-08 | 松下電器産業株式会社 | 密着型イメージセンサー |
JP3176303B2 (ja) | 1996-02-09 | 2001-06-18 | キヤノン株式会社 | 信号処理装置 |
DE19615839A1 (de) * | 1996-04-20 | 1997-10-23 | Abb Patent Gmbh | SMD-Leuchtdiode |
EP0846915B1 (de) * | 1996-12-04 | 2003-08-27 | Siteco Beleuchtungstechnik GmbH | Innenraumleuchte |
JPH11134918A (ja) * | 1997-03-04 | 1999-05-21 | Matsushita Electric Ind Co Ltd | 線状照明装置 |
JPH10260405A (ja) | 1997-03-18 | 1998-09-29 | Seiko Epson Corp | 照明装置、液晶表示装置及び電子機器 |
DE29706201U1 (de) * | 1997-03-27 | 1997-05-28 | Osa Elektronik Gmbh | Leucht- oder Anzeigeelement mit einer Lichteinkopplung in einen Lichtleitkörper |
JP3673063B2 (ja) * | 1997-08-06 | 2005-07-20 | ローム株式会社 | 画像読み取り装置 |
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US6200134B1 (en) | 1998-01-20 | 2001-03-13 | Kerr Corporation | Apparatus and method for curing materials with radiation |
USD428659S (en) * | 1998-08-12 | 2000-07-25 | Nortel Networks Corporation | Lightpipe |
JP4172558B2 (ja) * | 1998-11-11 | 2008-10-29 | シチズン電子株式会社 | 赤外線通信デバイス |
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EP1089069A3 (de) * | 1999-10-01 | 2001-08-29 | CorkOpt Limited | Lineare Beleuchtung |
US7053419B1 (en) | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
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WO2012004724A1 (en) * | 2010-07-08 | 2012-01-12 | Koninklijke Philips Electronics N.V. | Leadframe led lighting assembly |
RU2462658C2 (ru) * | 2010-07-19 | 2012-09-27 | Закрытое акционерное общество "Производственное объединение "Электроточприбор" | Светильник |
JP5285038B2 (ja) | 2010-08-31 | 2013-09-11 | シャープ株式会社 | 投光構造体および照明装置 |
WO2012058304A2 (en) | 2010-10-28 | 2012-05-03 | Banyan Energy, Inc. | Redirecting optics for concentration and illumination systems |
JP2012142410A (ja) * | 2010-12-28 | 2012-07-26 | Rohm Co Ltd | 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置 |
WO2014011748A1 (en) | 2012-07-10 | 2014-01-16 | Soundoff Signal, Inc. | Emergency vehicle light fixture |
DE102013227195A1 (de) * | 2013-12-27 | 2015-07-02 | Automotive Lighting Reutlingen Gmbh | Kraftfahrzeugleuchte mit einem linien- oder flächenhaften Erscheinungsbild |
RU2581604C2 (ru) * | 2014-05-20 | 2016-04-20 | Акционерное общество "Научно-производственное объединение автоматики имени академика Н.А. Семихатова" | Светодиодный светильник |
CZ2017498A3 (cs) * | 2017-08-29 | 2019-03-13 | Varroc Lighting Systems, s.r.o. | Optický systém směrového indikátoru pro motorová vozidla, zejména progresivního směrového indikátoru |
TWI761275B (zh) * | 2021-08-05 | 2022-04-11 | 坦德科技股份有限公司 | 車用信號燈具結構以及車用日行燈 |
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DE3123369A1 (de) * | 1981-06-12 | 1983-02-03 | Vdo Schindling | Lichtleiter |
JPS58222578A (ja) * | 1982-06-18 | 1983-12-24 | Toshiba Corp | 照明装置 |
JPS59127879A (ja) * | 1983-01-12 | 1984-07-23 | Semiconductor Energy Lab Co Ltd | 光電変換装置およびその作製方法 |
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JPH0812497B2 (ja) * | 1987-07-07 | 1996-02-07 | コニカ株式会社 | 画像形成装置 |
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JPH0365982A (ja) * | 1989-08-03 | 1991-03-20 | Pioneer Electron Corp | 表示装置における表示板照明装置 |
US5017986A (en) * | 1989-08-28 | 1991-05-21 | At&T Bell Laboratories | Optical device mounting apparatus |
US5050946A (en) * | 1990-09-27 | 1991-09-24 | Compaq Computer Corporation | Faceted light pipe |
US5237641A (en) * | 1992-03-23 | 1993-08-17 | Nioptics Corporation | Tapered multilayer luminaire devices |
-
1992
- 1992-08-28 JP JP23045192A patent/JP3025109B2/ja not_active Expired - Lifetime
-
1993
- 1993-03-05 US US08/026,841 patent/US5418384A/en not_active Expired - Lifetime
- 1993-03-11 EP EP93301844A patent/EP0560605B1/de not_active Expired - Lifetime
- 1993-03-11 DE DE69316055T patent/DE69316055T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0560605A1 (de) | 1993-09-15 |
JPH05316296A (ja) | 1993-11-26 |
EP0560605B1 (de) | 1998-01-07 |
US5418384A (en) | 1995-05-23 |
JP3025109B2 (ja) | 2000-03-27 |
DE69316055T2 (de) | 1998-07-02 |
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