DE69233363D1 - Bipolarer Transistor vom isolierten Gatetyp mit Überspannungschutz - Google Patents

Bipolarer Transistor vom isolierten Gatetyp mit Überspannungschutz

Info

Publication number
DE69233363D1
DE69233363D1 DE69233363T DE69233363T DE69233363D1 DE 69233363 D1 DE69233363 D1 DE 69233363D1 DE 69233363 T DE69233363 T DE 69233363T DE 69233363 T DE69233363 T DE 69233363T DE 69233363 D1 DE69233363 D1 DE 69233363D1
Authority
DE
Germany
Prior art keywords
bipolar transistor
insulated gate
overvoltage protection
gate type
type bipolar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69233363T
Other languages
English (en)
Other versions
DE69233363T2 (de
Inventor
Naoto Okabe
Norihito Tokura
Naohito Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Application granted granted Critical
Publication of DE69233363D1 publication Critical patent/DE69233363D1/de
Publication of DE69233363T2 publication Critical patent/DE69233363T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395—Vertical transistors, e.g. vertical IGBT

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
DE69233363T 1991-03-12 1992-03-11 Bipolarer Transistor vom isolierten Gatetyp mit Überspannungschutz Expired - Lifetime DE69233363T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4671091 1991-03-12
JP3046710A JP2862027B2 (ja) 1991-03-12 1991-03-12 絶縁ゲート型バイポーラトランジスタ

Publications (2)

Publication Number Publication Date
DE69233363D1 true DE69233363D1 (de) 2004-07-15
DE69233363T2 DE69233363T2 (de) 2005-06-02

Family

ID=12754916

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69233363T Expired - Lifetime DE69233363T2 (de) 1991-03-12 1992-03-11 Bipolarer Transistor vom isolierten Gatetyp mit Überspannungschutz

Country Status (4)

Country Link
US (1) US5973338A (de)
EP (1) EP0503605B1 (de)
JP (1) JP2862027B2 (de)
DE (1) DE69233363T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3081739B2 (ja) * 1992-10-20 2000-08-28 三菱電機株式会社 絶縁ゲート型半導体装置及びその製造方法
JP3216315B2 (ja) * 1993-04-02 2001-10-09 株式会社デンソー 絶縁ゲート型バイポーラトランジスタ
US5719412A (en) * 1993-04-02 1998-02-17 Nippondenso Co., Ltd Insulated gate bipolar transistor
EP0665597A1 (de) * 1994-01-27 1995-08-02 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe IGBT und Herstellungsverfahren dafür
JP2870402B2 (ja) * 1994-03-10 1999-03-17 株式会社デンソー 絶縁ゲート型電界効果トランジスタ
US5723882A (en) * 1994-03-10 1998-03-03 Nippondenso Co., Ltd. Insulated gate field effect transistor having guard ring regions
JP3355851B2 (ja) * 1995-03-07 2002-12-09 株式会社デンソー 絶縁ゲート型電界効果トランジスタ及びその製造方法
DE59711481D1 (de) * 1996-02-05 2004-05-06 Infineon Technologies Ag Durch Feldeffekt steuerbares Halbleiterbauelement
JP3918209B2 (ja) 1996-09-11 2007-05-23 株式会社デンソー 絶縁ゲート型バイポーラトランジスタ及びその製造方法
US6054752A (en) * 1997-06-30 2000-04-25 Denso Corporation Semiconductor device
JP4181322B2 (ja) 1999-08-19 2008-11-12 インフィネオン テクノロジーズ アクチエンゲゼルシャフト 垂直方向に構造化された電力半導体モジュール
JP4164962B2 (ja) 1999-10-08 2008-10-15 株式会社デンソー 絶縁ゲート型バイポーラトランジスタ
JP4460741B2 (ja) * 2000-09-27 2010-05-12 株式会社東芝 電力用半導体素子及びその製造方法
DE102004017723B4 (de) * 2003-04-10 2011-12-08 Fuji Electric Co., Ltd In Rückwärtsrichtung sperrendes Halbleiterbauteil und Verfahren zu seiner Herstellung
US9166048B2 (en) * 2012-09-16 2015-10-20 Sensor Electronic Technology, Inc. Lateral/vertical semiconductor device
US9391189B2 (en) 2012-09-16 2016-07-12 Sensor Electronic Technology, Inc. Lateral/vertical semiconductor device
US9660038B2 (en) 2012-09-16 2017-05-23 Sensor Electronic Technology, Inc. Lateral/vertical semiconductor device
JP6476317B2 (ja) * 2015-12-01 2019-02-27 シャープ株式会社 アバランシェフォトダイオード

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4041517A (en) * 1974-09-04 1977-08-09 Tokyo Shibaura Electric Co., Ltd. Vertical type junction field effect semiconductor device
IE53895B1 (en) * 1981-11-23 1989-04-12 Gen Electric Semiconductor device having rapid removal of majority carriers from an active base region thereof at device turn-off and method of fabricating this device
US4672407A (en) * 1984-05-30 1987-06-09 Kabushiki Kaisha Toshiba Conductivity modulated MOSFET
JPH07123166B2 (ja) * 1986-11-17 1995-12-25 日産自動車株式会社 電導度変調形ｍｏｓｆｅｔ
JP2786196B2 (ja) * 1987-07-21 1998-08-13 株式会社デンソー 絶縁ゲート型半導体装置
JPH02112285A (ja) * 1988-10-21 1990-04-24 Hitachi Ltd 伝導度変調型ｍｏｓｆｅｔ
US4994871A (en) * 1988-12-02 1991-02-19 General Electric Company Insulated gate bipolar transistor with improved latch-up current level and safe operating area
US5095343A (en) * 1989-06-14 1992-03-10 Harris Corporation Power MOSFET
EP0405200A1 (de) * 1989-06-30 1991-01-02 Asea Brown Boveri Ag MOS-gesteuertes, bipolares Leistungshalbleiter-Bauelement
EP0416805B1 (de) * 1989-08-30 1996-11-20 Siliconix, Inc. Transistor mit Spannungsbegrenzungsanordnung
EP0450082B1 (de) * 1989-08-31 2004-04-28 Denso Corporation Bipolarer transistor mit isolierter steuerelektrode
US5399883A (en) * 1994-05-04 1995-03-21 North Carolina State University At Raleigh High voltage silicon carbide MESFETs and methods of fabricating same

Also Published As

Publication number Publication date
DE69233363T2 (de) 2005-06-02
US5973338A (en) 1999-10-26
JP2862027B2 (ja) 1999-02-24
JPH04283968A (ja) 1992-10-08
EP0503605A2 (de) 1992-09-16
EP0503605A3 (en) 1993-05-19
EP0503605B1 (de) 2004-06-09

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition