DE69219057T2 - Tunneleffekttransistor - Google Patents

Tunneleffekttransistor

Info

Publication number
DE69219057T2
DE69219057T2 DE69219057T DE69219057T DE69219057T2 DE 69219057 T2 DE69219057 T2 DE 69219057T2 DE 69219057 T DE69219057 T DE 69219057T DE 69219057 T DE69219057 T DE 69219057T DE 69219057 T2 DE69219057 T2 DE 69219057T2
Authority
DE
Germany
Prior art keywords
semiconductor layer
tunnel
semiconductor
transistor according
tunnel transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69219057T
Other languages
German (de)
English (en)
Other versions
DE69219057D1 (de
Inventor
Toshio Baba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Application granted granted Critical
Publication of DE69219057D1 publication Critical patent/DE69219057D1/de
Publication of DE69219057T2 publication Critical patent/DE69219057T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/211—Gated diodes

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
DE69219057T 1991-10-15 1992-10-15 Tunneleffekttransistor Expired - Fee Related DE69219057T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3265749A JP2773487B2 (ja) 1991-10-15 1991-10-15 トンネルトランジスタ

Publications (2)

Publication Number Publication Date
DE69219057D1 DE69219057D1 (de) 1997-05-22
DE69219057T2 true DE69219057T2 (de) 1998-02-26

Family

ID=17421473

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69219057T Expired - Fee Related DE69219057T2 (de) 1991-10-15 1992-10-15 Tunneleffekttransistor

Country Status (4)

Country Link
US (1) US5589696A (enExample)
EP (1) EP0538036B1 (enExample)
JP (1) JP2773487B2 (enExample)
DE (1) DE69219057T2 (enExample)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69202554T2 (de) * 1991-12-25 1995-10-19 Nippon Electric Co Tunneltransistor und dessen Herstellungsverfahren.
US6693317B2 (en) * 2001-07-13 2004-02-17 Taiwan Semiconductor Manufacturing Company Optical sensor by using tunneling diode
AU2003258948A1 (en) * 2002-06-19 2004-01-06 The Board Of Trustees Of The Leland Stanford Junior University Insulated-gate semiconductor device and approach involving junction-induced intermediate region
WO2004084292A1 (en) 2003-03-20 2004-09-30 Matsushita Electric Industrial Co., Ltd. Finfet-type semiconductor device and method for fabricating the same
US9153645B2 (en) 2005-05-17 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US8324660B2 (en) 2005-05-17 2012-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
WO2007014294A2 (en) 2005-07-26 2007-02-01 Amberwave Systems Corporation Solutions integrated circuit integration of alternative active area materials
US7638842B2 (en) 2005-09-07 2009-12-29 Amberwave Systems Corporation Lattice-mismatched semiconductor structures on insulators
US8441000B2 (en) * 2006-02-01 2013-05-14 International Business Machines Corporation Heterojunction tunneling field effect transistors, and methods for fabricating the same
WO2007112066A2 (en) 2006-03-24 2007-10-04 Amberwave Systems Corporation Lattice-mismatched semiconductor structures and related methods for device fabrication
WO2008030574A1 (en) 2006-09-07 2008-03-13 Amberwave Systems Corporation Defect reduction using aspect ratio trapping
WO2008039495A1 (en) 2006-09-27 2008-04-03 Amberwave Systems Corporation Tri-gate field-effect transistors formed by aspect ratio trapping
WO2008039534A2 (en) 2006-09-27 2008-04-03 Amberwave Systems Corporation Quantum tunneling devices and circuits with lattice- mismatched semiconductor structures
US20080187018A1 (en) 2006-10-19 2008-08-07 Amberwave Systems Corporation Distributed feedback lasers formed via aspect ratio trapping
US8120115B2 (en) * 2007-03-12 2012-02-21 Imec Tunnel field-effect transistor with gated tunnel barrier
US8237151B2 (en) 2009-01-09 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Diode-based devices and methods for making the same
US7825328B2 (en) 2007-04-09 2010-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Nitride-based multi-junction solar cell modules and methods for making the same
WO2008124154A2 (en) 2007-04-09 2008-10-16 Amberwave Systems Corporation Photovoltaics on silicon
US8304805B2 (en) 2009-01-09 2012-11-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor diodes fabricated by aspect ratio trapping with coalesced films
US8329541B2 (en) 2007-06-15 2012-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. InP-based transistor fabrication
US8344242B2 (en) 2007-09-07 2013-01-01 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-junction solar cells
US8183667B2 (en) 2008-06-03 2012-05-22 Taiwan Semiconductor Manufacturing Co., Ltd. Epitaxial growth of crystalline material
US8274097B2 (en) 2008-07-01 2012-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. Reduction of edge effects from aspect ratio trapping
US8981427B2 (en) 2008-07-15 2015-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing of small composite semiconductor materials
US20100072515A1 (en) 2008-09-19 2010-03-25 Amberwave Systems Corporation Fabrication and structures of crystalline material
CN102160145B (zh) 2008-09-19 2013-08-21 台湾积体电路制造股份有限公司 通过外延层过成长的元件形成
US8253211B2 (en) 2008-09-24 2012-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor sensor structures with reduced dislocation defect densities
EP2415083B1 (en) 2009-04-02 2017-06-21 Taiwan Semiconductor Manufacturing Company, Ltd. Devices formed from a non-polar plane of a crystalline material and method of making the same
JP5910965B2 (ja) * 2012-03-07 2016-04-27 国立研究開発法人産業技術総合研究所 トンネル電界効果トランジスタの製造方法及びトンネル電界効果トランジスタ
EP2674978B1 (en) * 2012-06-15 2020-07-29 IMEC vzw Tunnel field effect transistor device and method for making the device
JP2014053435A (ja) 2012-09-06 2014-03-20 Toshiba Corp 半導体装置
EP2808897B1 (en) 2013-05-30 2021-06-30 IMEC vzw Tunnel field effect transistor and method for making thereof
US8975123B2 (en) 2013-07-09 2015-03-10 International Business Machines Corporation Tunnel field-effect transistors with a gate-swing broken-gap heterostructure
JP6331375B2 (ja) * 2013-12-17 2018-05-30 富士通株式会社 電界効果型半導体装置
JP6175411B2 (ja) * 2014-06-16 2017-08-02 東芝メモリ株式会社 半導体装置
WO2016168994A1 (zh) * 2015-04-22 2016-10-27 华为技术有限公司 隧穿晶体管及隧穿晶体管的制备方法
CN109065615B (zh) * 2018-06-12 2021-05-07 西安电子科技大学 一种新型平面InAs/Si异质隧穿场效应晶体管及其制备方法
CN110459541B (zh) * 2019-06-27 2022-05-13 西安电子科技大学 一种平面互补型隧穿场效应晶体管反相器
CN111640791A (zh) * 2020-04-26 2020-09-08 西安电子科技大学 基于InAs/GaSb异质结的量子阱隧穿场效应晶体管及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3390352A (en) * 1961-11-06 1968-06-25 Itt Tunnel-effect semiconductor, used as an oscillator or amplifier, forms part of surface of waveguide or chamber
JPH0673375B2 (ja) * 1984-03-19 1994-09-14 富士通株式会社 半導体装置の製造方法
EP0181191B1 (en) * 1984-11-05 1996-02-28 Hitachi, Ltd. Superconducting device
JPS63250855A (ja) * 1987-04-08 1988-10-18 Hitachi Ltd バイポ−ラ型トランジスタ
US4969019A (en) * 1987-08-27 1990-11-06 Texas Instruments Incorporated Three-terminal tunnel device
JPH02268429A (ja) * 1989-04-11 1990-11-02 Tokyo Electron Ltd プラズマエッチング装置
US5105247A (en) * 1990-08-03 1992-04-14 Cavanaugh Marion E Quantum field effect device with source extension region formed under a gate and between the source and drain regions
DE69119022T2 (de) * 1990-10-08 1996-10-31 Sumitomo Electric Industries Supraleitende Einrichtung mit ultradünnem Kanal aus oxydisch supraleitendem Material und Verfahren zu deren Herstellung
JPH05235057A (ja) * 1992-02-19 1993-09-10 Sanyo Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
EP0538036B1 (en) 1997-04-16
EP0538036A3 (enExample) 1995-03-22
JP2773487B2 (ja) 1998-07-09
JPH05110086A (ja) 1993-04-30
EP0538036A2 (en) 1993-04-21
US5589696A (en) 1996-12-31
DE69219057D1 (de) 1997-05-22

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee