DE69033841D1 - DRAM-Zelle mit Grabenkondensator und vergrabenen Seitenkontakten - Google Patents

DRAM-Zelle mit Grabenkondensator und vergrabenen Seitenkontakten

Info

Publication number
DE69033841D1
DE69033841D1 DE69033841T DE69033841T DE69033841D1 DE 69033841 D1 DE69033841 D1 DE 69033841D1 DE 69033841 T DE69033841 T DE 69033841T DE 69033841 T DE69033841 T DE 69033841T DE 69033841 D1 DE69033841 D1 DE 69033841D1
Authority
DE
Germany
Prior art keywords
side contacts
dram cell
trench capacitor
buried side
buried
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69033841T
Other languages
English (en)
Other versions
DE69033841T2 (de
Inventor
Bing-Whey Shen
Masaaki Yashiro
Randy Mckee
Gishi Chung
Kiyoshi Shirai
Clarence Teng
Coleman, Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69033841D1 publication Critical patent/DE69033841D1/de
Publication of DE69033841T2 publication Critical patent/DE69033841T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69033841T 1989-07-25 1990-07-18 DRAM-Zelle mit Grabenkondensator und vergrabenen Seitenkontakten Expired - Fee Related DE69033841T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/385,327 US4978634A (en) 1989-07-25 1989-07-25 Method of making trench DRAM cell with stacked capacitor and buried lateral contact

Publications (2)

Publication Number Publication Date
DE69033841D1 true DE69033841D1 (de) 2001-12-06
DE69033841T2 DE69033841T2 (de) 2002-05-29

Family

ID=23520952

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69033841T Expired - Fee Related DE69033841T2 (de) 1989-07-25 1990-07-18 DRAM-Zelle mit Grabenkondensator und vergrabenen Seitenkontakten

Country Status (5)

Country Link
US (1) US4978634A (de)
EP (1) EP0418491B1 (de)
JP (1) JPH03149875A (de)
KR (1) KR100198769B1 (de)
DE (1) DE69033841T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5064498A (en) * 1990-08-21 1991-11-12 Texas Instruments Incorporated Silicon backside etch for semiconductors
US5097381A (en) * 1990-10-11 1992-03-17 Micron Technology, Inc. Double sidewall trench capacitor cell
US5065273A (en) * 1990-12-04 1991-11-12 International Business Machines Corporation High capacity DRAM trench capacitor and methods of fabricating same
DE69224730T2 (de) 1991-12-31 1998-07-30 Sgs Thomson Microelectronics Seitenwand-Abstandsstruktur für Feldeffekttransistor
US5363327A (en) * 1993-01-19 1994-11-08 International Business Machines Corporation Buried-sidewall-strap two transistor one capacitor trench cell
US5429978A (en) * 1994-06-22 1995-07-04 Industrial Technology Research Institute Method of forming a high density self-aligned stack in trench
US5595926A (en) * 1994-06-29 1997-01-21 Industrial Technology Research Institute Method for fabricating a DRAM trench capacitor with recessed pillar
US5627092A (en) * 1994-09-26 1997-05-06 Siemens Aktiengesellschaft Deep trench dram process on SOI for low leakage DRAM cell
US5444013A (en) * 1994-11-02 1995-08-22 Micron Technology, Inc. Method of forming a capacitor
KR100212419B1 (ko) * 1995-11-06 1999-08-02 김영환 디램의 전하저장전극 콘택홀 형성방법
US6083849A (en) 1995-11-13 2000-07-04 Micron Technology, Inc. Methods of forming hemispherical grain polysilicon
US5926717A (en) * 1996-12-10 1999-07-20 Advanced Micro Devices, Inc. Method of making an integrated circuit with oxidizable trench liner
EP0973203A3 (de) * 1998-07-17 2001-02-14 Infineon Technologies AG Halbleiterschicht mit lateral veränderlicher Dotierung und Verfahren zu dessen Herstellung
JP3205306B2 (ja) * 1998-12-08 2001-09-04 松下電器産業株式会社 半導体装置およびその製造方法
TW463311B (en) * 2000-10-02 2001-11-11 United Microelectronics Corp Manufacturing method of bit line
US6686235B2 (en) 2001-04-12 2004-02-03 Micron Technology, Inc. Buried digit spacer-separated capacitor array
US8872344B2 (en) 2010-06-09 2014-10-28 Texas Instruments Incorporated Conductive via structures for routing porosity and low via resistance, and processes of making
JP5581853B2 (ja) * 2010-06-30 2014-09-03 富士通セミコンダクター株式会社 半導体装置およびその製造方法
US11295893B2 (en) 2018-02-16 2022-04-05 KYOCERA AVX Components Corporation Self-aligning capacitor electrode assembly having improved breakdown voltage

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812739B2 (ja) * 1975-05-07 1983-03-10 株式会社日立製作所 半導体記憶装置
US4225945A (en) * 1976-01-12 1980-09-30 Texas Instruments Incorporated Random access MOS memory cell using double level polysilicon
JPS5511365A (en) * 1978-07-11 1980-01-26 Pioneer Electronic Corp Semiconductor memory
JPS5681968A (en) * 1979-12-07 1981-07-04 Toshiba Corp Manufacture of semiconductor device
US4353086A (en) * 1980-05-07 1982-10-05 Bell Telephone Laboratories, Incorporated Silicon integrated circuits
US4397075A (en) * 1980-07-03 1983-08-09 International Business Machines Corporation FET Memory cell structure and process
JPS58154256A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置
JPS5982761A (ja) * 1982-11-04 1984-05-12 Hitachi Ltd 半導体メモリ
JPS59161860A (ja) * 1983-03-07 1984-09-12 Hitachi Ltd 半導体メモリ装置
JPS6012752A (ja) * 1983-07-01 1985-01-23 Nippon Telegr & Teleph Corp <Ntt> 半導体記憶装置およびその製造方法
US4717942A (en) * 1983-07-29 1988-01-05 Nec Corporation Dynamic ram with capacitor groove surrounding switching transistor
JPS6023507B2 (ja) * 1983-11-21 1985-06-07 株式会社日立製作所 半導体記憶装置
JPS60213053A (ja) * 1984-04-09 1985-10-25 Oki Electric Ind Co Ltd 半導体メモリ素子
JPH0616549B2 (ja) * 1984-04-17 1994-03-02 三菱電機株式会社 半導体集積回路装置
EP0167764B1 (de) * 1984-06-14 1989-08-16 International Business Machines Corporation Dynamische RAM-Zelle
JPH079944B2 (ja) * 1984-07-30 1995-02-01 株式会社東芝 半導体メモリ装置
US4797373A (en) * 1984-10-31 1989-01-10 Texas Instruments Incorporated Method of making dRAM cell with trench capacitor
US4791463A (en) * 1984-10-31 1988-12-13 Texas Instruments Incorporated Structure for contacting devices in three dimensional circuitry
JPS61135151A (ja) * 1984-12-05 1986-06-23 Mitsubishi Electric Corp 半導体記憶装置
US4785337A (en) * 1986-10-17 1988-11-15 International Business Machines Corporation Dynamic ram cell having shared trench storage capacitor with sidewall-defined bridge contacts and gate electrodes
US4830978A (en) * 1987-03-16 1989-05-16 Texas Instruments Incorporated Dram cell and method
JPS63260164A (ja) * 1987-04-17 1988-10-27 Oki Electric Ind Co Ltd 半導体記憶装置及びその製造方法
JPH01183152A (ja) * 1988-01-18 1989-07-20 Oki Electric Ind Co Ltd 半導体記憶装置及びその製造方法
JPH01192164A (ja) * 1988-01-28 1989-08-02 Fujitsu Ltd 半導体装置とその製造方法

Also Published As

Publication number Publication date
DE69033841T2 (de) 2002-05-29
EP0418491A3 (en) 1991-09-25
US4978634A (en) 1990-12-18
EP0418491B1 (de) 2001-10-31
EP0418491A2 (de) 1991-03-27
JPH03149875A (ja) 1991-06-26
KR910003813A (ko) 1991-02-28
KR100198769B1 (ko) 1999-06-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee