DE69032735D1 - Verfahren zum Herstellen von Hochspannungs- und Niederspannungs-CMOS-Transistoren in einem einzigen integrierten Schaltungs-Chip - Google Patents
Verfahren zum Herstellen von Hochspannungs- und Niederspannungs-CMOS-Transistoren in einem einzigen integrierten Schaltungs-ChipInfo
- Publication number
- DE69032735D1 DE69032735D1 DE69032735T DE69032735T DE69032735D1 DE 69032735 D1 DE69032735 D1 DE 69032735D1 DE 69032735 T DE69032735 T DE 69032735T DE 69032735 T DE69032735 T DE 69032735T DE 69032735 D1 DE69032735 D1 DE 69032735D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- circuit chip
- single integrated
- cmos transistors
- manufacturing high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0922—Combination of complementary transistors having a different structure, e.g. stacked CMOS, high-voltage and low-voltage CMOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823857—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/324,869 US5047358A (en) | 1989-03-17 | 1989-03-17 | Process for forming high and low voltage CMOS transistors on a single integrated circuit chip |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69032735D1 true DE69032735D1 (de) | 1998-12-10 |
DE69032735T2 DE69032735T2 (de) | 1999-04-01 |
Family
ID=23265446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69032735T Expired - Fee Related DE69032735T2 (de) | 1989-03-17 | 1990-02-09 | Verfahren zum Herstellen von Hochspannungs- und Niederspannungs-CMOS-Transistoren in einem einzigen integrierten Schaltungs-Chip |
Country Status (5)
Country | Link |
---|---|
US (1) | US5047358A (de) |
EP (1) | EP0387999B1 (de) |
JP (1) | JP2510751B2 (de) |
KR (1) | KR930010121B1 (de) |
DE (1) | DE69032735T2 (de) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5260226A (en) * | 1987-07-10 | 1993-11-09 | Kabushiki Kaisha Toshiba | Semiconductor device having different impurity concentration wells |
JP3017809B2 (ja) * | 1991-01-09 | 2000-03-13 | 株式会社東芝 | アナログ・デジタル混載半導体集積回路装置 |
JP3206026B2 (ja) * | 1991-07-19 | 2001-09-04 | 富士電機株式会社 | 高電圧用misfetを備える半導体装置 |
US5759869A (en) * | 1991-12-31 | 1998-06-02 | Sgs-Thomson Microelectronics, Inc. | Method to imporve metal step coverage by contact reflow |
DE69332006T2 (de) * | 1992-03-25 | 2002-11-28 | Texas Instruments Inc., Dallas | Planares Verfahren unter Verwendung von gemeinsamen Ausrichtungsmarken für die Wannenimplantierungen |
US5242841A (en) * | 1992-03-25 | 1993-09-07 | Texas Instruments Incorporated | Method of making LDMOS transistor with self-aligned source/backgate and photo-aligned gate |
JPH05308128A (ja) * | 1992-04-30 | 1993-11-19 | Fuji Electric Co Ltd | 半導体装置およびその製造方法 |
JP2861624B2 (ja) * | 1992-05-13 | 1999-02-24 | 日本電気株式会社 | 半導体装置の製造方法 |
US5366916A (en) * | 1993-02-04 | 1994-11-22 | Delco Electronics Corporation | Method of making a high voltage implanted channel device for VLSI and ULSI processes |
US5424663A (en) * | 1993-04-22 | 1995-06-13 | North American Philips Corporation | Integrated high voltage differential sensor using the inverse gain of high voltage transistors |
US5468666A (en) * | 1993-04-29 | 1995-11-21 | Texas Instruments Incorporated | Using a change in doping of poly gate to permit placing both high voltage and low voltage transistors on the same chip |
US5376568A (en) * | 1994-01-25 | 1994-12-27 | United Microelectronics Corp. | Method of fabricating high voltage complementary metal oxide semiconductor transistors |
WO1995022174A1 (en) * | 1994-02-15 | 1995-08-17 | National Semiconductor Corporation | High-voltage cmos transistors for a standard cmos process |
US5475335A (en) * | 1994-04-01 | 1995-12-12 | National Semiconductor Corporation | High voltage cascaded charge pump |
US5498554A (en) * | 1994-04-08 | 1996-03-12 | Texas Instruments Incorporated | Method of making extended drain resurf lateral DMOS devices |
US5512495A (en) * | 1994-04-08 | 1996-04-30 | Texas Instruments Incorporated | Method of manufacturing extended drain resurf lateral DMOS devices |
US5620908A (en) * | 1994-09-19 | 1997-04-15 | Kabushiki Kaisha Toshiba | Manufacturing method of semiconductor device comprising BiCMOS transistor |
JP2746175B2 (ja) * | 1995-02-28 | 1998-04-28 | 日本電気株式会社 | 高耐圧半導体装置 |
US5480830A (en) * | 1995-04-04 | 1996-01-02 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of making depleted gate transistor for high voltage operation |
JP4775357B2 (ja) * | 1995-04-12 | 2011-09-21 | 富士電機株式会社 | 高耐圧ic |
US6475846B1 (en) * | 1995-05-18 | 2002-11-05 | Texas Instruments Incorporated | Method of making floating-gate memory-cell array with digital logic transistors |
US5494843A (en) * | 1995-06-28 | 1996-02-27 | Taiwan Semiconductor Manufacturing Co. | Method for forming MOSFET devices |
DE19526183C1 (de) * | 1995-07-18 | 1996-09-12 | Siemens Ag | Verfahren zur Herstellung von mindestens zwei Transistoren in einem Halbleiterkörper |
US5547894A (en) * | 1995-12-21 | 1996-08-20 | International Business Machines Corporation | CMOS processing with low and high-current FETs |
US5880502A (en) * | 1996-09-06 | 1999-03-09 | Micron Display Technology, Inc. | Low and high voltage CMOS devices and process for fabricating same |
JPH10189762A (ja) * | 1996-12-20 | 1998-07-21 | Nec Corp | 半導体装置およびその製造方法 |
KR100220252B1 (ko) * | 1996-12-28 | 1999-09-15 | 김영환 | 반도체 소자의 제조방법 |
US5850628A (en) * | 1997-01-30 | 1998-12-15 | Hasbro, Inc. | Speech and sound synthesizers with connected memories and outputs |
JPH10223771A (ja) * | 1997-02-12 | 1998-08-21 | Yamaha Corp | 半導体装置とその製造方法 |
US6133077A (en) * | 1998-01-13 | 2000-10-17 | Lsi Logic Corporation | Formation of high-voltage and low-voltage devices on a semiconductor substrate |
US5911104A (en) * | 1998-02-20 | 1999-06-08 | Texas Instruments Incorporated | Integrated circuit combining high frequency bipolar and high power CMOS transistors |
US6124157A (en) * | 1998-03-20 | 2000-09-26 | Cypress Semiconductor Corp. | Integrated non-volatile and random access memory and method of forming the same |
US6207991B1 (en) | 1998-03-20 | 2001-03-27 | Cypress Semiconductor Corp. | Integrated non-volatile and CMOS memories having substantially the same thickness gates and methods of forming the same |
US6093585A (en) * | 1998-05-08 | 2000-07-25 | Lsi Logic Corporation | High voltage tolerant thin film transistor |
US6277682B1 (en) * | 1998-08-25 | 2001-08-21 | Texas Instruments Incorporated | Source drain implant process for mixed voltage CMOS devices |
US6638856B1 (en) | 1998-09-11 | 2003-10-28 | Cypress Semiconductor Corporation | Method of depositing metal onto a substrate |
US6136656A (en) * | 1998-10-22 | 2000-10-24 | International Business Machines Corporation | Method to create a depleted poly MOSFET |
US5976922A (en) * | 1998-11-27 | 1999-11-02 | United Microelectronics Corp. | Method for fabricating a high bias device compatible with a low bias device |
US6165849A (en) * | 1998-12-04 | 2000-12-26 | Advanced Micro Devices, Inc. | Method of manufacturing mosfet with differential gate oxide thickness on the same IC chip |
EP1011137A1 (de) * | 1998-12-16 | 2000-06-21 | STMicroelectronics S.r.l. | Verfahren zum Integrieren von Widerständen und ESD-Selbstschutz-Transistoren mit Speichermatrix |
US6524895B2 (en) | 1998-12-25 | 2003-02-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
US6743679B2 (en) | 1999-03-03 | 2004-06-01 | Koninklijke Philips Electronics N.V. | Integrated circuit devices with high and low voltage components and processes for manufacturing these devices |
SE523899C2 (sv) * | 1999-04-15 | 2004-06-01 | Ericsson Telefon Ab L M | Halvledaranordning |
DE19928795C2 (de) * | 1999-06-23 | 2001-09-13 | Infineon Technologies Ag | Kombinierte LV/HV-Technologie mit retrograd dotierter Drain-Extension für HV-Transistoren |
DE69942418D1 (de) * | 1999-11-19 | 2010-07-08 | St Microelectronics Srl | Herstellungsverfahren für elektronische Bauelemente mit Hochspannungs-MOS- und EEPROM-Transistoren |
US6262459B1 (en) * | 2000-01-18 | 2001-07-17 | United Microelectronics Corp. | High-voltage device and method for manufacturing high-voltage device |
US6660603B2 (en) * | 2000-09-21 | 2003-12-09 | Texas Instruments Incorporated | Higher voltage drain extended MOS transistors with self-aligned channel and drain extensions |
SE519382C2 (sv) * | 2000-11-03 | 2003-02-25 | Ericsson Telefon Ab L M | Integrering av självinriktade MOS-högspänningskomponenter samt halvledarstruktur innefattande sådana |
US6818494B1 (en) | 2001-03-26 | 2004-11-16 | Hewlett-Packard Development Company, L.P. | LDMOS and CMOS integrated circuit and method of making |
JP4811895B2 (ja) * | 2001-05-02 | 2011-11-09 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US6731136B2 (en) | 2001-11-01 | 2004-05-04 | Hewlett-Packard Development Company, L.P. | Differential CMOS logic with dynamic bias |
US6835622B2 (en) * | 2002-06-04 | 2004-12-28 | Taiwan Semiconductor Manufacturing Co., Ltd | Gate electrode doping method for forming semiconductor integrated circuit microelectronic fabrication with varying effective gate dielectric layer thicknesses |
US7049659B2 (en) * | 2003-09-10 | 2006-05-23 | Silicon Intergrated Systems Corp. | Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation |
JP4707947B2 (ja) * | 2003-11-14 | 2011-06-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US8253196B2 (en) | 2004-01-29 | 2012-08-28 | Enpirion, Inc. | Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same |
US7230302B2 (en) * | 2004-01-29 | 2007-06-12 | Enpirion, Inc. | Laterally diffused metal oxide semiconductor device and method of forming the same |
US8212317B2 (en) | 2004-01-29 | 2012-07-03 | Enpirion, Inc. | Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same |
US8253197B2 (en) | 2004-01-29 | 2012-08-28 | Enpirion, Inc. | Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same |
US8212316B2 (en) | 2004-01-29 | 2012-07-03 | Enpirion, Inc. | Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same |
US8212315B2 (en) | 2004-01-29 | 2012-07-03 | Enpirion, Inc. | Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same |
US8253195B2 (en) | 2004-01-29 | 2012-08-28 | Enpirion, Inc. | Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same |
US7176530B1 (en) | 2004-03-17 | 2007-02-13 | National Semiconductor Corporation | Configuration and fabrication of semiconductor structure having n-channel channel-junction field-effect transistor |
US7190026B2 (en) * | 2004-08-23 | 2007-03-13 | Enpirion, Inc. | Integrated circuit employable with a power converter |
US7232733B2 (en) * | 2004-08-23 | 2007-06-19 | Enpirion, Inc. | Method of forming an integrated circuit incorporating higher voltage devices and low voltage devices therein |
US7195981B2 (en) * | 2004-08-23 | 2007-03-27 | Enpirion, Inc. | Method of forming an integrated circuit employable with a power converter |
US7229886B2 (en) * | 2004-08-23 | 2007-06-12 | Enpirion, Inc. | Method of forming an integrated circuit incorporating higher voltage devices and low voltage devices therein |
US7186606B2 (en) * | 2004-08-23 | 2007-03-06 | Enpirion, Inc. | Method of forming an integrated circuit employable with a power converter |
US7335948B2 (en) * | 2004-08-23 | 2008-02-26 | Enpirion, Inc. | Integrated circuit incorporating higher voltage devices and low voltage devices therein |
US7214985B2 (en) * | 2004-08-23 | 2007-05-08 | Enpirion, Inc. | Integrated circuit incorporating higher voltage devices and low voltage devices therein |
US7491595B2 (en) | 2005-07-06 | 2009-02-17 | Hewlett-Packard Development Company, L.P. | Creating high voltage FETs with low voltage process |
US7781843B1 (en) | 2007-01-11 | 2010-08-24 | Hewlett-Packard Development Company, L.P. | Integrating high-voltage CMOS devices with low-voltage CMOS |
US8169081B1 (en) | 2007-12-27 | 2012-05-01 | Volterra Semiconductor Corporation | Conductive routings in integrated circuits using under bump metallization |
US8211774B2 (en) * | 2009-09-18 | 2012-07-03 | Vanguard International Semiconductor Corporation | Method for forming semiconductor structure |
EP2738809A3 (de) | 2012-11-30 | 2017-05-10 | Enpirion, Inc. | Halbleitervorrichtung mit Gate-Treibern um eine Peripherie davon |
US9123642B1 (en) * | 2013-07-22 | 2015-09-01 | Cypress Semiconductor Corporation | Method of forming drain extended MOS transistors for high voltage circuits |
US9673192B1 (en) | 2013-11-27 | 2017-06-06 | Altera Corporation | Semiconductor device including a resistor metallic layer and method of forming the same |
US10020739B2 (en) | 2014-03-27 | 2018-07-10 | Altera Corporation | Integrated current replicator and method of operating the same |
US9536938B1 (en) | 2013-11-27 | 2017-01-03 | Altera Corporation | Semiconductor device including a resistor metallic layer and method of forming the same |
CN104835787A (zh) * | 2014-02-08 | 2015-08-12 | 北大方正集团有限公司 | 双栅氧器件的制造方法和双栅氧器件 |
US10103627B2 (en) | 2015-02-26 | 2018-10-16 | Altera Corporation | Packaged integrated circuit including a switch-mode regulator and method of forming the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3477097D1 (en) * | 1984-03-21 | 1989-04-13 | Siemens Ag | Method of producing a highly integrated circuit of mos field-effect transistors |
EP0160183A3 (de) * | 1984-05-03 | 1986-12-03 | Rockwell International Corporation | Hochspannungs-MOS-Feldeffekttransistor |
FR2571178B1 (fr) * | 1984-09-28 | 1986-11-21 | Thomson Csf | Structure de circuit integre comportant des transistors cmos a tenue en tension elevee, et son procede de fabrication |
JPS61174667A (ja) * | 1985-01-29 | 1986-08-06 | Nec Corp | 半導体装置の製造方法 |
-
1989
- 1989-03-17 US US07/324,869 patent/US5047358A/en not_active Expired - Lifetime
-
1990
- 1990-02-09 EP EP90301381A patent/EP0387999B1/de not_active Expired - Lifetime
- 1990-02-09 DE DE69032735T patent/DE69032735T2/de not_active Expired - Fee Related
- 1990-03-16 JP JP2064444A patent/JP2510751B2/ja not_active Expired - Lifetime
- 1990-03-17 KR KR1019900003676A patent/KR930010121B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR930010121B1 (ko) | 1993-10-14 |
DE69032735T2 (de) | 1999-04-01 |
EP0387999A3 (de) | 1992-07-29 |
KR900015344A (ko) | 1990-10-26 |
EP0387999B1 (de) | 1998-11-04 |
JPH02284462A (ja) | 1990-11-21 |
EP0387999A2 (de) | 1990-09-19 |
JP2510751B2 (ja) | 1996-06-26 |
US5047358A (en) | 1991-09-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69032735D1 (de) | Verfahren zum Herstellen von Hochspannungs- und Niederspannungs-CMOS-Transistoren in einem einzigen integrierten Schaltungs-Chip | |
DE69012611D1 (de) | Verfahren zum Herstellen bipolarer vertikaler Transistoren und von Hochspannungs-CMOS-Transistoren in einer einzigen integrierten Schaltung. | |
DE3888937D1 (de) | Verfahren zum Herstellen von integrierten Schaltungen mit FET. | |
DE69030843D1 (de) | Verfahren zum Herstellen von Kondensatoren für integrierte Schaltungen | |
DE69432918D1 (de) | Verfahren zum Herstellen eines CMOS-Bauteil mit Hoch- und Niedrigspannungstransistoren | |
DE69301225D1 (de) | Verfahren und Schaltung zum Durchbrennen von Sicherung in einen integrierten Schaltkreis | |
EP0092871A3 (en) | Semiconductor integrated circuits and method of manufacturing | |
KR860004457A (ko) | 반도체 집적회로장치 및 그의 제조방법과 제조장치 | |
DE69434234D1 (de) | Chipkarte und Herstellungsmethode | |
KR860000712A (ko) | 반도체 집적회로 및 그 회로 패턴 설계방법 | |
DE69409347D1 (de) | Verfahren zum Herstellen von Halbleitervorrichtungen | |
DE3588129D1 (de) | Verbesserungen von Verfahren zum Herstellen von Chips mit einer integrierten Schaltung und auf diese Art hergestellte Chips | |
DE69130624D1 (de) | Verfahren zum Herstellen von Feldeffekt-Transistoren für integrierte Schaltungen | |
FI941951A (fi) | Sirutyyppinen piirikomponentti ja menetelmä sen valmistamiseksi | |
DE69215978D1 (de) | Verfahren zur gleichzeitigen Herstellung von Hoch- und Niederspannungs-Halbleiterbauelementen und damit versehene Halbleiterschaltungen | |
DE68928193D1 (de) | Halbleiterchip und Verfahren zu seiner Herstellung | |
KR890015418A (ko) | 반도체 집적회로와 그 제조방법 | |
KR890013782A (ko) | 광전자집적회로 및 그 제조방법 | |
FR2527866B1 (fr) | Procede et circuit de limitation ou maintien de tension dans des circuits integres | |
DE68914572D1 (de) | Verfahren zum Herstellen von Halbleitervorrichtungen. | |
DE69034109D1 (de) | Halbleiter-IC-Vorrichtung und deren Herstellungsverfahren | |
KR860005450A (ko) | 반도체 집적 회로장치 및 그의 제조방법 | |
KR900008649A (ko) | 집적회로의 다량 제조방법 | |
DE68916045D1 (de) | Halbleiteranordnung und Verfahren zum Herstellen derselben. | |
KR850007901A (ko) | 집적회로 마이크로프로세서 칩과 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: DELPHI TECHNOLOGIES, INC., TROY, MICH., US |
|
8339 | Ceased/non-payment of the annual fee |