DE69031141D1 - Integrierte Hybridschaltungsanordnung - Google Patents
Integrierte HybridschaltungsanordnungInfo
- Publication number
- DE69031141D1 DE69031141D1 DE69031141T DE69031141T DE69031141D1 DE 69031141 D1 DE69031141 D1 DE 69031141D1 DE 69031141 T DE69031141 T DE 69031141T DE 69031141 T DE69031141 T DE 69031141T DE 69031141 D1 DE69031141 D1 DE 69031141D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit arrangement
- hybrid circuit
- integrated hybrid
- integrated
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
Applications Claiming Priority (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1100786A JPH0680765B2 (ja) | 1989-04-20 | 1989-04-20 | 混成集積回路装置 |
JP1100785A JPH0680764B2 (ja) | 1989-04-20 | 1989-04-20 | 混成集積回路装置 |
JP1119110A JPH0680767B2 (ja) | 1989-05-12 | 1989-05-12 | 混成集積回路装置 |
JP1119113A JPH0680770B2 (ja) | 1989-05-12 | 1989-05-12 | 混成集積回路装置 |
JP1119109A JPH02298060A (ja) | 1989-05-12 | 1989-05-12 | 混成集積回路装置 |
JP1120901A JPH0680771B2 (ja) | 1989-05-15 | 1989-05-15 | 混成集積回路装置 |
JP1120906A JPH0680776B2 (ja) | 1989-05-15 | 1989-05-15 | 混成集積回路装置 |
JP1122357A JPH0680779B2 (ja) | 1989-05-16 | 1989-05-16 | 混成集積回路装置 |
JP1122356A JPH0680778B2 (ja) | 1989-05-16 | 1989-05-16 | 混成集積回路装置 |
JP12390489A JPH0680782B2 (ja) | 1989-05-17 | 1989-05-17 | 混成集積回路装置 |
JP12390389A JPH0680781B2 (ja) | 1989-05-17 | 1989-05-17 | 混成集積回路装置 |
JP12491289A JPH0680783B2 (ja) | 1989-05-18 | 1989-05-18 | 混成集積回路装置 |
JP1124913A JPH0680784B2 (ja) | 1989-05-18 | 1989-05-18 | 混成集積回路装置 |
JP12731089A JPH0680785B2 (ja) | 1989-05-19 | 1989-05-19 | 混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69031141D1 true DE69031141D1 (de) | 1997-09-04 |
DE69031141T2 DE69031141T2 (de) | 1997-12-11 |
Family
ID=27584873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69031141T Expired - Fee Related DE69031141T2 (de) | 1989-04-20 | 1990-04-19 | Integrierte Hybridschaltungsanordnung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5285107A (de) |
EP (1) | EP0393657B1 (de) |
DE (1) | DE69031141T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2960560B2 (ja) | 1991-02-28 | 1999-10-06 | 株式会社日立製作所 | 超小型電子機器 |
US5278442A (en) * | 1991-07-15 | 1994-01-11 | Prinz Fritz B | Electronic packages and smart structures formed by thermal spray deposition |
JP2721093B2 (ja) * | 1992-07-21 | 1998-03-04 | 三菱電機株式会社 | 半導体装置 |
EP0654866A3 (de) * | 1993-11-23 | 1997-08-20 | Motorola Inc | Träger zur Verbindung eines Halbleiterwürfels und Herstellungsverfahren. |
US5789815A (en) * | 1996-04-23 | 1998-08-04 | Motorola, Inc. | Three dimensional semiconductor package having flexible appendages |
FR2758935B1 (fr) * | 1997-01-28 | 2001-02-16 | Matra Marconi Space France | Boitier micro-electronique multi-niveaux |
US6300679B1 (en) * | 1998-06-01 | 2001-10-09 | Semiconductor Components Industries, Llc | Flexible substrate for packaging a semiconductor component |
DE10030994A1 (de) * | 2000-06-30 | 2002-01-17 | Infineon Technologies Ag | Halbleiter-Chip |
US6614121B1 (en) * | 2000-08-21 | 2003-09-02 | Advanced Micro Devices, Inc. | Vertical cache configuration |
US6603193B2 (en) * | 2001-09-06 | 2003-08-05 | Silicon Bandwidth Inc. | Semiconductor package |
JP4459883B2 (ja) * | 2005-04-28 | 2010-04-28 | 三菱電機株式会社 | 半導体装置 |
US8022519B2 (en) * | 2005-05-19 | 2011-09-20 | Sandisk Technologies Inc. | System-in-a-package based flash memory card |
US7767543B2 (en) * | 2005-09-06 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a micro-electro-mechanical device with a folded substrate |
US20080224199A1 (en) * | 2007-03-14 | 2008-09-18 | Li Hui Lu | Non-volatile memory module package capability of replacing |
JP4425961B2 (ja) * | 2008-01-15 | 2010-03-03 | パナソニック株式会社 | 回路基板モジュール及び電子機器 |
US8362368B2 (en) * | 2009-04-27 | 2013-01-29 | Ultrasource, Inc. | Method and apparatus for an improved filled via |
US20110031607A1 (en) * | 2009-08-06 | 2011-02-10 | Advanced Chip Engineering Technology Inc. | Conductor package structure and method of the same |
US20110031594A1 (en) * | 2009-08-06 | 2011-02-10 | Advanced Chip Engineering Technology Inc. | Conductor package structure and method of the same |
US20110209908A1 (en) * | 2009-08-06 | 2011-09-01 | Advanced Chip Engineering Technology Inc. | Conductor package structure and method of the same |
US20110180891A1 (en) * | 2009-08-06 | 2011-07-28 | Advanced Chip Engineering Technology Inc. | Conductor package structure and method of the same |
TW201143013A (en) * | 2010-05-26 | 2011-12-01 | Princeton Technology Corp | Anti-UV electronic device and fabrication method thereof |
TWI517341B (zh) | 2013-05-10 | 2016-01-11 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
JP6552450B2 (ja) * | 2016-04-19 | 2019-07-31 | 三菱電機株式会社 | 半導体装置 |
US10057989B1 (en) * | 2017-04-10 | 2018-08-21 | Tactotek Oy | Multilayer structure and related method of manufacture for electronics |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3614832A (en) * | 1966-03-09 | 1971-10-26 | Ibm | Decal connectors and methods of forming decal connections to solid state devices |
GB1601520A (en) * | 1978-05-31 | 1981-10-28 | Gen Electric Co Ltd | Electric circuit arrangements |
JPS58131756A (ja) * | 1982-01-29 | 1983-08-05 | Fujitsu Ltd | Dip型ハイブリツドic |
JPS59141258A (ja) * | 1983-02-02 | 1984-08-13 | Sanyo Electric Co Ltd | 混成集積回路 |
JPS59228748A (ja) * | 1983-06-09 | 1984-12-22 | Toshiba Corp | 混成集積回路装置 |
JPS61180463A (ja) * | 1985-02-05 | 1986-08-13 | Matsushita Electric Ind Co Ltd | 部品の実装方法 |
JPS62115750A (ja) * | 1985-11-15 | 1987-05-27 | Nec Corp | 半導体装置 |
US5016138A (en) * | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
FR2630859B1 (fr) * | 1988-04-27 | 1990-07-13 | Thomson Composants Militaires | Boitier ceramique multicouches a plusieurs puces de circuit-integre |
US4972253A (en) * | 1988-06-27 | 1990-11-20 | Digital Equipment Corporation | Programmable ceramic high performance custom package |
-
1990
- 1990-04-18 US US07/510,467 patent/US5285107A/en not_active Expired - Fee Related
- 1990-04-19 DE DE69031141T patent/DE69031141T2/de not_active Expired - Fee Related
- 1990-04-19 EP EP90107414A patent/EP0393657B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0393657A3 (de) | 1991-02-13 |
US5285107A (en) | 1994-02-08 |
EP0393657B1 (de) | 1997-07-30 |
DE69031141T2 (de) | 1997-12-11 |
EP0393657A2 (de) | 1990-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |