JP4425961B2 - 回路基板モジュール及び電子機器 - Google Patents
回路基板モジュール及び電子機器 Download PDFInfo
- Publication number
- JP4425961B2 JP4425961B2 JP2008005460A JP2008005460A JP4425961B2 JP 4425961 B2 JP4425961 B2 JP 4425961B2 JP 2008005460 A JP2008005460 A JP 2008005460A JP 2008005460 A JP2008005460 A JP 2008005460A JP 4425961 B2 JP4425961 B2 JP 4425961B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- circuit board
- substrate
- board module
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Liquid Crystal (AREA)
- Casings For Electric Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
また、本実施形態の第2枠体5でも、第1枠体4と同様、底面が基板1と電気的に接続されて基板1のグランドと同電位となるように構成されている。
また、本実施の形態では、第1枠体4及び第2枠体5の断面形状を略矩形として説明したが、矩形に限らず円形や多角形であってもよい。
2 電子部品
3 電子部品(第1表示装置)
4 第1枠体
5 第2枠体
6 樹脂部
7 蓋部
72 孔
10 回路基板モジュール
h1 基板から第1枠体の上面までの壁の高さ
h2 基板から第2枠体の上面までの壁の高さ
D1 第1表示装置
D2 第2表示装置
Δh 隙間
S 空間
Claims (3)
- 実装面を有する基板と、
前記実装面に実装された枠体と、
前記実装面に実装され、前記枠体の内部に配置された電子部品と、
前記枠体の内部に埋められた樹脂部と、
前記基板の前記実装面と反対の反対面に配置された表示装置と、を備え、
前記表示装置は、前記枠体と略同じ大きさであり、かつ前記反対面において前記枠体と略対応する位置に配置された回路基板モジュール。 - 請求項1に記載の回路基板モジュールであって、
前記表示装置はガラスを含む回路基板モジュール - 請求項1又は請求項2に記載の回路基板モジュールを備えた電子機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008005460A JP4425961B2 (ja) | 2008-01-15 | 2008-01-15 | 回路基板モジュール及び電子機器 |
PCT/JP2008/003010 WO2009090694A1 (ja) | 2008-01-15 | 2008-10-23 | 回路基板モジュール及び電子機器 |
US12/863,172 US20100309639A1 (en) | 2008-01-15 | 2008-10-23 | Circuit board module and electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008005460A JP4425961B2 (ja) | 2008-01-15 | 2008-01-15 | 回路基板モジュール及び電子機器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009168987A JP2009168987A (ja) | 2009-07-30 |
JP2009168987A5 JP2009168987A5 (ja) | 2009-09-10 |
JP4425961B2 true JP4425961B2 (ja) | 2010-03-03 |
Family
ID=40885105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008005460A Expired - Fee Related JP4425961B2 (ja) | 2008-01-15 | 2008-01-15 | 回路基板モジュール及び電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100309639A1 (ja) |
JP (1) | JP4425961B2 (ja) |
WO (1) | WO2009090694A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8134840B2 (en) * | 2006-07-25 | 2012-03-13 | Panasonic Corporation | Circuit board and mobile electronic apparatus |
CN101729087A (zh) * | 2008-10-21 | 2010-06-09 | 深圳富泰宏精密工业有限公司 | 无线通信装置 |
CN107071107B (zh) * | 2017-04-26 | 2019-12-31 | Oppo广东移动通信有限公司 | 显示组件和移动终端 |
US10653030B1 (en) * | 2018-11-30 | 2020-05-12 | Illinois Tool Works Inc. | Water ingress prevention in electronic components |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01186699A (ja) * | 1988-01-14 | 1989-07-26 | Toyota Motor Corp | 複合電子部品モジュール |
JPH0726844Y2 (ja) * | 1988-03-16 | 1995-06-14 | 三洋電機株式会社 | 混成集積回路 |
JPH0680767B2 (ja) * | 1989-05-12 | 1994-10-12 | 三洋電機株式会社 | 混成集積回路装置 |
US5285107A (en) * | 1989-04-20 | 1994-02-08 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
JPH0492686A (ja) * | 1990-08-09 | 1992-03-25 | San & San:Kk | パチンコ玉発射装置におけるハンマーヘッド |
JPH09321446A (ja) * | 1996-05-28 | 1997-12-12 | Nippon Seiki Co Ltd | 電子回路ユニット |
JPH11307968A (ja) * | 1998-04-20 | 1999-11-05 | Matsushita Electric Ind Co Ltd | 電子制御装置の放熱構造 |
JP2000208905A (ja) * | 1999-01-14 | 2000-07-28 | Nec Corp | プリント基板 |
US6588132B2 (en) * | 2000-05-25 | 2003-07-08 | Rohm Co., Ltd. | Light emitting display device |
US6482346B1 (en) * | 2000-11-21 | 2002-11-19 | Ross Alcazar | Method for manufacturing an in-mold display |
US6806938B2 (en) * | 2001-08-30 | 2004-10-19 | Kyocera Corporation | Liquid crystal display device with particular on substrate wiring, portable terminal and display equipment provided with the liquid crystal display device |
JP4581726B2 (ja) * | 2004-12-28 | 2010-11-17 | ソニー株式会社 | 表示装置および携帯機器 |
TWI354155B (en) * | 2005-07-22 | 2011-12-11 | Sony Corp | Display |
JP5091500B2 (ja) * | 2007-02-20 | 2012-12-05 | 株式会社ジャパンディスプレイイースト | 液晶表示装置 |
-
2008
- 2008-01-15 JP JP2008005460A patent/JP4425961B2/ja not_active Expired - Fee Related
- 2008-10-23 US US12/863,172 patent/US20100309639A1/en not_active Abandoned
- 2008-10-23 WO PCT/JP2008/003010 patent/WO2009090694A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2009168987A (ja) | 2009-07-30 |
US20100309639A1 (en) | 2010-12-09 |
WO2009090694A1 (ja) | 2009-07-23 |
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