GB1601520A - Electric circuit arrangements - Google Patents

Electric circuit arrangements Download PDF

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Publication number
GB1601520A
GB1601520A GB1088978A GB1088978A GB1601520A GB 1601520 A GB1601520 A GB 1601520A GB 1088978 A GB1088978 A GB 1088978A GB 1088978 A GB1088978 A GB 1088978A GB 1601520 A GB1601520 A GB 1601520A
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United Kingdom
Prior art keywords
substrate
circuit arrangement
connections
terminals
connector
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Expired
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GB1088978A
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General Electric Co PLC
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General Electric Co PLC
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Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB1088978A priority Critical patent/GB1601520A/en
Publication of GB1601520A publication Critical patent/GB1601520A/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

(54) IMPROVEMENTS IN OR RELATING TO ELECTRIC CIRCUIT ARRANGEMENTS (71) We, THE GENERAL ELECTRIC COMPANY LIMITED, of 1 Stanhope Gate, London W1A 1EH, a British Company, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed to be particularly described in and by the following statement: This invention relates to electric circuit arrangements of the kind including substrates carrying circuit elements, and connector means for connecting together the parts of the circuit arrangement carried on the respective substrates.
Electric circuit arrangements, particularly those of the low power kind, frequently comprise a multitude of electric circuits located on a plurality of substrates, such that each substrate carries those circuit elements and conductors which form part of the complete circuit arrangement.
Each of the substrates usually comprises a sheet of insulating material, to at least one surface of which are attached tracks of electrically conductive material, which are arranged to provide the required electrical connections between those elements of the circuit arrangement which are located on the same substrate.
Alternatively, or additionally, these tracks may provide terminals for eelctrical connections leading from the parts of the circuit arrangement located on the substrate to other parts of the circuit arrangement located elsewhere.
The connections between the terminals and the other parts of the circuit arrangement referred to above are frequently made by means of a connecting device which includes at least one connector member consisting of an insulating body carrying a set of contacts which are adapted to releasably engage respective ones of a complementary set of contacts associated with, or formed by, these terminals. The contacts of the connector member are, in turn, connected to onward connections, that is to say either to a further set of contacts located on the connector member and adapted to engage another set of complementary contacts, or to a set of terminals located on the connector member to which further connections can be made, for example, by soldering.
Although the use of such connector members in electric circuit arrangements usually results in easier assembly, and any subsequent testing and the like, of the circuit arrangements or parts thereof located on different substrates, these connector members require additional space, thereby often increasing the production costs of units incorporating such circuit arrangements, especially where the arrangement includes more than two substrates to be connected together.
It is an object of the present invention to provide an electric circuit arrangement of the kind referred to, incorporating one or more connector members of a form which may permit a reduction in the space required for a given circuit arrangement.
According to one aspect of the present invention, an electric circuit arrangement consists of first and second substrates of insulating material, each carrying a plurality of circuit elements, constituting a part of the circuit arrangement, and electrically conducting tracks which include terminals for connection of the part of the circuit arrangement located on the respective substrate to other parts of the circuit arrangement, and one or more connector members each of which comprises a body of insulating material carrying on one face a first set of contacting means, of resilient form, arranged to engage in resilient abutment with a complementary set of said terminals on said first substrate, each said member incorporating one or more semiconductor devices forming part of the circuit arrangement, input and/or output leads of which device, or of each of which devices, are electrically connected to appropriate ones of said first set of contacting means, and each said member also incorporat- ing a second set of contacting means to which further input and/or output leads of said device or devices are electrically connected, said second set of contacung means being arranged to form electrical connections with a complementary set of said terminals on said second substrate.
According to another aspect of the present invention, an electric circuit arrangement consists of first and second substrates of insulating material, each carrying a plurality of circuit elements, constituting a part of the circuit arrangement, and electrically conducting tracks which include terminals for connection of the part of the circuit arrangement located on the respective substrate to other parts of the circuit arrangement, and one or more connector members each of which comprises a body of insulating material carrying on one face a first set of contacting means, of resilient form, arranged to engage in resilient abutment with a complementary set of said terminals on said first substrate, each said member incorporating one or more mounting structures on each of which is mounted a semi-conductor device forming part of the circuit arrangement, each mounting structure including contact portions which receive input and/or output leads of the semiconductor device and at least some of which are electrically connected to appropriate ones of said first set of contacting means, and each said connector member also incorporating a second set of contacting means to at least some of which further said contact portions of the mounting structure or structures are electrically connected, said second set of contacting means being arranged to form connections with a complementary set of said terminals on said second subsuate.
The said semiconductor device, or each such device, incorporated in or mounted on each connector member may be a discrete component, such as for example a transistor or a diode. Preferably, however, the or each semiconductor device is an integrated circuit, that is to say a device in which the active and passive elements of the circuit are located on a single piece of semiconductor material.
Thus, by either incorporating the semiconductor device in the connector member, that is to say permanently securing the device to, or even encapsulating the device in, the connector member, or by providing a mounting structure for a semiconductor device on the connector member, it is possible to reduce the number of substrates, particularly so-called circuit boards, required for the construction of a circuit arrangement, since some of the circuit elements of the circuit arrangement are located on, or within, the connector member, thus assisting in reducing the space required by the circuit arrangement.
The said first set of contacting means in each connector member may be in the form of a set of resilient metal strips arranged in a row along one side of the connector member, so that abutment of the metal strips against appropriate ones of the complementary set of terminals on the first substrate will provide the required electrical connections.
Alternatively, each connector member may have in one of its faces one or more recesses, at the bottom of which are located one or more conductors connected either to said input and/or output leads of the semiconductor device or devices, or to said contact portions of the mounting structure or structures, and one or more connector strips of elastomeric material, also known as "zebra strips", which comprise alternate sections of conducting and non-conducting elastomeric material, for example rubber, may be located in the recess or recesses. The strip or strips are then arranged to project above the recess or recesses in which they are located, which enables electrical connections to be made between the conductors at the bottom of the recess or recesses and appropriate terminals on the first substrate by abutment of the conducting sections of the connector strip or strips against the terminals.
The second set of contacting means on each connector member may again be resilient members of either of the forms described above, or they may be conductors to which terminals on the second substrate may be secured by soldering or in any other suitable manner.
It will be understood that the connector members included in the circuit arrangement of the invention may be conventional semiconductor device packages modified to form connector members as described.
Means for providing mechanical connections between the substrates and the connector members may be provided on the connector members in suitable positions.
An important, but by no means the only, application of the present invention lies in the field of electrically driven matrix displays, such as zinc sulphide direct current electric luminescent displays, liquid crystal displays, or gas discharge displays.
The invention will now be described further by way of example and with reference to the drawings accompanying the Provisional Specification, in which Figure 1 shows in Figure la a side view, and in Figure ib a partially sectioned front view, of a connector member for use in a circuit arrangement in accordance with the present invention, Figure 2 illustrates in schematic form an electroluminescent display arrangement incorporating connector members of the form shown in Figure 1, Figures 2a and 2b showing a partially sectioned side elevation and a partially sectioned plan view, respectively, of the display arrangement, Figure 3 shows a further embodiment, in Figure 3a a side view and in Figure 3b a front view, of a connector member for use in accordance with the present invention, Figure 4 shows in Figure 4a a side view and in Figure 4b a partially sectioned front view of another embodiment of a connector member, and Figure 5 shows a modified form of the em bodiment of Figure 4.Pigure 4.
Referring first to Figure 1, a connector member 1 comprises a body 2 of substantially rectangular cross-section, made of insulating material. Embedded within the body 2 is an integrated circuit device 3 whose input leads 4 and output leads 5, which together form the lead frame of the integrated circuit device, emerge on opposite sides of the insulating body 2. The input leads 4 are arranged to extend in a straight line so as to allow insertion into suitable apertures in an adjacent substrate, where they are soldered to respective conductor tracks (see 10 in Figure 2).
The output leads 5 are bent over at the point where they emerge from the body 2, so as to form a set of contact strips to which electrical connections may be made by abutment.
To ensure good electrical connection, at least the output leads 5 are made of elastic metal strip so that the leads 5 form an array of spring contacts. The outer end section 8 of each output lead 5 is inclined towards the body 2 with respect to its main section 9 to prevent catching of the ends, when contact is made and the ends move along an arc, as indicated by the arrow 11, towards the body 2. To accommodate the inclined end sections 8, grooves 6 are provided along the edge 12 of the body 2, which are separated from each other by thin wall sections 7. These wall sections help to prevent sideways movement of the end sections 8 and the consequent possibility of short circuits between two adjacent output leads 5.
The intergrated circuit device 3 as shown in the drawing is encapsulated in a casing 13, which in turn is embedded in the body 2 of the connector member 1. As an alternative, the body 2 may provide the necessary en capsulation, i.e. the integrated circuit device may be directly embedded in the body 2, without prior encapsulation in the casing 13.
Referring now also to Figure 2, an electroluminescent display arrangement as shown comprises a transparent substrate 17, made e.g. of glass, to the underside of which is attached an encapsulated display 18 having a regular array of electroluminescent elements.
Also attached to the underside of the substrate 17 are a plurality of row conductors 14 and column conductors 15, arranged such that by applying an appropriate voltage between a selected row conductor 14 and a selected column conductor a chosen element may be energised. Since the row conductors 14 and column conductors 15 traverse the underside of the transparent substrate 17, they need to be not only of very small thickness to allow the maximum amount of light emerging from the display 18 to reach the outside, but they should also be comparatively small widths. At the same time these conductors must be capable of making a good electrical connection to the contacts 5 of the connector members 1, and for this reason they widen out around the perimeter of the display, as shown in the Figure 2b. To ensure a sufficient gap between adjacent row and column connectors, 14 and 15 respectively, it is usual to terminate successive row conductors 14, and column conductors 15 on opposite sides of the substrate (e.g. 14a and 14b in Figure 2).
The row and column drive circuits, through which the energizing of the individual elements is controlled are provided by the integrated circuits 3 incorporated in the connector members arranged around the perimeter of the substrate 17 and the substrate 16 respectively, the contacts 5 providing the electrical connection between the outputs of the integrated circuits and the row conductors 14 or, respectively, the column conductors 15.
As illustrated in Figure 2, each of the connector members incorporates more than one integrated circuit 3, the number of circuits depending largely on the number of row conductors 14, and column conductors 15 which have to be addressed.
The input connections 4 of the integrated circuits 3 are inserted and pushed through appropriately shaped openings (not shown) in the substrate 16, where solder connections 10 are made between the input connections 4 of the integrated circuits 3 and conductor tracks (not shown) attached to the underside (and possibly also the top side) of the substrate 16.
The substrate 16 itself is a printed circuit board, made from a suitable insulating material such as fibreglass reinforced resin, or "Tufnol" (Registered Trade Mark), and carries on one or both major surfaces conductor tracks appropriately routed to interconnect the circuit components, represented by items C, in the desired manner. The parts of the circuit arrangement carried on the substrate 16 are the control logic circuits, which control the row and column drive circuits, which in turn, as mentioned above, control the energizing of the row and column conductors.
Figure 3 illustrates a further embodiment of a connector member for use in a circuit arrangement in accordance with the invention, wherein the connector member 21 is adapted to receive a separate integrated circuit device (not shown) of the kind having a packaging known as dual-in-line package, i.e. having a double array of input and output leads akin to contacts 40 and 44 of Figure 4.
The input and output leads of such a packaged integrated circuit device are received within the apertures 23 in the body 22 of the connector member 21. Contact between the output connections 25, which comprise a main section 29 and inwardly inclined thereto end sections 28, or the input connections 24 and the respective leads of the integrated circuit device is established by spring contact sections 30 within the apertures 23.
Just as for the member illustrated in Figure 1, the edge 32 nearest the end sections 28 of the spring contacts 25 incorporates a number of grooves 26 separated by wall sections 27, which are arranged to accommodate the end sections 28 when in their operating position.
The connector member furthermore incorporates a straight through connection 31, which by-passes any of the integrated circuit connections, and also incorporates a further straight through connection 33 between conductors 24 and 25, but this time also connecting up an output and an input connection of an integrated circuit, when secured to the connector member 21.
Figures 4 and 5 show two further connector members for use in accordance with the present invention, which are obtained by suitably modifying the packages of dual-in-line integrated circuit devices.
Thus, the connector member 41 of Figure 4 comprises an insulating body 42 enclosing an integrated circuit device (not shown), whose input connections 44 and output connections 40 penetrate the sidewalls 47 and 47' respectively. These connections are arranged to allow the mounting of the integrated circuit package, or connector member, 41 and thereby of the integrated circuit device, either within a conventional socket, or to permit soldering of the connections to the appropriate conductor tracks of an associated substrate (not shown) e.g. a printed circuit board. A further set of output connections 45, which may or may not be connected to the output connections 40, is located at the bottom of the recess, or groove, 46 in the top surface of the connector member 41. An elastomeric connector strip 48, comprising alternate sections of conducting rubber, 49, and nonconducting rubber, 50, is placed in the groove 46. On abutment of the conducting rubber sections 49 against a further set of conductor strips, (not shown), e.g. the conductor tracks of a printed circuit board, or the row conductors or column conductors of an electroluminescent display substrate such as illustrated in Figure 2, electrical connection, through those conducting rubber sections which are in abutment with an output connection 45, is established between the conductors 45 and the said conductor tracks.
By selecting the spacing between the conducting sections 49 to be less than the width of the connections 45, and choosing the width of the conducting rubber sections 49 to be less than the spacing between adjacent connections 45 it can be ensured that at least one of the conducting sections 49 is in contact with each of the output connections 45, while at the same time the possibility of a short circuit connection between two adjacent output connections 45, on account of one conducting rubber section 49 being in abutment with two such connections, can be eliminated.
Instead of making the output connections on the top surface of the package of the integrated circuit device in the manner illustrated in Figure 4, i.e. by using an elastomeric connector strip, a plurality of spring contacts, 55, as illustrated in Figure 5, may be provided. As above, the further output connections 55 may or may not be electrically connected to the output connections 50.
Each of the spring contacts 55 has a main section 59, and an end section 58 inclined thereto in the same way as the respective end sections 8, and 28 of Figures 1 and 3. A longitudinal groove 56 serves to accomodate the end sections 58 of the spring contacts 55 when in their operating position. To prevent transverse movement of the contacts 55 in that position, the groove may be divided up into individual chambers by means of transverse walls (not shown).
It is to be understood that the above references to input and output leads or conductors, in the description is, for the most part, adopted for the sake of clarity only, and is not intended to limit the scope of the invention.
WHAT WE CLAIM IS:- 1. An electric circuit arrangement consisting of first and second substrates of insulating material, each carrying a plurality of circuit elements, constituting a part of the circuit arrangement, and electrically conducting tracks which include terminals for connection of the part of the circuit arrangement located on the respective substrate to other parts of the circuit arrangement, and one or more connector members each of which comprises a body of insulating material carrying on one face a first set of contacting means, of resilient form, arranged to engage in resilient abutment with a complementary set of said terminals on said first substrate, each said member incorporating one or more semiconductor devices forming part of the circuit arrangement, input and/or output leads of which device, or of each of which devices, are electrically connected to appropriate ones of said first set of contacting means, and each said member also incorporating a second set of contacting means to which further input and/or output leads of said device or devices are electrically connected, said second set of contacting means being arranged to form electrical connections with a complementary set of said terminals on said second substrate.
2. An electric circuit arrangement consisting of first and second substrates of insulating material, each carrying a plurality of circuit elements, constituting a part of the circuit arrangement, and electrically conducting tracks which include terminals for connection of the part of the circuit arrangement located on the
**WARNING** end of DESC field may overlap start of CLMS **.

Claims (10)

**WARNING** start of CLMS field may overlap end of DESC **. the respective leads of the integrated circuit device is established by spring contact sections 30 within the apertures 23. Just as for the member illustrated in Figure 1, the edge 32 nearest the end sections 28 of the spring contacts 25 incorporates a number of grooves 26 separated by wall sections 27, which are arranged to accommodate the end sections 28 when in their operating position. The connector member furthermore incorporates a straight through connection 31, which by-passes any of the integrated circuit connections, and also incorporates a further straight through connection 33 between conductors 24 and 25, but this time also connecting up an output and an input connection of an integrated circuit, when secured to the connector member 21. Figures 4 and 5 show two further connector members for use in accordance with the present invention, which are obtained by suitably modifying the packages of dual-in-line integrated circuit devices. Thus, the connector member 41 of Figure 4 comprises an insulating body 42 enclosing an integrated circuit device (not shown), whose input connections 44 and output connections 40 penetrate the sidewalls 47 and 47' respectively. These connections are arranged to allow the mounting of the integrated circuit package, or connector member, 41 and thereby of the integrated circuit device, either within a conventional socket, or to permit soldering of the connections to the appropriate conductor tracks of an associated substrate (not shown) e.g. a printed circuit board. A further set of output connections 45, which may or may not be connected to the output connections 40, is located at the bottom of the recess, or groove, 46 in the top surface of the connector member 41. An elastomeric connector strip 48, comprising alternate sections of conducting rubber, 49, and nonconducting rubber, 50, is placed in the groove 46. On abutment of the conducting rubber sections 49 against a further set of conductor strips, (not shown), e.g. the conductor tracks of a printed circuit board, or the row conductors or column conductors of an electroluminescent display substrate such as illustrated in Figure 2, electrical connection, through those conducting rubber sections which are in abutment with an output connection 45, is established between the conductors 45 and the said conductor tracks. By selecting the spacing between the conducting sections 49 to be less than the width of the connections 45, and choosing the width of the conducting rubber sections 49 to be less than the spacing between adjacent connections 45 it can be ensured that at least one of the conducting sections 49 is in contact with each of the output connections 45, while at the same time the possibility of a short circuit connection between two adjacent output connections 45, on account of one conducting rubber section 49 being in abutment with two such connections, can be eliminated. Instead of making the output connections on the top surface of the package of the integrated circuit device in the manner illustrated in Figure 4, i.e. by using an elastomeric connector strip, a plurality of spring contacts, 55, as illustrated in Figure 5, may be provided. As above, the further output connections 55 may or may not be electrically connected to the output connections 50. Each of the spring contacts 55 has a main section 59, and an end section 58 inclined thereto in the same way as the respective end sections 8, and 28 of Figures 1 and 3. A longitudinal groove 56 serves to accomodate the end sections 58 of the spring contacts 55 when in their operating position. To prevent transverse movement of the contacts 55 in that position, the groove may be divided up into individual chambers by means of transverse walls (not shown). It is to be understood that the above references to input and output leads or conductors, in the description is, for the most part, adopted for the sake of clarity only, and is not intended to limit the scope of the invention. WHAT WE CLAIM IS:-
1. An electric circuit arrangement consisting of first and second substrates of insulating material, each carrying a plurality of circuit elements, constituting a part of the circuit arrangement, and electrically conducting tracks which include terminals for connection of the part of the circuit arrangement located on the respective substrate to other parts of the circuit arrangement, and one or more connector members each of which comprises a body of insulating material carrying on one face a first set of contacting means, of resilient form, arranged to engage in resilient abutment with a complementary set of said terminals on said first substrate, each said member incorporating one or more semiconductor devices forming part of the circuit arrangement, input and/or output leads of which device, or of each of which devices, are electrically connected to appropriate ones of said first set of contacting means, and each said member also incorporating a second set of contacting means to which further input and/or output leads of said device or devices are electrically connected, said second set of contacting means being arranged to form electrical connections with a complementary set of said terminals on said second substrate.
2. An electric circuit arrangement consisting of first and second substrates of insulating material, each carrying a plurality of circuit elements, constituting a part of the circuit arrangement, and electrically conducting tracks which include terminals for connection of the part of the circuit arrangement located on the
respective substrate to other parts of the circuit arrangement, and one or more connector members each of which comprises a body of insulating material carrying on one face a first set of contacting means, of resilient form arranged to engage in resilient abutment with a complementary set of said terminals on said first substrate, each said member incorporating one or more mounting structures on each of which is mounted a semiconductor device forming part of the circuit arrangement, each mounting structure including contact portions which receive input and/or output leads of the semiconductor device and at least some of which are electrically connected to appropriate ones of said first set of contacting means, and each said connector member also incorporating a second set of contacting means to at least some of which further said contact portions of the mounting structure or structures are electrically connected, said second set of con tacting means being arranged to form con nections with a complementary set of said terminals on said second substrate.
3. A circuit arrangement as claimed in Claim 1 or 2, wherein the said first set of contacting means in each connector member consists of resilient metal strips arranged in a row along one face of the connector mem ber, so that abutment of the metal strips against appropriate ones of the complementary set of terminals on said first substrate will provide the required electrical connections.
4. A circuit arrangement as claimed in Claim 1 or 2, wherein each connector member has in one of its faces one or more recesses at the bottom of which are located one or more conductors connected to said input and/or output leads of the semiconductor device or devices, or to said contact portions of the mount ing structure or structures, and the said first set of contacting means consists of a connector strip or strips of elastomeric material comprising alternate sections of conducting and non-conducting elastomeric material, which strip or strips is or are located in the recess or recesses and project above the recess or recesses so that electrical connections can be made between the conductors at the bottom of the recess or recesses and the appropriate terminals on said first substrate by abutment of the projecting parts of the conducting sections of the connector strip or strips against the said terminals.
5. A circuit arrangement as claimed in any preceding Claim, wherein the or each said semiconductor device incorporated in or mounted on each connector member is an integrated circuit.
6. A circuit arrangement as claimed in any preceding Claim, wherein the part thereof carried by the first substrate comprises an array of electroluminescent elements constituting an electroluminescent display, with a plurality of conductor tracks secured to a surface of the substrate, each of said elements being selectively energizable via pair of said conductor tracks, and at least part of the electric circuits required to energize said elements are integrated circuits incorporated in or mounted on one or more said connector members, said first set of contacting means carried by each connector member being in abutment with a complementary set of terminals included in said conductor tracks.
7. A circuit arrangement as claimed in Claim 6, wherein said first substrate carries an electroluminescent matrix display comprising a regular array of electroluminescent elements each of which is energizable by selectively addressing a pair of the said conductor tracks of which one is associated with a row and the other with a column of the matrix array, and which circuit arrangement includes control logic circuits and row and column drive circuits, the control logic circuits being located on said second substrate and connected to con ductor tracks on said second substrate, and connections between terminals of the conductor tracks on said second substrate and appropriate terminals of the conductor tracks on said first substrate being made via the row and column drive circuits which are incorporated in or mounted on one or more said connector members, said first set of contacting means carried by each connector member being in abutment with the said terminals on the first substrate, and the said second set of contact ing means of each connector member being connected to said terminals on the second substrate.
8. A circuit arrangement as claimed in Claim 6 or 7, wherein the said display is a zinc sulphide direct current electroluminescent display.
9. An electric circuit arrangement a claimed in Claim 1 or 2, including at least one connector member substantially as shown in, and as hereinbefore described with reference to, Figures l(a) and l(b), or Figures 3(a) and 3(b), or Figures 4(a) and 4(b), or Figures 5(a) and 5(b), of the drawings accompanying the Provisional Specification.
10. An electroluminescent display arrangement substantially as shown in, and as hereinbefore described with reference to, Figures 2(a) and 2(b) of the drawings accompanying the Provisional Specification.
GB1088978A 1978-05-31 1978-05-31 Electric circuit arrangements Expired GB1601520A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2498791A1 (en) * 1980-12-19 1982-07-30 Timex Corp SUB-ASSEMBLY ELECTRO-OPTICAL DISPLAY DEVICE-FRAME ASSEMBLY AND TIMER DEVICE INCORPORATING THE SAME, AND METHOD OF MANUFACTURING THE ELECTRO-OPTICAL DISPLAY DEVICE
GB2201295A (en) * 1987-02-23 1988-08-24 Lohja Ab Oy Planar display construction
EP0393657A2 (en) * 1989-04-20 1990-10-24 Sanyo Electric Co., Ltd. Hybrid integrated circuit device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2498791A1 (en) * 1980-12-19 1982-07-30 Timex Corp SUB-ASSEMBLY ELECTRO-OPTICAL DISPLAY DEVICE-FRAME ASSEMBLY AND TIMER DEVICE INCORPORATING THE SAME, AND METHOD OF MANUFACTURING THE ELECTRO-OPTICAL DISPLAY DEVICE
GB2201295A (en) * 1987-02-23 1988-08-24 Lohja Ab Oy Planar display construction
FR2611294A1 (en) * 1987-02-23 1988-08-26 Lohja Ab Oy PLANAR DISPLAY DEVICE, PARTICULARLY ELECTROLUMINESCENT DISPLAY DEVICE
GB2201295B (en) * 1987-02-23 1991-05-29 Lohja Ab Oy Planar display construction
EP0393657A2 (en) * 1989-04-20 1990-10-24 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
EP0393657A3 (en) * 1989-04-20 1991-02-13 Sanyo Electric Co., Ltd. Hybrid integrated circuit device

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