FR2630859B1 - Boitier ceramique multicouches a plusieurs puces de circuit-integre - Google Patents
Boitier ceramique multicouches a plusieurs puces de circuit-integreInfo
- Publication number
- FR2630859B1 FR2630859B1 FR8805590A FR8805590A FR2630859B1 FR 2630859 B1 FR2630859 B1 FR 2630859B1 FR 8805590 A FR8805590 A FR 8805590A FR 8805590 A FR8805590 A FR 8805590A FR 2630859 B1 FR2630859 B1 FR 2630859B1
- Authority
- FR
- France
- Prior art keywords
- multiple circuit
- integrated chips
- layered ceramic
- ceramic housing
- layered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8805590A FR2630859B1 (fr) | 1988-04-27 | 1988-04-27 | Boitier ceramique multicouches a plusieurs puces de circuit-integre |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8805590A FR2630859B1 (fr) | 1988-04-27 | 1988-04-27 | Boitier ceramique multicouches a plusieurs puces de circuit-integre |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2630859A1 FR2630859A1 (fr) | 1989-11-03 |
FR2630859B1 true FR2630859B1 (fr) | 1990-07-13 |
Family
ID=9365731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8805590A Expired - Lifetime FR2630859B1 (fr) | 1988-04-27 | 1988-04-27 | Boitier ceramique multicouches a plusieurs puces de circuit-integre |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2630859B1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285107A (en) * | 1989-04-20 | 1994-02-08 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
JPH0548000A (ja) * | 1991-08-13 | 1993-02-26 | Fujitsu Ltd | 半導体装置 |
JP2944405B2 (ja) * | 1993-12-29 | 1999-09-06 | 日本電気株式会社 | 半導体素子の冷却構造および電磁遮蔽構造 |
US5642262A (en) * | 1995-02-23 | 1997-06-24 | Altera Corporation | High-density programmable logic device in a multi-chip module package with improved interconnect scheme |
TW338180B (en) * | 1996-03-29 | 1998-08-11 | Mitsubishi Electric Corp | Semiconductor and its manufacturing method |
DE10045042C1 (de) * | 2000-09-12 | 2002-05-23 | Infineon Technologies Ag | MRAM-Modulanordnung |
-
1988
- 1988-04-27 FR FR8805590A patent/FR2630859B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2630859A1 (fr) | 1989-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CL | Concession to grant licenses |