DE68912494D1 - Leiterplattenherstellung. - Google Patents
Leiterplattenherstellung.Info
- Publication number
- DE68912494D1 DE68912494D1 DE89309858T DE68912494T DE68912494D1 DE 68912494 D1 DE68912494 D1 DE 68912494D1 DE 89309858 T DE89309858 T DE 89309858T DE 68912494 T DE68912494 T DE 68912494T DE 68912494 D1 DE68912494 D1 DE 68912494D1
- Authority
- DE
- Germany
- Prior art keywords
- pcb manufacturing
- pcb
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09572—Solder filled plated through-hole in the final product
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0435—Metal coated solder, e.g. for passivation of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
- Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB888823537A GB8823537D0 (en) | 1988-10-06 | 1988-10-06 | Circuit board manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68912494D1 true DE68912494D1 (de) | 1994-03-03 |
DE68912494T2 DE68912494T2 (de) | 1994-08-18 |
Family
ID=10644847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68912494T Expired - Lifetime DE68912494T2 (de) | 1988-10-06 | 1989-09-28 | Leiterplattenherstellung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5025553A (de) |
EP (1) | EP0363074B1 (de) |
JP (1) | JPH02237093A (de) |
DE (1) | DE68912494T2 (de) |
GB (1) | GB8823537D0 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL9100546A (nl) * | 1991-03-27 | 1992-10-16 | Du Pont Nederland | Werkwijze alsmede inrichting voor het verbinden van een connector aan een plaat. |
US5305523A (en) * | 1992-12-24 | 1994-04-26 | International Business Machines Corporation | Method of direct transferring of electrically conductive elements into a substrate |
US5401913A (en) * | 1993-06-08 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
FI114855B (fi) * | 1999-07-09 | 2005-01-14 | Outokumpu Oy | Menetelmä reiän tulppaamiseksi ja menetelmällä valmistettu jäähdytyselementti |
US6617520B1 (en) | 2000-08-30 | 2003-09-09 | Heatron, Inc. | Circuit board |
FR2832558A1 (fr) * | 2001-11-22 | 2003-05-23 | Framatome Connectors Int | Manchon d'accouplement d'un cable a isolant mineral et procede de raccordement |
CN1832658A (zh) * | 2005-03-10 | 2006-09-13 | 3M创新有限公司 | 一种双层金属的柔性印刷电路板及其制造方法 |
JP5763424B2 (ja) * | 2011-06-02 | 2015-08-12 | 矢崎総業株式会社 | コネクタ |
CN110730575A (zh) * | 2019-10-18 | 2020-01-24 | 苏州浪潮智能科技有限公司 | 一种实心过孔制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB902463A (en) * | 1959-01-06 | 1962-08-01 | Multicore Solders Ltd | Improvements in or relating to soft solder rods or wires |
GB1087604A (en) * | 1966-05-17 | 1967-10-18 | Standard Telephones Cables Ltd | Interconnection methods for printed circuit boards |
GB1177831A (en) * | 1967-01-23 | 1970-01-14 | J & S Engineers Ltd | Methods and Apparatus for Providing Connections Between Printed Circuits |
US4183137A (en) * | 1977-02-15 | 1980-01-15 | Lomerson Robert B | Method for metalizing holes in insulation material |
JPS59144195A (ja) * | 1983-02-08 | 1984-08-18 | 日本メクトロン株式会社 | 積層回路基板用のスル−ホ−ルピン |
US4644643A (en) * | 1984-02-22 | 1987-02-24 | Kangyo Denkikiki Kabushiki Kaisha | Method of electrically interconnecting a laminated printed circuit by use of a compressed, solder-plated connector pin |
JPH01280344A (ja) * | 1988-03-31 | 1989-11-10 | Toshiba Corp | 半導体装置における配線基板とリードピンとの接合部構造 |
-
1988
- 1988-10-06 GB GB888823537A patent/GB8823537D0/en active Pending
-
1989
- 1989-09-28 EP EP89309858A patent/EP0363074B1/de not_active Expired - Lifetime
- 1989-09-28 DE DE68912494T patent/DE68912494T2/de not_active Expired - Lifetime
- 1989-10-02 US US07/415,718 patent/US5025553A/en not_active Expired - Fee Related
- 1989-10-06 JP JP1261925A patent/JPH02237093A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB8823537D0 (en) | 1988-11-16 |
EP0363074A2 (de) | 1990-04-11 |
JPH02237093A (ja) | 1990-09-19 |
DE68912494T2 (de) | 1994-08-18 |
EP0363074A3 (en) | 1990-12-05 |
US5025553A (en) | 1991-06-25 |
EP0363074B1 (de) | 1994-01-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |