GB902463A - Improvements in or relating to soft solder rods or wires - Google Patents
Improvements in or relating to soft solder rods or wiresInfo
- Publication number
- GB902463A GB902463A GB51859A GB51859A GB902463A GB 902463 A GB902463 A GB 902463A GB 51859 A GB51859 A GB 51859A GB 51859 A GB51859 A GB 51859A GB 902463 A GB902463 A GB 902463A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- solder
- wire
- coating
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
902,463. Soldering. MULTICORE SOLDERS Ltd.. Dec. 3, 1959 [Jan. 6, 1959], No. 518/59. Class 83 (4). [Also in Group XXXVI] A soft solder rod or wire has formed thereon a coating of substantially pure copper. The solder may be flux cored or solid, the coating may be applied electrolytically, by chemical deposition or by impregnating, forcing or rolling particles of copper on to the surface of the solder. In providing the copper coating on a flux-cored solder wire, the wire of 50% tin, 50% lead alloy having five cores of activated flux, known under the Registered Trade Mark "Ersin," is fed through an electroplating bath to become coated with 0.1 g. copper for every 450 g. of solder. The coated wire may be passed through a pad soaked with a solution of resin plasticized with dibutyl phthalate. The use of the copper-coated wire is said to reduce wear of a copper bit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB51859A GB902463A (en) | 1959-01-06 | 1959-01-06 | Improvements in or relating to soft solder rods or wires |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB51859A GB902463A (en) | 1959-01-06 | 1959-01-06 | Improvements in or relating to soft solder rods or wires |
Publications (1)
Publication Number | Publication Date |
---|---|
GB902463A true GB902463A (en) | 1962-08-01 |
Family
ID=9705773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB51859A Expired GB902463A (en) | 1959-01-06 | 1959-01-06 | Improvements in or relating to soft solder rods or wires |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB902463A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0363074A2 (en) * | 1988-10-06 | 1990-04-11 | Telco International Ltd., | Circuit board manufacture |
DE102006003191A1 (en) * | 2006-01-24 | 2007-11-15 | Airbus Deutschland Gmbh | Additional material in particular for improving the quality of a joining seam formed during the thermal joining of two metallic components |
-
1959
- 1959-01-06 GB GB51859A patent/GB902463A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0363074A2 (en) * | 1988-10-06 | 1990-04-11 | Telco International Ltd., | Circuit board manufacture |
EP0363074A3 (en) * | 1988-10-06 | 1990-12-05 | Telco International Ltd., | Circuit board manufacture |
US5025553A (en) * | 1988-10-06 | 1991-06-25 | Telco International, Ltd. | Circuit board manufacture |
DE102006003191A1 (en) * | 2006-01-24 | 2007-11-15 | Airbus Deutschland Gmbh | Additional material in particular for improving the quality of a joining seam formed during the thermal joining of two metallic components |
DE102006003191B4 (en) * | 2006-01-24 | 2011-03-17 | Airbus Operations Gmbh | Additional material for the thermal joining of two metallic components and a corresponding use of a filler material |
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