GB1177831A - Methods and Apparatus for Providing Connections Between Printed Circuits - Google Patents

Methods and Apparatus for Providing Connections Between Printed Circuits

Info

Publication number
GB1177831A
GB1177831A GB327867A GB327867A GB1177831A GB 1177831 A GB1177831 A GB 1177831A GB 327867 A GB327867 A GB 327867A GB 327867 A GB327867 A GB 327867A GB 1177831 A GB1177831 A GB 1177831A
Authority
GB
United Kingdom
Prior art keywords
slug
conductor
aperture
washer
fuse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB327867A
Inventor
Harry Thomas Prestige
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
J&S Engineers Ltd
Original Assignee
J&S Engineers Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by J&S Engineers Ltd filed Critical J&S Engineers Ltd
Priority to GB327867A priority Critical patent/GB1177831A/en
Priority to DE19681616272 priority patent/DE1616272A1/en
Priority to FR1551743D priority patent/FR1551743A/fr
Publication of GB1177831A publication Critical patent/GB1177831A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

1,177,831. Punching. J. & S. ENGS. Ltd. 19 Jan., 1968 [23 Jan., 1967], No. 3278/67. Heading B3W. [Also in Division H2] A method of making an electrical connection between overlying portions of at least two printed conductors on respective surfaces of at least two insulating boards is described, by way of example, with reference to a single board 2 carrying printed conductors 3, 4. A punch 7 in a shroud 8 forces a metal slug 5, e.g. brass or nickel, to displace a portion of the board through an aperture 9 in a die 6, so that the upper part of the slug contacts the conductor 3 while the lower part, being of greater diameter than the aperture 9, is peened back by the die 6 to contact the conductor 4. The slug 5 and aperture 9 are preferably circular. The slug may be coated, e.g. with indium or gallium, and heated to fuse with the conductors 3, 4. Alternatively, the ends of the slug and adjacent areas of conductor may be tinned or plated and projecting parts of the slug may be flattened by rollers. In an alternative embodiment, instead of peening back the leading end of the slug 9, it is forced into a washer (20, Fig. 4, not shown), contained in the aperture 9, so that the washer contacts the conductor 4. The washer may be coated, e.g. with indium, and heated to fuse with the slug and the conductor. The upper end of the slug 5 may have an integral terminal thereon, the punch 7 being suitably modified. Reference has been directed by the Comptroller to Specification 776,373.
GB327867A 1967-01-23 1967-01-23 Methods and Apparatus for Providing Connections Between Printed Circuits Expired GB1177831A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB327867A GB1177831A (en) 1967-01-23 1967-01-23 Methods and Apparatus for Providing Connections Between Printed Circuits
DE19681616272 DE1616272A1 (en) 1967-01-23 1968-01-18 Method for the electrically conductive connection of printed circuits arranged one above the other
FR1551743D FR1551743A (en) 1967-01-23 1968-01-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB327867A GB1177831A (en) 1967-01-23 1967-01-23 Methods and Apparatus for Providing Connections Between Printed Circuits

Publications (1)

Publication Number Publication Date
GB1177831A true GB1177831A (en) 1970-01-14

Family

ID=9755323

Family Applications (1)

Application Number Title Priority Date Filing Date
GB327867A Expired GB1177831A (en) 1967-01-23 1967-01-23 Methods and Apparatus for Providing Connections Between Printed Circuits

Country Status (3)

Country Link
DE (1) DE1616272A1 (en)
FR (1) FR1551743A (en)
GB (1) GB1177831A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503611A (en) * 1981-09-18 1985-03-12 Molex Incorporated Method of making a circuit assembly
WO1989005571A1 (en) * 1987-12-09 1989-06-15 Cabot Electronics Ceramics, Inc. Low cost, hermetic pin grid array package
US5025553A (en) * 1988-10-06 1991-06-25 Telco International, Ltd. Circuit board manufacture
US5305523A (en) * 1992-12-24 1994-04-26 International Business Machines Corporation Method of direct transferring of electrically conductive elements into a substrate
US5326245A (en) * 1992-06-26 1994-07-05 International Business Machines Corporation Apparatus for extruding materials that exhibit anisotropic properties due to molecular or fibril orientation as a result of the extrusion process
EP1107654A1 (en) * 1999-05-25 2001-06-13 Mitsui Mining & Smelting Co., Ltd. Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same
WO2019170297A1 (en) * 2018-03-07 2019-09-12 Robert Bosch Gmbh Electrical device, method for producing an electrical device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2513444B1 (en) * 1981-09-18 1987-08-21 Molex Inc DEVICE AND METHOD FOR CONNECTING A TERMINAL TO A FLEXIBLE CIRCUIT

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503611A (en) * 1981-09-18 1985-03-12 Molex Incorporated Method of making a circuit assembly
WO1989005571A1 (en) * 1987-12-09 1989-06-15 Cabot Electronics Ceramics, Inc. Low cost, hermetic pin grid array package
US4861944A (en) * 1987-12-09 1989-08-29 Cabot Electronics Ceramics, Inc. Low cost, hermetic pin grid array package
US5025553A (en) * 1988-10-06 1991-06-25 Telco International, Ltd. Circuit board manufacture
US5326245A (en) * 1992-06-26 1994-07-05 International Business Machines Corporation Apparatus for extruding materials that exhibit anisotropic properties due to molecular or fibril orientation as a result of the extrusion process
US5305523A (en) * 1992-12-24 1994-04-26 International Business Machines Corporation Method of direct transferring of electrically conductive elements into a substrate
EP1107654A1 (en) * 1999-05-25 2001-06-13 Mitsui Mining & Smelting Co., Ltd. Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same
EP1107654A4 (en) * 1999-05-25 2006-05-24 Mitsui Mining & Smelting Co Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same
WO2019170297A1 (en) * 2018-03-07 2019-09-12 Robert Bosch Gmbh Electrical device, method for producing an electrical device

Also Published As

Publication number Publication date
FR1551743A (en) 1968-12-27
DE1616272A1 (en) 1971-05-06

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