DE69024731D1 - Verfahren zur Herstellung einer plastikumhüllten Halbleiteranordnung - Google Patents

Verfahren zur Herstellung einer plastikumhüllten Halbleiteranordnung

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Publication number
DE69024731D1
DE69024731D1 DE69024731T DE69024731T DE69024731D1 DE 69024731 D1 DE69024731 D1 DE 69024731D1 DE 69024731 T DE69024731 T DE 69024731T DE 69024731 T DE69024731 T DE 69024731T DE 69024731 D1 DE69024731 D1 DE 69024731D1
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DE
Germany
Prior art keywords
plastic
producing
semiconductor arrangement
coated semiconductor
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69024731T
Other languages
English (en)
Other versions
DE69024731T2 (de
Inventor
Tetsuya Nagaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
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Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69024731D1 publication Critical patent/DE69024731D1/de
Application granted granted Critical
Publication of DE69024731T2 publication Critical patent/DE69024731T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69024731T 1989-09-12 1990-09-12 Verfahren zur Herstellung einer plastikumhüllten Halbleiteranordnung Expired - Fee Related DE69024731T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1236408A JP2637247B2 (ja) 1989-09-12 1989-09-12 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
DE69024731D1 true DE69024731D1 (de) 1996-02-22
DE69024731T2 DE69024731T2 (de) 1996-06-27

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Country Link
US (1) US5045919A (de)
EP (1) EP0419941B1 (de)
JP (1) JP2637247B2 (de)
KR (1) KR910007094A (de)
DE (1) DE69024731T2 (de)

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US5310526A (en) * 1990-10-30 1994-05-10 The Dow Chemical Company Chemical sensor
US5245214A (en) * 1991-06-06 1993-09-14 Northern Telecom Limited Method of designing a leadframe and a leadframe created thereby
JP2526787B2 (ja) * 1993-07-01 1996-08-21 日本電気株式会社 半導体装置用リ―ドフレ―ム
US5684332A (en) * 1994-05-27 1997-11-04 Advanced Semiconductor Engineering, Inc. Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom
US6909179B2 (en) * 1996-03-18 2005-06-21 Renesas Technology Corp. Lead frame and semiconductor device using the lead frame and method of manufacturing the same
JPH09312375A (ja) * 1996-03-18 1997-12-02 Hitachi Ltd リードフレーム、半導体装置及び半導体装置の製造方法
US5780772A (en) * 1997-01-24 1998-07-14 National Semiconductor Corporation Solution to mold wire sweep in fine pitch devices
KR100265461B1 (ko) * 1997-11-21 2000-09-15 윤종용 더미본딩와이어를포함하는반도체집적회로소자
US6297078B1 (en) 1997-12-31 2001-10-02 Intel Corporation Integrated circuit package with bond wires at the corners of an integrated circuit
US6444295B1 (en) 1998-12-29 2002-09-03 Industrial Technology Research Institute Method for improving integrated circuits bonding firmness
US6225685B1 (en) * 2000-04-05 2001-05-01 Advanced Micro Devices, Inc. Lead frame design for reduced wire sweep having a defined gap between tie bars and lead pins
KR100642748B1 (ko) * 2004-07-24 2006-11-10 삼성전자주식회사 리드 프레임과 패키지 기판 및 이들을 이용한 패키지
US8035188B2 (en) 2004-07-28 2011-10-11 Panasonic Corporation Semiconductor device
US20060220191A1 (en) * 2005-04-01 2006-10-05 Honeywell International Inc. Electronic package with a stepped-pitch leadframe
US7829983B2 (en) * 2005-08-01 2010-11-09 Panasonic Corporation Semiconductor device

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Publication number Priority date Publication date Assignee Title
JPS5385541A (en) * 1977-01-07 1978-07-28 Hitachi Metals Ltd Exhaust heat recovery system for industial firing furnace
JPS5479563A (en) * 1977-12-07 1979-06-25 Kyushu Nippon Electric Lead frame for semiconductor
EP0078606A3 (de) * 1981-11-02 1985-04-24 Texas Instruments Incorporated Halbleiterzusammenbau mit Drahtträger
JPS6046041A (ja) * 1983-08-24 1985-03-12 Nec Corp 半導体装置
JPS60171734A (ja) * 1984-02-17 1985-09-05 Hitachi Ltd 半導体装置
WO1986002200A1 (en) * 1984-09-27 1986-04-10 Motorola, Inc. Lead frame having improved arrangement of supporting leads and semiconductor device employing the same
JPS6195559A (ja) * 1984-10-17 1986-05-14 Hitachi Ltd リ−ドフレ−ム及びそれを用いた半導体装置
JPS63126257A (ja) * 1986-11-17 1988-05-30 Hitachi Ltd 半導体装置
JPS63239831A (ja) * 1987-03-27 1988-10-05 Toshiba Corp 半導体装置の製造方法
JPH0216565A (ja) * 1988-07-05 1990-01-19 Mitsubishi Electric Corp 感光性樹脂組成物
JPH01315149A (ja) * 1988-08-05 1989-12-20 Hitachi Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
KR910007094A (ko) 1991-04-30
EP0419941A2 (de) 1991-04-03
DE69024731T2 (de) 1996-06-27
EP0419941A3 (en) 1992-10-07
EP0419941B1 (de) 1996-01-10
US5045919A (en) 1991-09-03
JPH0399445A (ja) 1991-04-24
JP2637247B2 (ja) 1997-08-06

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