DE68915072D1 - Integrierte Halbleiterschaltung für ein Radio. - Google Patents
Integrierte Halbleiterschaltung für ein Radio.Info
- Publication number
- DE68915072D1 DE68915072D1 DE68915072T DE68915072T DE68915072D1 DE 68915072 D1 DE68915072 D1 DE 68915072D1 DE 68915072 T DE68915072 T DE 68915072T DE 68915072 T DE68915072 T DE 68915072T DE 68915072 D1 DE68915072 D1 DE 68915072D1
- Authority
- DE
- Germany
- Prior art keywords
- radio
- semiconductor circuit
- integrated semiconductor
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63173007A JPH0652771B2 (ja) | 1988-07-12 | 1988-07-12 | リニア半導体集積回路 |
JP63202197A JPH0750779B2 (ja) | 1988-08-12 | 1988-08-12 | 半導体集積回路 |
JP63291450A JPH0821617B2 (ja) | 1988-11-17 | 1988-11-17 | 半導体集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68915072D1 true DE68915072D1 (de) | 1994-06-09 |
DE68915072T2 DE68915072T2 (de) | 1994-12-08 |
Family
ID=27323716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68915072T Expired - Lifetime DE68915072T2 (de) | 1988-07-12 | 1989-07-12 | Integrierte Halbleiterschaltung für ein Radio. |
Country Status (4)
Country | Link |
---|---|
US (2) | US5050238A (de) |
EP (1) | EP0354371B1 (de) |
KR (1) | KR920005802B1 (de) |
DE (1) | DE68915072T2 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5155570A (en) * | 1988-06-21 | 1992-10-13 | Sanyo Electric Co., Ltd. | Semiconductor integrated circuit having a pattern layout applicable to various custom ICs |
KR920005863B1 (ko) * | 1988-08-12 | 1992-07-23 | 산요덴끼 가부시끼가이샤 | 반도체 집적회로 |
US5780918A (en) * | 1990-05-22 | 1998-07-14 | Seiko Epson Corporation | Semiconductor integrated circuit device having a programmable adjusting element in the form of a fuse mounted on a margin of the device and a method of manufacturing the same |
US5151769A (en) * | 1991-04-04 | 1992-09-29 | General Electric Company | Optically patterned RF shield for an integrated circuit chip for analog and/or digital operation at microwave frequencies |
JPH05152291A (ja) * | 1991-11-29 | 1993-06-18 | Mitsubishi Electric Corp | 半導体集積回路装置 |
JP3252569B2 (ja) * | 1993-11-09 | 2002-02-04 | 株式会社デンソー | 絶縁分離基板及びそれを用いた半導体装置及びその製造方法 |
WO1995022839A1 (en) * | 1994-02-17 | 1995-08-24 | National Semiconductor Corporation | Packaged integrated circuit with reduced electromagnetic interference |
US5828110A (en) * | 1995-06-05 | 1998-10-27 | Advanced Micro Devices, Inc. | Latchup-proof I/O circuit implementation |
GB9513420D0 (en) * | 1995-06-30 | 1995-09-06 | Philips Electronics Uk Ltd | Power semiconductor devices |
KR100415567B1 (ko) * | 2001-10-16 | 2004-01-24 | 삼성전기주식회사 | 더블 컨버젼방식 알에프 튜너 |
JP3681677B2 (ja) | 2001-11-21 | 2005-08-10 | テクノポリマー株式会社 | ポリマー片の洗浄装置 |
US20030114129A1 (en) * | 2001-12-17 | 2003-06-19 | Jerng Albert C. | System and method for a radio frequency receiver front end utilizing a balun to couple a low-noise amplifier to a mixer |
JP2003273231A (ja) * | 2002-03-19 | 2003-09-26 | Fujitsu Ltd | 半導体集積回路のシールド構造 |
JP2003318754A (ja) * | 2002-04-24 | 2003-11-07 | Alps Electric Co Ltd | テレビジョンチューナ |
JP3677011B2 (ja) * | 2002-04-30 | 2005-07-27 | アルプス電気株式会社 | 液晶表示装置 |
US6657285B1 (en) * | 2002-07-08 | 2003-12-02 | Alcor Micro, Corp. | Semiconductor anti-interference band for integrated circuit |
US7493094B2 (en) * | 2005-01-19 | 2009-02-17 | Micro Mobio Corporation | Multi-mode power amplifier module for wireless communication devices |
US6774718B2 (en) * | 2002-07-19 | 2004-08-10 | Micro Mobio Inc. | Power amplifier module for wireless communication devices |
US20040232982A1 (en) * | 2002-07-19 | 2004-11-25 | Ikuroh Ichitsubo | RF front-end module for wireless communication devices |
US7071783B2 (en) * | 2002-07-19 | 2006-07-04 | Micro Mobio Corporation | Temperature-compensated power sensing circuit for power amplifiers |
DE10313868B4 (de) * | 2003-03-21 | 2009-11-19 | Siemens Ag | Katheter zur magnetischen Navigation |
JP3100213U (ja) * | 2003-09-03 | 2004-05-13 | アルプス電気株式会社 | テレビジョンチューナ |
JP3100214U (ja) * | 2003-09-03 | 2004-05-13 | アルプス電気株式会社 | テレビジョンチューナ |
US20050205986A1 (en) * | 2004-03-18 | 2005-09-22 | Ikuroh Ichitsubo | Module with integrated active substrate and passive substrate |
US7254371B2 (en) * | 2004-08-16 | 2007-08-07 | Micro-Mobio, Inc. | Multi-port multi-band RF switch |
US7262677B2 (en) * | 2004-10-25 | 2007-08-28 | Micro-Mobio, Inc. | Frequency filtering circuit for wireless communication devices |
US7389090B1 (en) | 2004-10-25 | 2008-06-17 | Micro Mobio, Inc. | Diplexer circuit for wireless communication devices |
US20060089099A1 (en) * | 2004-10-26 | 2006-04-27 | Buchwald Gregory J | Method and apparatus for allowing communication units to utilize non-licensed spectrum |
US7239624B2 (en) * | 2004-10-26 | 2007-07-03 | Motorola, Inc. | Method and apparatus for allowing communication units to utilize non-licensed title spectrum |
US7221225B2 (en) | 2004-12-03 | 2007-05-22 | Micro-Mobio | Dual band power amplifier module for wireless communication devices |
US8716834B2 (en) * | 2004-12-24 | 2014-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including antenna |
US7769355B2 (en) * | 2005-01-19 | 2010-08-03 | Micro Mobio Corporation | System-in-package wireless communication device comprising prepackaged power amplifier |
US7348842B2 (en) * | 2005-01-19 | 2008-03-25 | Micro-Mobio | Multi-substrate RF module for wireless communication devices |
US7580687B2 (en) | 2005-01-19 | 2009-08-25 | Micro Mobio Corporation | System-in-package wireless communication device comprising prepackaged power amplifier |
US7548111B2 (en) * | 2005-01-19 | 2009-06-16 | Micro Mobio Corporation | Miniature dual band power amplifier with reserved pins |
US7119614B2 (en) * | 2005-01-19 | 2006-10-10 | Micro-Mobio | Multi-band power amplifier module for wireless communications |
US7084702B1 (en) | 2005-01-19 | 2006-08-01 | Micro Mobio Corp. | Multi-band power amplifier module for wireless communication devices |
US20070063982A1 (en) * | 2005-09-19 | 2007-03-22 | Tran Bao Q | Integrated rendering of sound and image on a display |
US7477204B2 (en) * | 2005-12-30 | 2009-01-13 | Micro-Mobio, Inc. | Printed circuit board based smart antenna |
JP2007243863A (ja) * | 2006-03-13 | 2007-09-20 | Niigata Seimitsu Kk | Amラジオ付き携帯機器 |
US7477108B2 (en) * | 2006-07-14 | 2009-01-13 | Micro Mobio, Inc. | Thermally distributed integrated power amplifier module |
US20090275286A1 (en) * | 2008-04-30 | 2009-11-05 | Motorola, Inc. | Utilization of cognitive radios with mobile virtual private network (mvpn) solutions |
JP6132692B2 (ja) * | 2013-07-19 | 2017-05-24 | 株式会社東芝 | アンテナ装置 |
EP4068337A4 (de) * | 2019-12-18 | 2023-01-25 | Huawei Technologies Co., Ltd. | Chip-struktur und drahtlose kommunikationsvorrichtung |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3489953A (en) * | 1964-09-18 | 1970-01-13 | Texas Instruments Inc | Stabilized integrated circuit and process for fabricating same |
US3723882A (en) * | 1971-08-02 | 1973-03-27 | Zenith Radio Corp | Multi-band television tuner arrangement |
JPS547196B2 (de) * | 1971-08-26 | 1979-04-04 | ||
JPS4982646U (de) * | 1972-11-02 | 1974-07-17 | ||
US3886458A (en) * | 1972-12-12 | 1975-05-27 | Sony Corp | Frequency converter circuit with integrated injection capacitor |
US4146905A (en) * | 1974-06-18 | 1979-03-27 | U.S. Philips Corporation | Semiconductor device having complementary transistor structures and method of manufacturing same |
JPS51135383A (en) * | 1975-05-20 | 1976-11-24 | Sony Corp | Semiconductor variable capacitance device |
US4135158A (en) * | 1975-06-02 | 1979-01-16 | Motorola, Inc. | Universal automotive electronic radio |
JPS5833708B2 (ja) * | 1977-01-31 | 1983-07-21 | 株式会社東芝 | 集積回路装置 |
DE2835930C2 (de) * | 1978-08-17 | 1986-07-17 | Siemens AG, 1000 Berlin und 8000 München | Monolithisch integrierte Halbleiterschaltungsanordnung mit mindestens einem Lateraltransistor |
US4412238A (en) * | 1980-05-27 | 1983-10-25 | National Semiconductor Corporation | Simplified BIFET structure |
US4383273A (en) * | 1980-12-29 | 1983-05-10 | Motorola, Inc. | Large scale, single chip integrated circuit television receiver subsystems |
GB2097581A (en) * | 1981-04-24 | 1982-11-03 | Hitachi Ltd | Shielding semiconductor integrated circuit devices from light |
DE3133760C2 (de) * | 1981-08-26 | 1983-09-01 | Deutsche Thomson-Brandt Gmbh, 7730 Villingen-Schwenningen | Empfangsstufe für Rundfunk- und Fernsehempfänger |
JPS58157151A (ja) * | 1982-03-15 | 1983-09-19 | Mitsubishi Electric Corp | 半導体集積回路装置 |
DE3231952A1 (de) * | 1982-08-27 | 1984-03-01 | Dieter 4600 Dortmund Krebs | Autoradio |
JPS5984542A (ja) * | 1982-11-08 | 1984-05-16 | Nec Corp | 高周波半導体集積回路 |
JPS601843A (ja) * | 1983-06-17 | 1985-01-08 | Sanyo Electric Co Ltd | 半導体集積回路 |
JPS6035537A (ja) * | 1983-08-08 | 1985-02-23 | Nec Corp | 半導体集積回路 |
US4661998A (en) * | 1983-09-22 | 1987-04-28 | Matsushita Electric Industrial Co. Ltd. | Double superheterodyne tuner |
JPS60154644A (ja) * | 1984-01-25 | 1985-08-14 | Hitachi Ltd | 半導体装置 |
JPS60165752A (ja) * | 1984-02-08 | 1985-08-28 | Nec Corp | 半導体集積回路 |
JPS60192359A (ja) * | 1984-03-14 | 1985-09-30 | Nec Corp | 半導体メモリ装置 |
JPS61137407A (ja) * | 1984-12-08 | 1986-06-25 | New Japan Radio Co Ltd | 周波数変換器 |
JPS61150410A (ja) * | 1984-12-24 | 1986-07-09 | Sony Corp | チユ−ナ装置 |
JPS61218155A (ja) * | 1985-03-25 | 1986-09-27 | Hitachi Ltd | 半導体集積回路装置 |
JPS61276365A (ja) * | 1985-05-31 | 1986-12-06 | Oki Electric Ind Co Ltd | 半導体装置 |
JPS6212147A (ja) * | 1985-07-10 | 1987-01-21 | Hitachi Ltd | マスタ−スライス方式の半導体装置 |
US4970565A (en) * | 1988-09-01 | 1990-11-13 | Atmel Corporation | Sealed charge storage structure |
-
1989
- 1989-07-11 US US07/378,397 patent/US5050238A/en not_active Expired - Lifetime
- 1989-07-12 EP EP89112788A patent/EP0354371B1/de not_active Expired - Lifetime
- 1989-07-12 KR KR1019890010005A patent/KR920005802B1/ko not_active IP Right Cessation
- 1989-07-12 DE DE68915072T patent/DE68915072T2/de not_active Expired - Lifetime
-
1990
- 1990-10-23 US US07/602,184 patent/US5111274A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR900002446A (ko) | 1990-02-28 |
EP0354371A2 (de) | 1990-02-14 |
KR920005802B1 (ko) | 1992-07-18 |
US5050238A (en) | 1991-09-17 |
US5111274A (en) | 1992-05-05 |
EP0354371A3 (en) | 1990-11-07 |
DE68915072T2 (de) | 1994-12-08 |
EP0354371B1 (de) | 1994-05-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |