DE68910155T2 - Mehrschichtige keramische Unterlagen und Verfahren zu ihrer Herstellung. - Google Patents

Mehrschichtige keramische Unterlagen und Verfahren zu ihrer Herstellung.

Info

Publication number
DE68910155T2
DE68910155T2 DE89302380T DE68910155T DE68910155T2 DE 68910155 T2 DE68910155 T2 DE 68910155T2 DE 89302380 T DE89302380 T DE 89302380T DE 68910155 T DE68910155 T DE 68910155T DE 68910155 T2 DE68910155 T2 DE 68910155T2
Authority
DE
Germany
Prior art keywords
underlays
manufacture
processes
multilayer ceramic
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89302380T
Other languages
English (en)
Other versions
DE68910155D1 (de
Inventor
Seiichi Nakatani
Satoru Yuhaku
Tsutomu Nishimura
Yukio Terada
Yasuyuki Baba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE68910155D1 publication Critical patent/DE68910155D1/de
Publication of DE68910155T2 publication Critical patent/DE68910155T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B35/63416—Polyvinylalcohols [PVA]; Polyvinylacetates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
    • C04B35/18—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in aluminium oxide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B35/6342—Polyvinylacetals, e.g. polyvinylbutyral [PVB]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B35/63424—Polyacrylates; Polymethacrylates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/636—Polysaccharides or derivatives thereof
    • C04B35/6365—Cellulose or derivatives thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE89302380T 1988-03-11 1989-03-10 Mehrschichtige keramische Unterlagen und Verfahren zu ihrer Herstellung. Expired - Fee Related DE68910155T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63058752A JPH0728128B2 (ja) 1988-03-11 1988-03-11 セラミック多層配線基板とその製造方法

Publications (2)

Publication Number Publication Date
DE68910155D1 DE68910155D1 (de) 1993-12-02
DE68910155T2 true DE68910155T2 (de) 1994-04-14

Family

ID=13093271

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89302380T Expired - Fee Related DE68910155T2 (de) 1988-03-11 1989-03-10 Mehrschichtige keramische Unterlagen und Verfahren zu ihrer Herstellung.

Country Status (4)

Country Link
US (1) US5004640A (de)
EP (1) EP0332457B1 (de)
JP (1) JPH0728128B2 (de)
DE (1) DE68910155T2 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139975A (en) * 1988-07-18 1992-08-18 International Business Machines Corporation Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates
JPH04221888A (ja) * 1990-12-21 1992-08-12 Matsushita Electric Ind Co Ltd セラミック配線基板とその製造方法
JP2657008B2 (ja) * 1991-06-26 1997-09-24 日本特殊陶業株式会社 セラミックス用メタライズ組成物
US5925443A (en) * 1991-09-10 1999-07-20 International Business Machines Corporation Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
US5403651A (en) * 1991-10-14 1995-04-04 Fuji Electric Co., Ltd. Insulating substrate for mounting semiconductor devices
JPH05218654A (ja) * 1991-10-25 1993-08-27 Internatl Business Mach Corp <Ibm> マイクロ波を用いたセラミック複合構造の製造方法
US5281772A (en) * 1991-10-28 1994-01-25 Delco Electronics Corporation Electrical connector having energy-formed solder stops and methods of making and using the same
DE69328390T2 (de) * 1992-05-20 2000-12-07 Matsushita Electric Ind Co Ltd Verfahren zur Herstellung eines mehrlagigen Substrats
JP3003413B2 (ja) * 1992-09-21 2000-01-31 松下電器産業株式会社 多層セラミック基板の製造方法
US5431987A (en) * 1992-11-04 1995-07-11 Susumu Okamura Noise filter
JPH0715101A (ja) * 1993-06-25 1995-01-17 Shinko Electric Ind Co Ltd 酸化物セラミック回路基板及びその製造方法
US5640051A (en) * 1993-12-13 1997-06-17 Matsushita Electric Industrial Co., Ltd. Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex
JPH08125341A (ja) * 1994-10-25 1996-05-17 Hitachi Ltd 電子回路装置
US5716713A (en) * 1994-12-16 1998-02-10 Ceramic Packaging, Inc. Stacked planar transformer
US5565262A (en) * 1995-01-27 1996-10-15 David Sarnoff Research Center, Inc. Electrical feedthroughs for ceramic circuit board support substrates
JP3019136B2 (ja) * 1995-03-09 2000-03-13 株式会社住友金属エレクトロデバイス 厚膜ペースト及びそれを用いたセラミック回路基板
US5671116A (en) * 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
US6007900A (en) * 1995-04-28 1999-12-28 Murata Manufacturing Co., Ltd. Dielectric paste and thick-film capacitor using same
JP3327045B2 (ja) * 1995-04-28 2002-09-24 株式会社村田製作所 誘電体ペースト及びそれを用いた厚膜コンデンサ
DE69835934D1 (de) * 1997-12-03 2006-11-02 Tdk Corp Mehrlagiges keramisches Elektronikbauteil und dessen Herstellungsverfahren
JP2000124612A (ja) * 1998-01-19 2000-04-28 Toshiba Corp 配線基板とその製造方法、その配線基板を具える電気機器
US6320139B1 (en) 1998-11-12 2001-11-20 Rockwell Automation Technologies, Inc. Reflow selective shorting
JP2000277369A (ja) * 1999-03-29 2000-10-06 Taiyo Yuden Co Ltd 積層セラミック電子部品とその導電ペースト
US6730857B2 (en) * 2001-03-13 2004-05-04 International Business Machines Corporation Structure having laser ablated features and method of fabricating
JP2003031948A (ja) * 2001-07-12 2003-01-31 Matsushita Electric Ind Co Ltd セラミック多層基板の製造方法
WO2004015384A1 (ja) * 2002-08-07 2004-02-19 Matsushita Electric Industrial Co., Ltd. 荷重センサ及びその製造方法、それに用いるペースト及びその製造方法
KR100708755B1 (ko) * 2003-03-31 2007-04-17 티디케이가부시기가이샤 그린 시트용 도료, 그린 시트, 그린 시트의 제조방법 및전자 부품의 제조방법
JP3944144B2 (ja) * 2003-09-25 2007-07-11 Ｔｄｋ株式会社 セラミック電子部品及びその製造方法
KR100896610B1 (ko) * 2007-11-05 2009-05-08 삼성전기주식회사 다층 세라믹 기판 및 그 제조방법
US8178192B2 (en) * 2008-03-06 2012-05-15 Ngk Insulators, Ltd. Ceramic green sheet, ceramic green sheet laminate, production method of ceramic green sheet, and production method of ceramic green sheet laminate
EP2778144A1 (de) * 2013-03-11 2014-09-17 Keramik Holding AG Laufen Keramisches Material
CN111746065B (zh) * 2020-07-23 2022-02-22 东莞市盛元新材料科技有限公司 一种导热硅胶垫

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3914517A (en) * 1971-02-23 1975-10-21 Owens Illinois Inc Method of forming a conductively coated crystalline glass article and product produced thereby
FR2234239B1 (de) * 1973-06-25 1977-02-18 Ishizuka Glass
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
JPS6025398B2 (ja) * 1980-12-27 1985-06-18 セントラル硝子株式会社 グレ−ズドセラミック基板
JPS5922399B2 (ja) * 1981-10-14 1984-05-26 日本電気株式会社 多層セラミツク基板
US4414281A (en) * 1982-02-16 1983-11-08 Corning Glass Works Glass-ceramic articles having metallic surfaces
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
JPS60221358A (ja) * 1984-04-13 1985-11-06 日本碍子株式会社 電気絶縁体用セラミック組成物
JPS60260465A (ja) * 1984-06-01 1985-12-23 鳴海製陶株式会社 低温焼成セラミツクス
US4714570A (en) * 1984-07-17 1987-12-22 Matsushita Electric Industrial Co., Ltd. Conductor paste and method of manufacturing a multilayered ceramic body using the paste
JPS61155243A (ja) * 1984-12-28 1986-07-14 富士通株式会社 グリ−ンシ−ト組成物
US4812422A (en) * 1985-06-17 1989-03-14 Matsushita Electric Industrial Co., Ltd. Dielectric paste and method of manufacturing the paste
US4687540A (en) * 1985-12-20 1987-08-18 Olin Corporation Method of manufacturing glass capacitors and resulting product
JPH0680897B2 (ja) * 1985-12-20 1994-10-12 松下電器産業株式会社 セラミツク銅多層配線基板の製造方法
US4725333A (en) * 1985-12-20 1988-02-16 Olin Corporation Metal-glass laminate and process for producing same
JPS62173797A (ja) * 1986-01-27 1987-07-30 松下電器産業株式会社 セラミック多層配線基板
JPS62205692A (ja) * 1986-03-06 1987-09-10 松下電器産業株式会社 セラミツク多層配線基板の製造方法
US4885038A (en) * 1986-05-01 1989-12-05 International Business Machines Corporation Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
JPH0685468B2 (ja) * 1986-06-10 1994-10-26 松下電器産業株式会社 セラミツク多層基板の製造方法
JPS63215559A (ja) * 1987-02-27 1988-09-08 日本碍子株式会社 セラミツク基板
US4853349A (en) * 1988-05-26 1989-08-01 Corning Glass Works Glass-ceramics suitable for dielectric substrates

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JPH01231398A (ja) 1989-09-14
US5004640A (en) 1991-04-02
EP0332457B1 (de) 1993-10-27
EP0332457A3 (en) 1989-10-25
JPH0728128B2 (ja) 1995-03-29
EP0332457A2 (de) 1989-09-13
DE68910155D1 (de) 1993-12-02

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