DE60232205D1 - Klebefolie mit Leiterkörpern zur Flip-Chip-Montage - Google Patents

Klebefolie mit Leiterkörpern zur Flip-Chip-Montage

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Publication number
DE60232205D1
DE60232205D1 DE60232205T DE60232205T DE60232205D1 DE 60232205 D1 DE60232205 D1 DE 60232205D1 DE 60232205 T DE60232205 T DE 60232205T DE 60232205 T DE60232205 T DE 60232205T DE 60232205 D1 DE60232205 D1 DE 60232205D1
Authority
DE
Germany
Prior art keywords
flip
adhesive film
chip mounting
conductor bodies
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60232205T
Other languages
English (en)
Inventor
Osamu Yamazaki
Kazuyoshi Ebe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of DE60232205D1 publication Critical patent/DE60232205D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
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US20020140093A1 (en) 2002-10-03
JP2002299378A (ja) 2002-10-11
US6911720B2 (en) 2005-06-28
US20040012098A1 (en) 2004-01-22
EP1248291A3 (de) 2006-05-31
CN1387244A (zh) 2002-12-25
EP1248291B1 (de) 2009-05-06
TW548758B (en) 2003-08-21
EP1248291A2 (de) 2002-10-09
US6900550B2 (en) 2005-05-31
CN1261990C (zh) 2006-06-28
US20030226640A1 (en) 2003-12-11

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