DE60222736D1 - Optisches Modul mit Monitor-Photodiode - Google Patents
Optisches Modul mit Monitor-PhotodiodeInfo
- Publication number
- DE60222736D1 DE60222736D1 DE60222736T DE60222736T DE60222736D1 DE 60222736 D1 DE60222736 D1 DE 60222736D1 DE 60222736 T DE60222736 T DE 60222736T DE 60222736 T DE60222736 T DE 60222736T DE 60222736 D1 DE60222736 D1 DE 60222736D1
- Authority
- DE
- Germany
- Prior art keywords
- optical module
- monitor photodiode
- photodiode
- monitor
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002105148A JP2003303975A (ja) | 2002-04-08 | 2002-04-08 | モニタ用フォトダイオード付光モジュール。 |
JP2002105148 | 2002-04-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60222736D1 true DE60222736D1 (de) | 2007-11-15 |
DE60222736T2 DE60222736T2 (de) | 2008-07-17 |
Family
ID=28449898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60222736T Expired - Lifetime DE60222736T2 (de) | 2002-04-08 | 2002-06-07 | Optisches Modul mit Monitor-Photodiode |
Country Status (4)
Country | Link |
---|---|
US (1) | US6813102B2 (de) |
EP (1) | EP1353421B1 (de) |
JP (1) | JP2003303975A (de) |
DE (1) | DE60222736T2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050043219A (ko) * | 2003-11-05 | 2005-05-11 | 엘지전자 주식회사 | 광 픽업 모듈 및 그 제조 방법 |
JP2008010710A (ja) | 2006-06-30 | 2008-01-17 | Oki Electric Ind Co Ltd | 半導体レーザ装置 |
JP2008103991A (ja) * | 2006-10-19 | 2008-05-01 | Oki Electric Ind Co Ltd | データ伝送方法 |
US20090043211A1 (en) * | 2007-03-28 | 2009-02-12 | Albert Ting | Mems based optical coherence tomography probe |
JP5197978B2 (ja) * | 2007-03-29 | 2013-05-15 | 住友電工デバイス・イノベーション株式会社 | 光半導体モジュール |
JP2009253086A (ja) * | 2008-04-08 | 2009-10-29 | Sumitomo Electric Ind Ltd | 発光モジュール |
JP2011204788A (ja) * | 2010-03-24 | 2011-10-13 | Sumitomo Electric Ind Ltd | 光モジュール |
US8605763B2 (en) | 2010-03-31 | 2013-12-10 | Microsoft Corporation | Temperature measurement and control for laser and light-emitting diodes |
KR101430634B1 (ko) | 2010-11-19 | 2014-08-18 | 한국전자통신연구원 | 광 모듈 |
JP7082418B2 (ja) | 2019-11-26 | 2022-06-08 | 株式会社エルムテクノロジー | 半導体レーザー装置 |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4293826A (en) * | 1979-04-30 | 1981-10-06 | Xerox Corporation | Hybrid semiconductor laser/detectors |
JPS6215878A (ja) * | 1985-07-12 | 1987-01-24 | Sharp Corp | 半導体レ−ザ装置 |
JPS62219673A (ja) * | 1986-03-20 | 1987-09-26 | Hitachi Ltd | 光電子装置 |
JPS62219672A (ja) * | 1986-03-20 | 1987-09-26 | Hitachi Tobu Semiconductor Ltd | 光電子装置 |
US4904036A (en) * | 1988-03-03 | 1990-02-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Subassemblies for optoelectronic hybrid integrated circuits |
JP3157898B2 (ja) * | 1992-04-27 | 2001-04-16 | シャープ株式会社 | 光半導体装置 |
US5557116A (en) * | 1992-12-24 | 1996-09-17 | Sharp Kabushiki Kaisha | Semiconductor laser device and resin layer |
JPH06289258A (ja) | 1993-04-07 | 1994-10-18 | Hitachi Ltd | 半導体レーザ装置 |
US5499312A (en) * | 1993-11-09 | 1996-03-12 | Hewlett-Packard Company | Passive alignment and packaging of optoelectronic components to optical waveguides using flip-chip bonding technology |
JPH07199006A (ja) * | 1994-01-11 | 1995-08-04 | Hitachi Ltd | 光サブアセンブリ及び光モジュール |
JPH08235663A (ja) * | 1995-02-24 | 1996-09-13 | Sony Corp | 光学素子 |
US5631987A (en) * | 1995-06-07 | 1997-05-20 | Reliaspeed, Inc. | Low cost, mode-field matched, high performance laser transmitter optical subassembly |
JPH0921929A (ja) | 1995-07-06 | 1997-01-21 | Oki Electric Ind Co Ltd | 光モジュール |
JPH0964383A (ja) * | 1995-08-22 | 1997-03-07 | Hitachi Ltd | 光電子装置 |
EP0782224B1 (de) * | 1995-12-22 | 2000-12-20 | Lucent Technologies Inc. | Optische Unteranordnung mit niedriger Abmessung |
JP3417200B2 (ja) * | 1996-03-15 | 2003-06-16 | 住友電気工業株式会社 | 光送受信モジュ−ル |
JPH09307134A (ja) * | 1996-05-13 | 1997-11-28 | Fujitsu Ltd | 受光素子及びその光モジュール並びに光ユニット |
JPH1022576A (ja) * | 1996-07-01 | 1998-01-23 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JP3218980B2 (ja) | 1996-07-02 | 2001-10-15 | 日亜化学工業株式会社 | 2次元レーザアレー |
JPH10173207A (ja) | 1996-10-11 | 1998-06-26 | Sharp Corp | 光送受信モジュール |
JPH11163390A (ja) * | 1997-11-28 | 1999-06-18 | Fujitsu Ltd | 光モジュール |
JP3767156B2 (ja) * | 1998-02-23 | 2006-04-19 | 住友電気工業株式会社 | 光送受信モジュ−ル |
JP2000114655A (ja) * | 1998-09-30 | 2000-04-21 | Toshiba Corp | サブマウントミラー方式面型レーザ |
JP2000149311A (ja) * | 1998-11-09 | 2000-05-30 | Toshiba Corp | 光半導体装置及び光ピックアップ装置 |
JP2001094191A (ja) * | 1999-09-27 | 2001-04-06 | Fujitsu Quantum Devices Ltd | 光半導体モジュール及びその製造方法 |
JP2001166187A (ja) * | 1999-09-30 | 2001-06-22 | Kyocera Corp | 光モジュール |
JP3692519B2 (ja) * | 1999-11-01 | 2005-09-07 | 日本電気株式会社 | 受光素子の光結合構造 |
JP2001160646A (ja) * | 1999-12-02 | 2001-06-12 | Fujitsu Quantum Devices Ltd | 光モジュール |
JP2001242357A (ja) * | 2000-02-28 | 2001-09-07 | Alps Electric Co Ltd | 光半導体装置 |
JP3489528B2 (ja) * | 2000-03-14 | 2004-01-19 | 三菱電機株式会社 | レーザダイオードモジュール |
JP2001281503A (ja) * | 2000-03-30 | 2001-10-10 | Seiko Epson Corp | 光モジュールおよびその製造方法 |
JP3721935B2 (ja) * | 2000-04-19 | 2005-11-30 | 住友電気工業株式会社 | 光学装置 |
JP2001308443A (ja) * | 2000-04-26 | 2001-11-02 | Hitachi Ltd | サブマウント |
JP2001343559A (ja) * | 2000-05-30 | 2001-12-14 | Kyocera Corp | 光モジュール |
DE10064959C2 (de) * | 2000-12-20 | 2003-01-02 | Infineon Technologies Ag | Koppelvorrichtung zum Anschluß eines Lichtwellenleiters an eine optische Sende- oder Empfangseinheit |
JP2002100827A (ja) * | 2001-09-19 | 2002-04-05 | Sharp Corp | 半導体レーザ装置 |
JP2003198032A (ja) * | 2001-12-27 | 2003-07-11 | Mitsubishi Electric Corp | 光素子、光素子モジュール及び光素子用キャリア |
-
2002
- 2002-04-08 JP JP2002105148A patent/JP2003303975A/ja active Pending
- 2002-06-07 DE DE60222736T patent/DE60222736T2/de not_active Expired - Lifetime
- 2002-06-07 EP EP02012737A patent/EP1353421B1/de not_active Expired - Lifetime
- 2002-06-07 US US10/165,701 patent/US6813102B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1353421A2 (de) | 2003-10-15 |
US20030189770A1 (en) | 2003-10-09 |
JP2003303975A (ja) | 2003-10-24 |
US6813102B2 (en) | 2004-11-02 |
EP1353421A3 (de) | 2004-06-30 |
DE60222736T2 (de) | 2008-07-17 |
EP1353421B1 (de) | 2007-10-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE10296494D2 (de) | Optoelektronische Baugruppe mit Peltierkühlung | |
DE602005010006D1 (de) | Optisches Modul | |
NO20011464L (no) | Optisk modul | |
DE60330891D1 (de) | Netzwerkverbindung- detektierendes modul | |
DE60124834D1 (de) | Licht emittierendes modul | |
DK1650174T3 (da) | Optisk fiber | |
NO20021257D0 (no) | Fiberoptisk sensorpakke | |
DK1426795T3 (da) | Optisk fiber med mikrostruktur og optisk modul | |
DE60318905D1 (de) | Optisches Element | |
DE60239934D1 (de) | Optisches Übertragungsmodul mit Kühlkörper | |
DE60121416D1 (de) | Diodenlasermodul | |
DE60212562D1 (de) | Faseroptisches Array | |
DE60313777D1 (de) | Optisches halbleiterbauelement | |
DE60216842D1 (de) | Optisches Halbleitermodul | |
AU2003236881A8 (en) | Monolithically integrated high power laser optical device | |
EP1505416A4 (de) | Optisches wellenleitermodul | |
DE60222736D1 (de) | Optisches Modul mit Monitor-Photodiode | |
DE60307763D1 (de) | Integrierter optischer Wellenleiter | |
DE10393477D2 (de) | Hohlfaser-Modul | |
DE50311591D1 (de) | Optischer sensor | |
DE60309868D1 (de) | Faserlasereinheit | |
GB0313757D0 (en) | Optical semiconductor module | |
DE60336077D1 (de) | Optischer sensor | |
DE60138359D1 (de) | Optisches Modul | |
DE602004013682D1 (de) | Oberflächenlichtemittierendes Bauelement, optisches Modul, Lichtübertragungsvorrichtung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |